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SC18IS600IBS,151

NXP Semiconductors

SC18IS600IBS,151 by NXP Semiconductors

NXP Semiconductors SC18IS600IBS,151 is a bus controller IC with 24 terminals in a square chip carrier package. It operates at -40 to 85 °C with max supply voltage of 3.6 V and clock frequency of 18 MHz. Ideal for industrial applications requiring I2C communication at up to 16 mA supply current.

Median Price

$1.022

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$1.022

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Vyrian

USA . 7,491 parts In-Stock

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Anansix

USA . 2,430 parts In-Stock

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Digiode

USA . 2,411 parts In-Stock

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2,411

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Distributors (Availability)

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.002

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$0.961

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500

$1.002

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$0.961

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Argo Parts USA

USA . 1,219 parts In-Stock

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$1.022

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Continental Prestige Electronics

USA . 95 parts In-Stock

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$1.022

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$1.002

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$1.002

One Stop Electronics

USA . 481 parts In-Stock

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$3.000

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481

$3.000

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AZTECH Wire

Italy . 778 parts In-Stock

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$7.128

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Microchip USA

USA . 425 parts In-Stock

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$13.965

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Semicontronic

India . 1,136 parts In-Stock

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$24.000

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$23.400

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$23.280

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Corohmni

South Africa . 5,058 parts In-Stock

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$41.994

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Perfect Parts

USA . 1,550 parts In-Stock

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UNI Independent Distributors

Spain . 1,137 parts In-Stock

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Corphita

USA . 598 parts In-Stock

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Overview

Unlock seamless communication with the SC18IS600IBS,151 by NXP Semiconductors - a top-tier manufacturer known for cutting-edge technology. This bus controller offers unmatched reliability and functionality in various applications. Experience the value of effortless data transfer, enhanced connectivity, and increased efficiency. Elevate your projects with the SC18IS600IBS,151 and stay ahead of the curve with its superior performance and unparalleled benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and lightweight design.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs.

Maximum Supply Voltage: 3.6 V

Operates efficiently with a maximum supply voltage of 3.6V.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board.

Power Supplies (V): 2.4/3.6

Can be powered by either 2.4V or 3.6V for flexibility in voltage requirements.

No. of Terminals: 24

Provides ample connection options for various external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple package styles for different application needs.

Minimum Supply Voltage: 2.4 V

Can operate at a low minimum supply voltage of 2.4V.

Maximum Operating Temperature: 85 °C

Operates efficiently at high temperatures, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for secure connections with other components.

Maximum Seated Height: 1 mm

Has a low seated height, ideal for compact designs.

Width: 4 mm

Compact width allows for space-saving on the PCB.

Maximum Clock Frequency: 18 MHz

Supports high clock frequencies for efficient data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Offers a sufficient time for reflow soldering during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes.

Length: 4 mm

Compact length for efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environments.

Peripheral IC Type: BUS CONTROLLER, I2C

Specifically designed as a bus controller with I2C compatibility for seamless data communication.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and provides reliable connections.

Maximum Supply Current: 16 mA

Operates efficiently with a maximum supply current of 16mA.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on the PCB.

Technical Specifications

Bus Controllers SC18IS600IBS,151 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

0

Maximum Clock Frequency:

18 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.4/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

SC18IS600IBS,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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