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TUSB7320IRKMR

Texas Instruments

TUSB7320IRKMR by Texas Instruments

TUSB7320IRKMR by Texas Instruments is a BUS CONTROLLER IC with 100 terminals, operating at -40 to 85°C. It supports PCI and I2C buses, has a data transfer rate of 625 MBps, and operates at a max clock frequency of 50 MHz. Ideal for industrial applications requiring high-speed USB connectivity in compact designs.

Median Price

$10.019

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,650 parts In-Stock

1+ parts

$10.019

100+ parts

$7.368

1k+ parts

$6.047

10k+ parts

-

2,650

$10.019

$7.368

$6.047

-

Chip1Stop

Japan . 2,650 parts In-Stock

1+ parts

$10.321

100+ parts

$7.094

1k+ parts

$6.047

10k+ parts

-

2,650

$10.321

$7.094

$6.047

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Verical

USA . 2,650 parts In-Stock

1+ parts

-

100+ parts

$7.536

1k+ parts

$6.047

10k+ parts

-

2,650

-

$7.536

$6.047

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.810

100+ parts

-

1k+ parts

-

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100

$6.810

-

-

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Digiode

USA . 4,414 parts In-Stock

1+ parts

$9.518

100+ parts

-

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4,414

$9.518

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Chip Stock

USA . 6,750 parts In-Stock

1+ parts

-

100+ parts

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6,750

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Vyrian

USA . 4,841 parts In-Stock

1+ parts

-

100+ parts

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4,841

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

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3,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,391 parts In-Stock

1+ parts

$6.410

100+ parts

-

1k+ parts

-

10k+ parts

-

2,391

$6.410

-

-

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Semicontronic

India . 2,343 parts In-Stock

1+ parts

$6.410

100+ parts

$6.250

1k+ parts

$6.218

10k+ parts

-

2,343

$6.410

$6.250

$6.218

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Continental Prestige Electronics

USA . 4,694 parts In-Stock

1+ parts

$6.810

100+ parts

-

1k+ parts

-

10k+ parts

$6.674

4,694

$6.810

-

-

$6.674

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$6.810

100+ parts

$6.470

1k+ parts

-

10k+ parts

$6.061

200

$6.810

$6.470

-

$6.061

AZTECH Wire

Italy . 1,179 parts In-Stock

1+ parts

$8.130

100+ parts

-

1k+ parts

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10k+ parts

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1,179

$8.130

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Corphita

USA . 1,769 parts In-Stock

1+ parts

$9.017

100+ parts

-

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10k+ parts

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1,769

$9.017

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Corohmni

South Africa . 1,164 parts In-Stock

1+ parts

$24.815

100+ parts

-

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1,164

$24.815

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Parana Technologies

USA . 2,302 parts In-Stock

1+ parts

$36.416

100+ parts

-

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2,302

$36.416

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DigiPath Technology Company

USA . 1,812 parts In-Stock

1+ parts

$40.099

100+ parts

$36.891

1k+ parts

-

10k+ parts

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1,812

$40.099

$36.891

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ChromeModa Solutions

Germany . 3,432 parts In-Stock

1+ parts

$40.917

100+ parts

$33.552

1k+ parts

-

10k+ parts

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3,432

$40.917

$33.552

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$40.917

100+ parts

$38.871

1k+ parts

$36.825

10k+ parts

-

2,267

$40.917

$38.871

$36.825

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Lixinc

USA . 8,552 parts In-Stock

1+ parts

-

100+ parts

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8,552

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A-Z Elektronik GmbH

Germany . 6,461 parts In-Stock

1+ parts

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6,461

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,472 parts In-Stock

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2,472

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Overview

Elevate your connectivity with the TUSB7320IRKMR by Texas Instruments, a cutting-edge bus controller that offers unparalleled performance and reliability. Crafted with precision using high-quality materials, this chip carrier package ensures seamless integration into various applications. With a maximum data transfer rate of 625 MBps and compatibility with PCI and I2C buses, this versatile USB controller is a game-changer in the industry. Experience faster speeds, improved efficiency, and superior quality with the TUSB7320IRKMR - because your success deserves nothing less.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.21 V

The high maximum supply voltage ensures stable and reliable operation of the bus controller in different power supply conditions.

Package Shape: SQUARE

The square package shape provides a compact form factor, allowing for efficient use of space on the PCB.

Power Supplies (V): 1.1,3.3

The availability of multiple power supply options (1.1V and 3.3V) allows for compatibility with a wide range of systems and devices.

No. of Terminals: 100

The high number of terminals provides ample connectivity options for integrating the bus controller with other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style facilitates easy integration and efficient thermal performance, making it suitable for demanding industrial applications.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage ensures compatibility with a variety of power sources and helps in extending the product's operational range.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the bus controller to function reliably in harsh environmental conditions without overheating.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate ensures fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the bus controller to operate in extreme cold environments, providing versatility in usage.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and conductivity, ensuring long-lasting performance and reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and enhances signal integrity, improving overall system efficiency.

Maximum Seated Height: 0.8 mm

The low maximum seated height minimizes the overall profile of the bus controller, allowing for compact system designs.

Width: 9 mm

The 9mm width provides a balance between compactness and ease of handling during installation and maintenance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast data processing and communication, ensuring efficient operation in high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures proper soldering of the bus controller during assembly, preventing damage due to overheating.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables reliable soldering of the bus controller on the PCB, ensuring strong mechanical bond and electrical connections.

Length: 9 mm

The 9mm length complements the width and height dimensions, providing a compact and well-balanced form factor for easy integration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in challenging environmental conditions, making the bus controller suitable for a wide range of industrial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The bus controller that supports Universal Serial Bus technology offers versatile connectivity options, making it compatible with a wide range of USB-enabled devices.

Technology: CMOS

The CMOS technology used in the bus controller provides low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall performance.

Terminal Form: BUTT

The butt terminal form ensures secure and reliable connections, reducing the risk of signal loss or interference during data transmission.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V ensures stable and efficient operation of the bus controller, meeting the power requirements of modern electronic systems.

Bus Compatibility: PCI; I2C

The bus controller's compatibility with PCI and I2C interfaces allows for seamless integration with a variety of devices and systems, enhancing connectivity and interoperability.

Terminal Pitch: 0.6 mm

The small terminal pitch of 0.6mm enables high-density mounting and close arrangement of terminals on the PCB, optimizing space utilization and signal transmission.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the bus controller has a moderate sensitivity to moisture during storage and handling, requiring standard precautions for moisture protection.

Technical Specifications

Bus Controllers TUSB7320IRKMR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bus Compatibility:

PCI; I2C

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBCC-B100

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Equivalence Code:

SLGA100,15X15,24

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.21 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB7320IRKMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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