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USB5807T-I/KD

Microchip Technology

USB5807T-I/KD by Microchip Technology

The Microchip Technology USB5807T-I/KD is a BUS CONTROLLER IC with 625 MBps data transfer rate, operating at -40 to 85 °C. It supports I2C, SMBUS, and SPI bus compatibility, with a max clock frequency of 25 MHz. Ideal for industrial applications requiring low supply voltage and high-speed data transmission.

Median Price

$8.039

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

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-

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10k+ parts

$8.039

2,500

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$8.039

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,264 parts In-Stock

1+ parts

-

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3,264

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$5.141

100+ parts

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557

$5.141

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Aztec Data Supply Inc.

USA . 318 parts In-Stock

1+ parts

$24.516

100+ parts

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318

$24.516

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Ampacity Inc.

Singapore . 1,607 parts In-Stock

1+ parts

$26.000

100+ parts

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1k+ parts

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10k+ parts

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1,607

$26.000

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Corohmni

South Africa . 4,986 parts In-Stock

1+ parts

$54.984

100+ parts

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4,986

$54.984

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XL Components Corporation

Australia . 8,032 parts In-Stock

1+ parts

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8,032

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Lixinc

USA . 7,046 parts In-Stock

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7,046

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Marpe Global Electronics

Taiwan . 4,767 parts In-Stock

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4,767

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Continental Prestige Electronics

USA . 3,587 parts In-Stock

1+ parts

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3,587

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QualityLine Systems

Poland . 3,048 parts In-Stock

1+ parts

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3,048

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Argo Parts USA

USA . 347 parts In-Stock

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347

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Microchip USA

USA . 239 parts In-Stock

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239

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock seamless data transfer and streamlined connectivity with the USB5807T-I/KD by Microchip Technology. As a leader in innovative technology solutions, Microchip delivers top-notch quality and reliability in the Bus Controllers category. Ideal for various applications, this product offers customers unparalleled value and benefits, providing a maximum data transfer rate of 625 MBps and a wide operating temperature range. Elevate your projects with the USB5807T-I/KD and experience the superior performance and efficiency it brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on the PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 1.32 V

Provides a wide range of supply voltage support, making it compatible with various power sources.

Screening Level: TS 16949

Ensures high quality and reliability as per industry standards, making it suitable for critical applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

No. of Terminals: 100

Sufficient number of terminals for connecting to other components and peripherals.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate allows for fast and efficient communication between devices.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high performance.

Bus Compatibility: I2C; SMBUS; SPI

Supports multiple bus protocols, expanding compatibility with a wide range of devices.

Technical Specifications

Bus Controllers USB5807T-I/KD attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C; SMBUS; SPI

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-XQCC-N100

JESD-609 Code:

e3

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB5807T-I/KD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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