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SC18IS600IPW

NXP Semiconductors

SC18IS600IPW by NXP Semiconductors

SC18IS600IPW by NXP Semiconductors is a bus controller IC with 16 terminals, operating voltage of 2.4-3.6V, clock frequency up to 18MHz. It is used in industrial applications for I2C communication, featuring a small outline package and dual terminal position.

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Vyrian

USA . 8,605 parts In-Stock

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Digiode

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Nova Conductors

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Anansix

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Zilex Electronics Inc.

Canada . 19 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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One Stop Electronics

USA . 1,466 parts In-Stock

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AZTECH Wire

Italy . 431 parts In-Stock

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Semicontronic

India . 1,063 parts In-Stock

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Ampacity Inc.

Singapore . 368 parts In-Stock

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Corohmni

South Africa . 64 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

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Perfect Parts

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Lixinc

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Argo Parts USA

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Futuretech Components

Singapore . 1,121 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 76 parts In-Stock

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Kepictronics

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Overview

Unlock seamless communication and enhanced connectivity with the SC18IS600IPW from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability in their bus controllers. This versatile device is perfect for a wide range of applications, offering customers unmatched value and benefits. Say goodbye to connectivity issues and hello to superior performance with the SC18IS600IPW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the bus controller, making it suitable for various applications.

Surface Mount: YES

Easy to mount on PCBs, simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Has a standard shape that fits well within electronic devices and ensures easy integration.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption and high noise immunity.

Maximum Clock Frequency: 18 MHz

Capable of handling high clock frequencies for efficient data processing.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, offering stability in harsh environments.

Technical Specifications

Bus Controllers SC18IS600IPW attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

0

Maximum Clock Frequency:

18 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.4/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SC18IS600IPW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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