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PEX8713-CA80BCG

Broadcom

PEX8713-CA80BCG by Broadcom

Broadcom's PEX8713-CA80BCG is a PCI bus controller with 324 terminals in a square grid array package. It features CMOS technology, I2C compatibility, and peak reflow temperature of 245°C. Ideal for applications requiring high-speed data transfer and control over peripheral devices.

Median Price

$116.225

Lifecycle Status

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DigiKey

USA . 637 parts In-Stock

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$103.630

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$88.925

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Mouser Electronics

USA . 117 parts In-Stock

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$128.820

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Digiode

USA . 470 parts In-Stock

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$98.430

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Vyrian

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Touchstone Systems

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Chip Stock

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Cyclops Electronics Ltd

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Nova Conductors

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Lantek

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Corohmni

South Africa . 2,435 parts In-Stock

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$44.852

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Decca Corp

Germany . 67 parts In-Stock

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$88.070

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$86.309

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$85.446

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Corphita

USA . 317 parts In-Stock

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Microchip USA

USA . 2,772 parts In-Stock

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$147.230

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$147.230

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Neutron USA

USA . 50 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Futuretech Components

Singapore . 937 parts In-Stock

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Perfect Parts

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RC Electronics

USA . 299 parts In-Stock

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$96.390

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$89.050

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Kepictronics

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Aranea Global

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Overview

Unlock seamless data transfer and enhance system performance with the PEX8713-CA80BCG by Broadcom. With a reputation for top-quality manufacturing, Broadcom delivers reliable bus controllers that cater to a wide range of applications. From PCI buses to I2C compatibility, this product offers unparalleled value and benefits to customers looking for efficient data management solutions. Upgrade your systems today and experience the advantages of Broadcom's innovative technology in every transaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

The square package shape ensures easy alignment and placement on the PCB, optimizing space utilization.

No. of Terminals: 324

The high number of terminals allows for extensive connectivity options, making the product versatile and compatible with various systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides uniform and consistent electrical connections, improving signal transmission and reliability.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish enhances conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure mounting on the PCB, reducing the risk of damage during assembly and operation.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance ensures the product can withstand robust manufacturing processes, increasing overall product longevity.

Peripheral IC Type: BUS CONTROLLER, PCI

The bus controller, PCI peripheral IC type allows for seamless integration and compatibility with various bus systems, enhancing overall system performance.

Technology: CMOS

The CMOS technology used in the product enhances power efficiency and performance, making it an ideal choice for energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, reducing the risk of signal loss or interruption during operation.

Bus Compatibility: I2C

I2C bus compatibility allows for easy integration with I2C communication protocols, enabling seamless data transfer and communication between devices.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the product's resilience to moisture, making it suitable for a wide range of environments and applications.

Technical Specifications

Bus Controllers PEX8713-CA80BCG attributes and parameters. Explore more Bus Controllers devices from Broadcom

Specs

Bus Compatibility:

I2C

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

324

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

PEX8713-CA80BCG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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