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CY7C65642-28LTXC

Infineon Technologies

CY7C65642-28LTXC by Infineon Technologies

CY7C65642-28LTXC by Infineon: 3.6V max supply, 12MHz clock freq, I2C bus compatibility. Ideal for commercial applications requiring a BUS CONTROLLER with 105.4mA max supply current and operating temp range of 0-70°C.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,624 parts In-Stock

1+ parts

$2.680

100+ parts

$1.640

1k+ parts

$1.430

10k+ parts

$1.370

3,624

$2.680

$1.640

$1.430

$1.370

DigiKey

USA . 2,582 parts In-Stock

1+ parts

$2.680

100+ parts

$1.637

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$1.450

10k+ parts

$1.371

2,582

$2.680

$1.637

$1.450

$1.371

Newark

USA . 7,242 parts In-Stock

1+ parts

$2.760

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$1.680

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$1.500

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7,242

$2.760

$1.680

$1.500

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Farnell

UK . 5,530 parts In-Stock

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$3.100

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$1.590

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$1.150

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$3.100

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$1.150

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Element14

Singapore . 5,207 parts In-Stock

1+ parts

$3.880

100+ parts

$2.360

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$2.110

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5,207

$3.880

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$2.110

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Chip1Stop

Japan . 300 parts In-Stock

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$3.970

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$3.970

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Verical

USA . 1,372 parts In-Stock

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$1.488

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$1.483

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$1.488

$1.483

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Rochester

USA . 1,272 parts In-Stock

1+ parts

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$1.270

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$1.140

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$1.070

1,272

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$1.140

$1.070

RS (Exports)

UK . 488 parts In-Stock

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488

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Distributors (In-Stock)

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Digiode

USA . 700 parts In-Stock

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$0.646

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$0.646

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Nova Conductors

Japan . 66 parts In-Stock

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$3.799

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$3.799

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Chip Stock

USA . 18,000 parts In-Stock

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Vyrian

USA . 4,009 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,885 parts In-Stock

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Sunrise Surplus Inc.

USA . 100 parts In-Stock

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Speed Components Ltd

Israel . 9 parts In-Stock

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Resion

USA . 6 parts In-Stock

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Corphita

USA . 52 parts In-Stock

1+ parts

$0.612

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52

$0.612

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Semicontronic

India . 3,474 parts In-Stock

1+ parts

$1.100

100+ parts

$1.072

1k+ parts

$1.067

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3,474

$1.100

$1.072

$1.067

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Ampacity Inc.

Singapore . 3,081 parts In-Stock

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$1.100

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Component Stockers USA

USA . 16,355 parts In-Stock

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$3.110

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$3.200

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$2.450

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16,355

$3.110

$3.200

$2.450

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Argo Parts USA

USA . 2,499 parts In-Stock

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$3.799

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$3.799

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Continental Prestige Electronics

USA . 9,293 parts In-Stock

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$5.390

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$3.420

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$5.390

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Corohmni

South Africa . 626 parts In-Stock

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$50.237

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$53.173

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$48.387

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$43.602

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$53.173

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$43.602

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Aztec Data Supply Inc.

USA . 302 parts In-Stock

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$63.039

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Modulus Dynamics

Lithuania . 900 parts In-Stock

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$85.287

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$81.876

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$78.464

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$85.287

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GreenTree Electronics

Israel . 18,908 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 6,416 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 2,850 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,655 parts In-Stock

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Perfect Parts

USA . 2,410 parts In-Stock

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Glotronic Ltd.

UK . 912 parts In-Stock

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Metaverse IC Inc.

Canada . 910 parts In-Stock

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iodParts Technologies Inc.

India . 221 parts In-Stock

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$2.761

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S.R.D Solutions

India . 120 parts In-Stock

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Futuretech Components

Singapore . 107 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$3.723

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$3.609

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$3.533

100

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$3.723

$3.609

$3.533

Formix International (Excess)

India . 2 parts In-Stock

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Overview

Elevate your bus control system with the CY7C65642-28LTXC by Infineon Technologies, a top-tier manufacturer known for its superior quality and innovative technology. This versatile chip carrier, with a very thin profile and quad terminal position, offers seamless integration and reliable performance in a variety of applications. With a wide supply voltage range and high clock frequency, this bus controller ensures optimal functionality and efficiency. Experience the benefits of advanced CMOS technology and unmatched reliability with the CY7C65642-28LTXC – your ultimate solution for all bus control needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and simple placement on the PCB.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) ensures flexibility in various system configurations.

No. of Terminals: 28

With 28 terminals, this bus controller offers ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package style options provide versatility in installation and thermal management, catering to different application requirements.

Minimum Supply Voltage: 3.15 V

The ability to operate at a minimum supply voltage of 3.15V ensures stable performance even under low power conditions.

Maximum Operating Temperature: 70 °C

Support for a maximum operating temperature of 70°C ensures reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this bus controller can function effectively in cold environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent corrosion resistance and solderability, enhancing the longevity and reliability of the product.

Terminal Position: QUAD

Quad terminal position offers increased stability and durability during installation and operation.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this bus controller is suitable for applications with space constraints.

Width: 5 mm

Compact width of 5mm allows for easy integration into various system designs.

Maximum Clock Frequency: 12 MHz

Support for a maximum clock frequency of 12MHz enables efficient data transfer and processing.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure and robust solder joints for long-term functionality.

Length: 5 mm

Compact length of 5mm allows for efficient use of board space and easy placement on the PCB.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating conditions in commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a universal serial bus controller, this product offers versatile connectivity options for various USB devices and peripherals.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the bus controller energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form ensures compliance with environmental regulations and enhances the product's sustainability.

Maximum Supply Current: 105.4 mA

With a maximum supply current of 105.4mA, this bus controller operates efficiently within specified power limits.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent performance in typical operating conditions.

Bus Compatibility: I2C

Compatibility with the I2C bus protocol allows for seamless communication with other I2C-enabled devices, enhancing system integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent damage.

Technical Specifications

Bus Controllers CY7C65642-28LTXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

105.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CY7C65642-28LTXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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