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TUSB9261IPVP

Texas Instruments

TUSB9261IPVP by Texas Instruments

TUSB9261IPVP by Texas Instruments is a BUS CONTROLLER with 64 terminals, operating at -40 to 85 °C. It supports ATA and ATAPI bus compatibility, with a max data transfer rate of 375 MBps. Ideal for industrial applications requiring USB peripheral ICs.

Median Price

$7.660

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,802 parts In-Stock

1+ parts

$5.849

100+ parts

$4.769

1k+ parts

$3.179

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10,802

$5.849

$4.769

$3.179

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Mouser Electronics

USA . 1,784 parts In-Stock

1+ parts

$9.470

100+ parts

$6.270

1k+ parts

$5.530

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1,784

$9.470

$6.270

$5.530

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DigiKey

USA . 1,145 parts In-Stock

1+ parts

$9.470

100+ parts

$6.267

1k+ parts

$5.689

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1,145

$9.470

$6.267

$5.689

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Arrow

USA . 250 parts In-Stock

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$4.034

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250

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$4.034

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.768

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500

$4.768

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Digiode

USA . 2,654 parts In-Stock

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$5.557

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2,654

$5.557

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Maritex

Poland . 7 parts In-Stock

1+ parts

$7.041

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$4.396

1k+ parts

$3.567

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7

$7.041

$4.396

$3.567

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Vyrian

USA . 2,720 parts In-Stock

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Cyclops Electronics Ltd

UK . 451 parts In-Stock

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ComSIT Distribution GmbH

Germany . 71 parts In-Stock

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ComSIT USA

USA . 71 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,942 parts In-Stock

1+ parts

$3.430

100+ parts

$3.344

1k+ parts

$3.327

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2,942

$3.430

$3.344

$3.327

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Ampacity Inc.

Singapore . 2,919 parts In-Stock

1+ parts

$3.430

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2,919

$3.430

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.768

100+ parts

-

1k+ parts

$4.530

10k+ parts

$4.435

2,000

$4.768

-

$4.530

$4.435

Continental Prestige Electronics

USA . 1,166 parts In-Stock

1+ parts

$4.768

100+ parts

-

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$4.673

1,166

$4.768

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-

$4.673

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$4.864

100+ parts

$4.864

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$4.864

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2,000

$4.864

$4.864

$4.864

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Corphita

USA . 2,727 parts In-Stock

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$5.264

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$5.264

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Modulus Dynamics

Lithuania . 89 parts In-Stock

1+ parts

$5.293

100+ parts

$5.240

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$5.081

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89

$5.293

$5.240

$5.081

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Corohmni

South Africa . 5,182 parts In-Stock

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$5.352

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$5.352

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Microchip USA

USA . 3,253 parts In-Stock

1+ parts

$21.812

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$21.812

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Parana Technologies

USA . 1,048 parts In-Stock

1+ parts

$58.113

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$58.113

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ChromeModa Solutions

Germany . 2,208 parts In-Stock

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$65.296

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$53.543

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$53.543

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$65.296

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$62.031

1k+ parts

$58.766

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$62.031

$58.766

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A-Z Elektronik GmbH

Germany . 7,408 parts In-Stock

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Lixinc

USA . 7,038 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,752 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Assy Fe

Spain . 1,137 parts In-Stock

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

1+ parts

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$83.279

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$83.279

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$83.279

200

-

$83.279

$83.279

$83.279

DigiPath Technology Company

USA . 50 parts In-Stock

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$58.871

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$58.871

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Formix International (Excess)

India . 1 parts In-Stock

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Overview

Elevate your electronic designs with the TUSB9261IPVP by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. As a leading player in the Bus Controllers category, this versatile component offers unmatched value and benefits to customers. From its robust construction to its reliable performance, this universal serial bus controller is ideal for a wide range of applications. Upgrade your projects today with the TUSB9261IPVP and experience the superior quality and efficiency that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus controller.

Maximum Supply Voltage: 1.155 V

The maximum supply voltage ensures stable and efficient performance of the bus controller within safe limits.

Maximum Data Transfer Rate: 375 MBps

High data transfer rate allows for quick and efficient communication between devices connected to the bus controller.

Technology: CMOS

The CMOS technology used in the bus controller offers low power consumption and high noise immunity for reliable operation.

Bus Compatibility: ATA; ATAPI

Support for ATA and ATAPI bus standards ensures compatibility with a wide range of devices, making it a versatile choice.

Technical Specifications

Bus Controllers TUSB9261IPVP attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

ATA; ATAPI

Maximum Clock Frequency:

40 MHz

Maximum Data Transfer Rate:

375 MBps

Drive Interface Standard:

IEEE 1149.6; IEEE 1149.1

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.35SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

.005 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TUSB9261IPVP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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