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FT230XQ-T

FTDI

FT230XQ-T by FTDI

FT230XQ-T by FTDI is a bus controller with 16 terminals, operating voltage range of 2.97-5.5V, and data transfer rate up to 60MBps. Ideal for UART and USB bus compatibility applications, it features a compact square package style with a max clock frequency of 12.02MHz.

Median Price

$2.116

Lifecycle Status

Suppliers In-Stock

15

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1k+

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Verical

USA . 93 parts In-Stock

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$2.116

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$1.871

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$1.871

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Nova Conductors

Japan . 69 parts In-Stock

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$1.870

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$1.870

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Ozdisan Elektronik

Türkiye . 154 parts In-Stock

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$4.409

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Cyclops Electronics Ltd

UK . 12,968 parts In-Stock

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Chip Stock

USA . 9,598 parts In-Stock

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Vyrian

USA . 7,004 parts In-Stock

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ComSIT Distribution GmbH

Germany . 217 parts In-Stock

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ComSIT USA

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

USA . 188 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 170 parts In-Stock

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Atlantic Semiconductor

USA . 127 parts In-Stock

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PC Components Company LLC

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Prism Electronics

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Distributors (Availability)

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Argo Parts USA

USA . 4,825 parts In-Stock

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$1.870

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Continental Prestige Electronics

USA . 2,991 parts In-Stock

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$1.870

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$1.833

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$1.833

Netroflash

USA . 100 parts In-Stock

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$1.870

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100

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Allen Electronics Distributors

USA . 4,008 parts In-Stock

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$2.038

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$1.873

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$2.038

$1.873

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Modulus Dynamics

Lithuania . 59 parts In-Stock

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$2.076

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$2.055

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$1.993

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59

$2.076

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Corohmni

South Africa . 431 parts In-Stock

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$2.104

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Microchip USA

USA . 3,612 parts In-Stock

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$14.690

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Neutron USA

USA . 50 parts In-Stock

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$27.210

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Aztec Data Supply Inc.

USA . 70 parts In-Stock

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$49.820

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Advanced Electronics

New Zealand . 78 parts In-Stock

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$69.337

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$65.870

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$65.870

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Lucentia Tech

USA . 6,000 parts In-Stock

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$15.914

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$15.914

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Perfect Parts

USA . 4,948 parts In-Stock

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Overview

Enhance your project with the high-quality FT230XQ-T from FTDI, a leading manufacturer in bus controllers. This versatile product offers seamless integration and reliable performance, making it ideal for a wide range of applications. With its surface mount design and impressive data transfer rate, the FT230XQ-T provides exceptional value and benefits to customers seeking efficient solutions for their projects. Upgrade your system today with this innovative technology from FTDI.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and potentially reducing costs.

Maximum Supply Voltage: 5.5 V

Having a maximum supply voltage of 5.5 V provides flexibility in power supply options and ensures compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making the product suitable for compact designs.

Power Supplies (V): 1.8/3.3, 3.3/5

The multiple power supply options ensure compatibility with different voltage requirements, making the product versatile for various applications.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, allowing the product to interface with other components efficiently.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in design options, catering to different application needs and constraints.

Minimum Supply Voltage: 2.97 V

With a low minimum supply voltage, the product can operate in power-constrained environments while maintaining optimal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and performance in various operating conditions, making the product suitable for diverse environments.

Maximum Data Transfer Rate: 60 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product can withstand extreme cold conditions without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a reliable and durable connection, ensuring long-term performance and stability of the product.

Terminal Position: QUAD

Quad terminal position offers efficient routing and connectivity, enabling easy integration of the product into the system architecture.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a compact design, making the product suitable for space-constrained applications.

Width: 4 mm

The compact width dimension enables efficient placement on the circuit board, contributing to overall system miniaturization.

Maximum Clock Frequency: 12.02 MHz

The high maximum clock frequency supports fast and synchronized data processing, enhancing the overall efficiency of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and assembly of the product during manufacturing, contributing to its reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process effectively, ensuring a robust and stable connection.

Length: 4 mm

The compact length dimension allows for efficient use of space on the circuit board, contributing to overall system miniaturization.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus (USB) bus controller, the product offers standardized connectivity and communication protocols, ensuring compatibility with a wide range of devices.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Terminal Form: NO LEAD

Having a no-lead terminal form eliminates potential solder joint issues, ensuring a reliable and robust connection for the product.

Maximum Supply Current: 8.3 mA

The low maximum supply current consumption enables energy-efficient operation, making the product suitable for battery-powered and low-power applications.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage aligns with standard power requirements, ensuring compatibility with common power sources and systems.

Bus Compatibility: UART, USB

Supporting UART and USB bus compatibility allows the product to interface with a wide range of devices and systems, expanding its versatility and usability.

Terminal Pitch: 0.65 mm

The small terminal pitch enables dense packing and efficient routing of terminals, contributing to a compact and space-saving product design.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the product's ability to withstand moderate exposure to moisture during storage and handling, enhancing its reliability and longevity.

Technical Specifications

Bus Controllers FT230XQ-T attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

UART, USB

Maximum Clock Frequency:

12.02 MHz

Maximum Data Transfer Rate:

60 MBps

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

8.3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

FT230XQ-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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