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SC18IS600IBS,157

NXP Semiconductors

SC18IS600IBS,157 by NXP Semiconductors

NXP Semiconductors' SC18IS600IBS,157 is a bus controller IC with 24 terminals and operates at 2.4-3.6V. It features a max clock frequency of 18MHz, suitable for industrial applications requiring I2C communication. The chip carrier package has a compact size of 4x4mm and can withstand temperatures from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,558 parts In-Stock

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Vyrian

USA . 2,969 parts In-Stock

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Anansix

USA . 2,611 parts In-Stock

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Nova Conductors

Japan . 93 parts In-Stock

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One Stop Electronics

USA . 502 parts In-Stock

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$4.000

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502

$4.000

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Semicontronic

India . 729 parts In-Stock

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$5.000

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$4.875

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$4.850

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729

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$4.850

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Microchip USA

USA . 344 parts In-Stock

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$10.317

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344

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AZTECH Wire

Italy . 642 parts In-Stock

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$13.735

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642

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Ampacity Inc.

Singapore . 304 parts In-Stock

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$22.000

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Corohmni

South Africa . 823 parts In-Stock

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$52.570

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UNI Independent Distributors

Spain . 5,223 parts In-Stock

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Bastille Electronics

Australia . 1,667 parts In-Stock

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Continental Prestige Electronics

USA . 1,365 parts In-Stock

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Argo Parts USA

USA . 1,031 parts In-Stock

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Corphita

USA . 825 parts In-Stock

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Overview

Unlock seamless communication and maximize efficiency with the SC18IS600IBS,157 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality bus controllers that are ideal for a wide range of applications. This versatile chip carrier boasts a compact square package style and operates at industrial-grade temperatures, ensuring reliability in any environment. With a maximum clock frequency of 18 MHz and low power consumption, this I2C peripheral IC offers unparalleled value and performance for your next project. Experience the benefits of streamlined data transfer and enhanced connectivity with the SC18IS600IBS,157.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product resistant to damage and easy to handle.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for more flexibility in power options and compatibility with various systems.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is suitable for use in extreme cold environments without performance issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the bus controller.

Technical Specifications

Bus Controllers SC18IS600IBS,157 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

0

Maximum Clock Frequency:

18 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.4/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

SC18IS600IBS,157 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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