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CYUSB3064-BZXC

Infineon Technologies

CYUSB3064-BZXC by Infineon Technologies

CYUSB3064-BZXC by Infineon is a bus controller with 121 terminals, operating at 40 MHz clock frequency and supporting data transfer rates up to 625 MBps. It is ideal for applications requiring USB peripheral ICs, compatible with I2C, I2S, SPI, and UART buses. The package style is a low-profile grid array with a square shape and measures 10mm in width and length.

Median Price

$16.570

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 50 parts In-Stock

1+ parts

$16.230

100+ parts

$10.760

1k+ parts

-

10k+ parts

-

50

$16.230

$10.760

-

-

Arrow

USA . 800 parts In-Stock

1+ parts

$16.570

100+ parts

$14.440

1k+ parts

$14.040

10k+ parts

-

800

$16.570

$14.440

$14.040

-

Chip1Stop

Japan . 428 parts In-Stock

1+ parts

$24.800

100+ parts

$17.800

1k+ parts

-

10k+ parts

$16.200

428

$24.800

$17.800

-

$16.200

Newark

USA . 50 parts In-Stock

1+ parts

$26.430

100+ parts

$18.560

1k+ parts

$17.870

10k+ parts

-

50

$26.430

$18.560

$17.870

-

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$28.650

100+ parts

$19.890

1k+ parts

$19.140

10k+ parts

-

9

$28.650

$19.890

$19.140

-

Element14

Singapore . 50 parts In-Stock

1+ parts

$30.110

100+ parts

$24.740

1k+ parts

-

10k+ parts

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50

$30.110

$24.740

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-

Flip Electronics (Authorized)

USA . 10,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,560

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Verical

USA . 9,345 parts In-Stock

1+ parts

-

100+ parts

$10.458

1k+ parts

-

10k+ parts

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9,345

-

$10.458

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DigiKey

USA . 9,345 parts In-Stock

1+ parts

-

100+ parts

$9.050

1k+ parts

-

10k+ parts

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9,345

-

$9.050

-

-

Rochester

USA . 3,229 parts In-Stock

1+ parts

-

100+ parts

$15.000

1k+ parts

$13.420

10k+ parts

$12.630

3,229

-

$15.000

$13.420

$12.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 700 parts In-Stock

1+ parts

$15.742

100+ parts

-

1k+ parts

-

10k+ parts

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700

$15.742

-

-

-

Flip Electronics

USA . 10,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,145

-

-

-

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Vyrian

USA . 3,046 parts In-Stock

1+ parts

-

100+ parts

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3,046

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-

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Chip Stock

USA . 2,913 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,913

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

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10

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Halfin

Belgium . 7 parts In-Stock

1+ parts

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,424 parts In-Stock

1+ parts

$9.520

100+ parts

-

1k+ parts

-

10k+ parts

-

3,424

$9.520

-

-

-

Corphita

USA . 408 parts In-Stock

1+ parts

$14.913

100+ parts

-

1k+ parts

-

10k+ parts

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408

$14.913

-

-

-

Aztec Data Supply Inc.

USA . 1,056 parts In-Stock

1+ parts

$33.667

100+ parts

-

1k+ parts

-

10k+ parts

-

1,056

$33.667

-

-

-

Microchip USA

USA . 3,718 parts In-Stock

1+ parts

$54.855

100+ parts

-

1k+ parts

-

10k+ parts

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3,718

$54.855

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Modulus Dynamics

Lithuania . 3,283 parts In-Stock

1+ parts

$57.147

100+ parts

$54.861

1k+ parts

$52.575

10k+ parts

-

3,283

$57.147

$54.861

$52.575

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Corohmni

South Africa . 5,225 parts In-Stock

1+ parts

$62.311

100+ parts

-

1k+ parts

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10k+ parts

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5,225

$62.311

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Perfect Parts

USA . 10,266 parts In-Stock

1+ parts

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10,266

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Argo Parts USA

USA . 2,661 parts In-Stock

1+ parts

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2,661

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

-

-

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Continental Prestige Electronics

USA . 1,082 parts In-Stock

1+ parts

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1,082

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A-Z Elektronik GmbH

Germany . 255 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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255

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Overview

Discover the CYUSB3064-BZXC by Infineon Technologies, a versatile bus controller that offers high-quality performance and reliability. With its innovative technology and universal serial bus compatibility, this product is ideal for a wide range of applications. Infineon Technologies, known for its cutting-edge solutions, ensures that this bus controller delivers seamless data transfer rates of up to 625 MBps. Experience the value and benefits of the CYUSB3064-BZXC in meeting your connectivity needs with ease and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 1.25 V

With a high maximum supply voltage, the product can handle various power sources.

Package Shape: SQUARE

The square shape of the package allows for efficient PCB layout and space utilization.

No. of Terminals: 121

The high number of terminals provides versatility and compatibility with a wide range of devices.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high performance in a compact design.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures efficient power usage and compatibility.

Maximum Operating Temperature: 70 °C

This high operating temperature range ensures reliable performance in various environments.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate allows for fast and efficient communication.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of these materials for terminal finish ensures good conductivity and durability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and efficient PCB assembly.

Maximum Seated Height: 1.7 mm

The low seated height allows for compact and slim device designs.

Width: 10 mm

The small width of the product enables it to fit into tight spaces.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for fast and efficient data processing.

Length: 10 mm

The short length of the product is suitable for compact device designs.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

This product is versatile and can be used with various bus types.

Technology: CMOS

The CMOS technology offers low power consumption and high performance.

Terminal Form: BALL

The ball terminal form provides good contact reliability and easy installation.

Maximum Supply Current: 192 mA

The high supply current capability ensures stable operation under load.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures compatibility with standard power sources.

Bus Compatibility: I2C, I2S, SPI, UART

This product is compatible with a wide range of bus protocols, making it versatile.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures reliability in various environmental conditions.

Technical Specifications

Bus Controllers CYUSB3064-BZXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, I2S, SPI, UART

Maximum Clock Frequency:

40 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Current:

192 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

CYUSB3064-BZXC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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