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FT2232HL-TRAY

FTDI

FT2232HL-TRAY by FTDI

FTDI's FT2232HL-TRAY is a bus controller with 64 terminals, supporting 1.8V and 3.3V power supplies. It operates in industrial temperatures (-40 to 85°C) and has an external data bus width of 8 bits. Ideal for applications requiring USB peripheral ICs, it offers a max clock frequency of 12MHz and is compatible with the 8048 and 8051 buses.

Median Price

$3.650

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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RS Americas

USA . 1,794 parts In-Stock

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$3.650

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Nova Conductors

Japan . 57 parts In-Stock

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$5.260

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57

$5.260

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Vyrian

USA . 6,239 parts In-Stock

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6,239

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Chip Stock

USA . 4,730 parts In-Stock

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Semtec, LLC

USA . 1,729 parts In-Stock

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1,729

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K-1 Technologies

USA . 86 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 70 parts In-Stock

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Rebound Electronics

UK . 18 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Prism Electronics

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Continental Prestige Electronics

USA . 6,304 parts In-Stock

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$5.260

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$5.155

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Modulus Dynamics

Lithuania . 600 parts In-Stock

1+ parts

$5.839

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$5.780

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$5.605

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600

$5.839

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$5.605

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Allen Electronics Distributors

USA . 272 parts In-Stock

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$6.850

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$4.660

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Microchip USA

USA . 1,370 parts In-Stock

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$14.840

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Aztec Data Supply Inc.

USA . 262 parts In-Stock

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$67.070

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$82.668

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$78.534

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Neutron USA

USA . 25 parts In-Stock

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$131.880

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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Lucentia Tech

USA . 950 parts In-Stock

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$6.230

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$6.230

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience seamless connectivity and superior performance with the FT2232HL-TRAY by FTDI. As a leading manufacturer in the industry, FTDI brings you top-quality bus controllers that are perfect for a wide range of applications. With a reliable design and advanced technology, this product offers unparalleled value to customers looking for efficient and versatile solutions. Trust FTDI to deliver excellence in every aspect, from package body material to terminal form, and elevate your projects to new heights. Choose FT2232HL-TRAY for unmatched reliability and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 1.98 V

The maximum supply voltage of 1.98 V ensures safe operation within specified limits, protecting the device from overvoltage.

Address Bus Width: 16

The 16-bit address bus width allows for efficient communication and addressing of memory locations, enhancing overall performance.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages ensures flexibility in design and compatibility with various systems.

No. of Terminals: 64

The 64 terminals provide ample connectivity options and interfaces, allowing for seamless integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and high component density, ideal for compact designs.

Minimum Supply Voltage: 1.62 V

The minimum supply voltage of 1.62 V ensures reliable operation even under lower voltage conditions, enhancing versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold climates or environments.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for compact and slim device designs, ideal for space-constrained applications.

Width: 10 mm

The 10 mm width offers compatibility with standard PCB layouts and mounting configurations, simplifying integration into existing systems.

External Data Bus Width: 8

The 8-bit external data bus width facilitates efficient data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 12 MHz

With a maximum clock frequency of 12 MHz, this product can handle high-speed data processing and communication tasks effectively.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures reliable soldering and assembly processes, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables secure solder connections and ensures component reliability during assembly.

Length: 10 mm

The 10 mm length offers a compact form factor, making this product suitable for space-constrained applications and PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments with wide temperature fluctuations.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a bus controller for universal serial bus (USB) devices, this product enables seamless communication and data transfer between devices.

Technology: CMOS

The CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing efficiency.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections, reducing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures stable and efficient operation, meeting standard voltage requirements for various applications.

Bus Compatibility: 8048; 8051

Compatibility with 8048 and 8051 bus architectures allows for seamless integration into existing systems and enhances design flexibility.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch offers precise and compact solder connections, ensuring reliable signal transmission and minimizing signal interference.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture exposure, requiring standard handling and storage procedures to maintain component reliability.

Technical Specifications

Bus Controllers FT2232HL-TRAY attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 V

Address Bus Width:

16

Bus Compatibility:

8048; 8051

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

FT2232HL-TRAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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