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PI7C9X2G1224GPBHSBE

Diodes Incorporated

PI7C9X2G1224GPBHSBE by Diodes Incorporated

Diodes Inc. PI7C9X2G1224GPBHSBE is a Bus Controller IC with 324 terminals, operating at -40 to 85°C. It supports I2C, PCI, SMBus buses with a clock frequency of 100MHz and data rate of 625MBps. This CMOS technology chip in grid array package is ideal for high-speed data transfer applications.

Median Price

$67.490

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 77 parts In-Stock

1+ parts

$67.490

100+ parts

$50.080

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$48.833

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77

$67.490

$50.080

$48.833

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$51.375

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100

$51.375

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Chip Stock

USA . 67,000 parts In-Stock

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67,000

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Vyrian

USA . 7,272 parts In-Stock

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NAC Semi

USA . 84 parts In-Stock

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$71.740

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84

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$71.740

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Distributors (Availability)

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AZTECH Wire

Italy . 204 parts In-Stock

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$7.144

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204

$7.144

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Aztec Data Supply Inc.

USA . 7,604 parts In-Stock

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$36.810

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7,604

$36.810

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Aranea Global

USA . 2,000 parts In-Stock

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$50.348

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$48.334

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2,000

$50.348

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$48.334

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Continental Prestige Electronics

USA . 1,616 parts In-Stock

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$51.375

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$50.348

1,616

$51.375

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$50.348

Ampacity Inc.

Singapore . 59 parts In-Stock

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$52.840

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59

$52.840

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Corohmni

South Africa . 130 parts In-Stock

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$72.916

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130

$72.916

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Microchip USA

USA . 1,735 parts In-Stock

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$129.973

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1,735

$129.973

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Lixinc

USA . 5,628 parts In-Stock

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Argo Parts USA

USA . 1,813 parts In-Stock

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Perfect Parts

USA . 28 parts In-Stock

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Overview

Elevate your system's performance with the PI7C9X2G1224GPBHSBE by Diodes Incorporated. As a trusted manufacturer in the industry, Diodes Incorporated delivers top-quality bus controllers that excel in various applications. This versatile product offers customers unmatched value and benefits, enhancing data transfer rates up to 625 MBps with a maximum clock frequency of 100 MHz. Seamlessly integrated into I2C, PCI, and SMBus systems, this bus controller is the perfect solution for maximizing efficiency and productivity. Choose Diodes Incorporated for reliable performance and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.1 V

Efficient power management and low voltage operation, making it suitable for various applications.

Package Shape: SQUARE

Compact design that saves space on the circuit board, especially valuable in tight layouts.

No. of Terminals: 324

Provides ample connectivity options for interfacing with multiple devices and peripherals.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without risk of malfunction, ensuring reliability.

Maximum Data Transfer Rate: 625 MBps

High-speed data transfer capability, enabling quick communication between devices for efficient performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low-temperature conditions, making it suitable for a wide range of environments.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed for bus control and PCI interfacing, providing compatibility with a range of devices.

Technology: CMOS

Low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Controllers PI7C9X2G1224GPBHSBE attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, PCI, SMBUS

Maximum Clock Frequency:

100 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B324

Length:

19 mm

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

1.9 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

PI7C9X2G1224GPBHSBE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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