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XIO3130INMH

Texas Instruments

XIO3130INMH by Texas Instruments

XIO3130INMH by Texas Instruments is a PCI bus controller with 196 terminals, operating at 100 MHz clock frequency. It supports data transfer rates up to 250 MBps and has a low profile grid array package suitable for industrial applications. With a supply voltage range of 1.35V to 1.65V, it can operate in temperatures ranging from -40°C to 85°C.

Median Price

$16.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

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100

$16.000

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Vyrian

USA . 4,780 parts In-Stock

1+ parts

-

100+ parts

-

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4,780

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Digiode

USA . 1,123 parts In-Stock

1+ parts

-

100+ parts

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1,123

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$6.917

100+ parts

-

1k+ parts

-

10k+ parts

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298

$6.917

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-

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Ampacity Inc.

Singapore . 1,489 parts In-Stock

1+ parts

$7.000

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-

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1,489

$7.000

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Continental Prestige Electronics

USA . 3,019 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

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10k+ parts

$15.680

3,019

$16.000

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-

$15.680

One Stop Electronics

USA . 376 parts In-Stock

1+ parts

$22.000

100+ parts

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376

$22.000

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Microchip USA

USA . 1,477 parts In-Stock

1+ parts

$24.700

100+ parts

$24.340

1k+ parts

$24.170

10k+ parts

$23.990

1,477

$24.700

$24.340

$24.170

$23.990

Parana Technologies

USA . 262 parts In-Stock

1+ parts

$33.249

100+ parts

-

1k+ parts

$121.338

10k+ parts

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262

$33.249

-

$121.338

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ChromeModa Solutions

Germany . 6,827 parts In-Stock

1+ parts

$37.358

100+ parts

$30.634

1k+ parts

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6,827

$37.358

$30.634

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IDEA Electronic Components Group

UK . 1,892 parts In-Stock

1+ parts

$37.358

100+ parts

$35.490

1k+ parts

$33.622

10k+ parts

-

1,892

$37.358

$35.490

$33.622

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Corohmni

South Africa . 555 parts In-Stock

1+ parts

$59.085

100+ parts

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555

$59.085

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Corphita

USA . 1,605 parts In-Stock

1+ parts

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100+ parts

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1,605

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Argo Parts USA

USA . 1,306 parts In-Stock

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1,306

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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100+ parts

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1,000

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DigiPath Technology Company

USA . 412 parts In-Stock

1+ parts

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100+ parts

$33.682

1k+ parts

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10k+ parts

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412

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$33.682

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Overview

Experience seamless and efficient data transfer with the XIO3130INMH from Texas Instruments, a top-tier manufacturer known for its high-quality products. As a bus controller, this device offers unrivaled performance in various applications, ensuring smooth operation and reliability. With its advanced technology and industrial-grade design, customers can trust in the value and benefits that this product brings, making it an indispensable tool for their needs. Don't settle for less when you can have the best with the XIO3130INMH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and lightweight construction, making the product easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.65 V

Provides a safe operating range for the product, ensuring reliable performance without risk of damage from high voltages.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, optimizing layout and design.

No. of Terminals: 196

Large number of terminals allows for versatile connectivity options and compatibility with various systems and devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array design provides better signal integrity and power distribution, while low profile helps reduce overall height of the product for space-saving benefits.

Minimum Supply Voltage: 1.35 V

Allows for reliable operation even at lower voltages, increasing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures product durability and reliability in various environmental conditions.

Maximum Data Transfer Rate: 250 MBps

High data transfer rate enables fast and efficient communication within the system, reducing latency and improving overall performance.

Minimum Operating Temperature: -40 °C

Can operate efficiently in low-temperature environments without risk of malfunction or damage.

Terminal Finish: TIN SILVER COPPER

Provides good electrical conductivity and corrosion resistance, ensuring long-term reliability and performance of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections, enhancing overall stability and reliability of the product.

Maximum Seated Height: 1.5 mm

Low seated height helps reduce overall profile of the product, enabling compact and space-efficient design.

Width: 15 mm

Optimal width dimension for fitting into standard PCB layouts, maximizing compatibility and ease of integration.

Maximum Clock Frequency: 100 MHz

High clock frequency allows for fast processing and data transfer rates, improving system performance and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the product during assembly, leading to reliable connections and long-term durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature helps achieve strong and secure solder joints, ensuring stable operation of the product.

Length: 15 mm

Optimal length dimension for fitting into standard PCB layouts, maximizing compatibility and ease of integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures product reliability and performance in harsh operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed as a bus controller for PCI interface, providing seamless communication and connectivity within the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable performance.

Terminal Form: BALL

Ball terminal form allows for easy and reliable connections, enhancing overall stability and performance of the product.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent and reliable power delivery to the product, preventing voltage fluctuations and disruptions.

Bus Compatibility: PCI

Designed to be compatible with PCI bus architecture, ensuring seamless integration and communication with other PCI devices.

Terminal Pitch: 1 mm

Optimal terminal pitch for easy assembly and connections, facilitating efficient installation and maintenance of the product.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage during storage and assembly.

Technical Specifications

Bus Controllers XIO3130INMH attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

PCI

Maximum Clock Frequency:

100 MHz

Maximum Data Transfer Rate:

250 MBps

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XIO3130INMH Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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