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PI7C9X2G608GPCNJEX

Diodes Incorporated

PI7C9X2G608GPCNJEX by Diodes Incorporated

Diodes Inc. PI7C9X2G608GPCNJEX is a bus controller IC with 196 terminals, operating at -40 to 85°C. It supports I2C and PCI buses, with a max data rate of 625 MBps and clock frequency of 100 MHz. Ideal for low-profile applications requiring high-speed data transfer in compact spaces.

Median Price

$13.701

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

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$13.701

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650

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Chip Stock

USA . 8,170 parts In-Stock

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Vyrian

USA . 423 parts In-Stock

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423

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Sensible Micro Corp

USA . 308 parts In-Stock

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308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,106 parts In-Stock

1+ parts

$13.701

100+ parts

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$13.427

6,106

$13.701

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$13.427

Semicontronic

India . 789 parts In-Stock

1+ parts

$17.110

100+ parts

$16.682

1k+ parts

$16.597

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789

$17.110

$16.682

$16.597

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Ampacity Inc.

Singapore . 695 parts In-Stock

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$17.110

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695

$17.110

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Corohmni

South Africa . 127 parts In-Stock

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$31.877

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127

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Microchip USA

USA . 2,475 parts In-Stock

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$34.440

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Aztec Data Supply Inc.

USA . 2,319 parts In-Stock

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$63.230

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Lixinc

USA . 10,691 parts In-Stock

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Argo Parts USA

USA . 2,374 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

1+ parts

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$13.427

1k+ parts

$13.016

10k+ parts

$12.742

50

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$13.427

$13.016

$12.742

Overview

Unlock seamless data transfer and superior performance with the PI7C9X2G608GPCNJEX by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality bus controllers that excel in a wide range of applications. With its advanced technology and reliable design, this product offers customers unparalleled value, efficiency, and reliability. Experience lightning-fast data transfer rates and effortless integration, making it the perfect solution for your next project. Trust Diodes Incorporated to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 1.1 V

Operates efficiently within a low supply voltage range.

Package Shape: SQUARE

Square shape helps in uniform distribution of components and efficient use of space.

No. of Terminals: 196

Large number of terminals provide connectivity options for various devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array and low profile design offer compactness and improved thermal performance.

Minimum Supply Voltage: 0.95 V

Works efficiently even at low supply voltages, ensuring energy efficiency.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures for reliable performance in various environments.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate enables quick communication between devices and peripherals.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperature conditions, suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections with other components.

Maximum Seated Height: 1.5 mm

Low seated height helps in space-saving and compact design of the product.

Width: 15 mm

Compact width size allows for easy integration into circuit board layouts.

Maximum Clock Frequency: 100 MHz

High clock frequency supports fast data processing and communication.

Length: 15 mm

Optimal length size for fitting into compact electronic devices.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed as a bus controller for PCI systems, ensuring compatibility and efficiency.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable performance.

Terminal Form: BALL

Ball terminal form allows for reliable and secure connections with other components.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage for consistent and efficient operation.

Bus Compatibility: I2C, PCI

Compatible with I2C and PCI bus standards for seamless integration with various devices and systems.

Terminal Pitch: 1 mm

Optimal terminal pitch for easy soldering and connection with other components on circuit boards.

Technical Specifications

Bus Controllers PI7C9X2G608GPCNJEX attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, PCI

Maximum Clock Frequency:

100 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B196

Length:

15 mm

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

PI7C9X2G608GPCNJEX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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