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FT260Q-R

FTDI

FT260Q-R by FTDI

FT260Q-R by FTDI is a bus controller with 28 terminals, operating voltage range of 2.97-3.63 V, and data transfer rate of 0.064 MBps. Ideal for I2C, UART, and USB applications due to its compact square shape (5x5 mm), industrial temperature grade (-40 to 85 °C), and compatibility with various bus types.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,500 parts In-Stock

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$1.690

2,500

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$1.690

Distributors (In-Stock)

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Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$1.650

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63

$1.650

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Chip Stock

USA . 16,220 parts In-Stock

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Vyrian

USA . 2,444 parts In-Stock

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2,444

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ComSIT Distribution GmbH

Germany . 36 parts In-Stock

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36

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,485 parts In-Stock

1+ parts

$1.650

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3,485

$1.650

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.650

100+ parts

$1.617

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$1.650

$1.617

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Continental Prestige Electronics

USA . 244 parts In-Stock

1+ parts

$1.650

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$1.617

244

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Microchip USA

USA . 3,873 parts In-Stock

1+ parts

$10.725

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3,873

$10.725

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Aztec Data Supply Inc.

USA . 1,166 parts In-Stock

1+ parts

$55.090

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1,166

$55.090

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Overview

Unlock endless possibilities with the FT260Q-R by FTDI. This cutting-edge bus controller boasts superior quality and reliability, backed by FTDI's renowned reputation in the industry. Perfect for a wide range of applications, this versatile device offers seamless data transfer rates and compatibility with I2C, UART, and USB buses. Experience the value and benefits of enhanced connectivity with the FT260Q-R - your gateway to innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation, saving space and reducing overall product size.

Maximum Supply Voltage: 3.63 V

Provides a high maximum supply voltage, making it compatible with a wide range of systems and applications.

Package Shape: SQUARE

Square package shape offers a compact and standardized form factor, enhancing compatibility with various circuit layouts.

No. of Terminals: 28

Having a high number of terminals allows for versatile connectivity options and interface capabilities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation and space-saving features for optimal performance.

Minimum Supply Voltage: 2.97 V

Low minimum supply voltage ensures compatibility with power-sensitive applications while maintaining stable operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions and applications.

Maximum Data Transfer Rate: 0.064 MBps

High data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: QUAD

Quad terminal position offers enhanced connectivity options and flexibility in circuit design and integration.

Maximum Seated Height: 0.8 mm

Low seated height makes the product suitable for compact and slim designs, contributing to space-saving and efficient layout.

Width: 5 mm

Compact width dimensions provide versatility in placement and integration within various electronic systems.

Length: 5 mm

Optimal length dimensions offer a balanced form factor for easy installation and compatibility with standard circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, enhancing product durability and longevity.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a bus controller for USB devices offers versatile connectivity options and compatibility with a wide range of peripherals and systems.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and compatibility with various digital systems, enhancing overall product performance.

Terminal Form: NO LEAD

No lead terminal form offers reliable connectivity and soldering options, ensuring long-term stability and durability of the product.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation, suitable for a variety of electronic applications.

Bus Compatibility: I2C; UART; USB

Support for multiple bus protocols enhances versatility and compatibility with various devices and systems, making it a flexible choice for different applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connectivity and integration within compact electronic systems, enhancing overall performance and reliability.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for indoor and controlled environments, ensuring product longevity and stability.

Technical Specifications

Bus Controllers FT260Q-R attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Additional Features:

IT ALSO OPERATES AT 5V NOM SUPPLY

Address Bus Width:

0

Bus Compatibility:

I2C; UART; USB

Maximum Data Transfer Rate:

.064 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

FT260Q-R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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