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TUSB8044AIRGCR

Texas Instruments

TUSB8044AIRGCR by Texas Instruments

TUSB8044AIRGCR by Texas Instruments is a 64-terminal chip carrier with a data transfer rate of 625 MBps. It operates b/w -40 to 85 °C and supports I2C and SMBUS bus compatibility. Ideal for industrial applications requiring high-speed USB connectivity in compact spaces.

Median Price

$10.075

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,702 parts In-Stock

1+ parts

$7.820

100+ parts

$6.375

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$4.250

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10,702

$7.820

$6.375

$4.250

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DigiKey

USA . 1,870 parts In-Stock

1+ parts

$12.330

100+ parts

$8.285

1k+ parts

$8.225

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-

1,870

$12.330

$8.285

$8.225

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.375

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10

$6.375

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Digiode

USA . 3,888 parts In-Stock

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$7.429

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3,888

$7.429

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Vyrian

USA . 5,346 parts In-Stock

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5,346

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Chip Stock

USA . 1,125 parts In-Stock

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Cyclops Electronics Ltd

UK . 807 parts In-Stock

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807

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Bristol Electronics

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,250 parts In-Stock

1+ parts

$6.375

100+ parts

-

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$6.248

1,250

$6.375

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-

$6.248

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.375

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100

$6.375

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Ampacity Inc.

Singapore . 5,184 parts In-Stock

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$6.650

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$6.650

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Corphita

USA . 3,977 parts In-Stock

1+ parts

$7.038

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3,977

$7.038

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Corohmni

South Africa . 59 parts In-Stock

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$56.479

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59

$56.479

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Parana Technologies

USA . 1,579 parts In-Stock

1+ parts

$58.459

100+ parts

$5,428.783

1k+ parts

$52.613

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1,579

$58.459

$5,428.783

$52.613

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DigiPath Technology Company

USA . 399 parts In-Stock

1+ parts

$64.370

100+ parts

$59.221

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399

$64.370

$59.221

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ChromeModa Solutions

Germany . 6,348 parts In-Stock

1+ parts

$65.684

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$53.861

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$65.684

$53.861

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IDEA Electronic Components Group

UK . 1,513 parts In-Stock

1+ parts

$65.684

100+ parts

$62.400

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$59.116

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1,513

$65.684

$62.400

$59.116

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Lixinc

USA . 17,482 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Argo Parts USA

USA . 2,172 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

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Overview

Unlock seamless data transfer with the TUSB8044AIRGCR by Texas Instruments, a cutting-edge bus controller designed for industrial-grade applications. With a maximum data transfer rate of 625 MBps and compatibility with I2C and SMBus, this chip carrier offers unparalleled performance and reliability. Manufactured with top-quality materials and advanced CMOS technology, this device ensures optimal functionality even in extreme temperatures. Elevate your system's connectivity with Texas Instruments' trusted expertise and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to moisture, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

The higher maximum supply voltage allows for compatibility with a wider range of systems and devices.

Package Shape: SQUARE

The square shape helps in efficient placement on the circuit board, optimizing space utilization.

No. of Terminals: 64

Having a higher number of terminals enables the product to handle more data transfer connections, enhancing its versatility.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions, making it suitable for industrial applications.

Bus Compatibility: I2C; SMBUS

Support for multiple bus protocols increases flexibility and compatibility with different types of systems and devices.

Technical Specifications

Bus Controllers TUSB8044AIRGCR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

24 MHZ NOMINAL CRYSTAL CLOCK AVAILABLE; ALSO OPERATES @3.3V NOMINAL SUPPLY

Bus Compatibility:

I2C; SMBUS

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8044AIRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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