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CYUSB4347-BZXC

Infineon Technologies

CYUSB4347-BZXC by Infineon Technologies

CYUSB4347-BZXC by Infineon Technologies is a BUS CONTROLLER IC with 192 terminals, operating at 25 MHz clock frequency. It supports I2C and SPI bus compatibility, achieving data transfer rates of up to 1250 MBps. Ideal for applications requiring low profile, fine pitch components in commercial temperature grade environments.

Median Price

$18.472

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 595 parts In-Stock

1+ parts

$10.789

100+ parts

-

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595

$10.789

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Chip1Stop

Japan . 27 parts In-Stock

1+ parts

$16.500

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27

$16.500

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Farnell

UK . 1,404 parts In-Stock

1+ parts

$17.670

100+ parts

$12.110

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-

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1,404

$17.670

$12.110

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Newark

USA . 1,299 parts In-Stock

1+ parts

$27.100

100+ parts

$19.220

1k+ parts

$18.600

10k+ parts

-

1,299

$27.100

$19.220

$18.600

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DigiKey

USA . 793 parts In-Stock

1+ parts

$30.910

100+ parts

$23.347

1k+ parts

$20.680

10k+ parts

-

793

$30.910

$23.347

$20.680

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Element14

Singapore . 1,404 parts In-Stock

1+ parts

$32.440

100+ parts

$26.130

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-

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1,404

$32.440

$26.130

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Verical

USA . 1,217 parts In-Stock

1+ parts

-

100+ parts

$19.275

1k+ parts

$17.250

10k+ parts

$16.225

1,217

-

$19.275

$17.250

$16.225

Rochester

USA . 1,217 parts In-Stock

1+ parts

-

100+ parts

$15.420

1k+ parts

$13.800

10k+ parts

$12.980

1,217

-

$15.420

$13.800

$12.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 370 parts In-Stock

1+ parts

$16.274

100+ parts

-

1k+ parts

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370

$16.274

-

-

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Vyrian

USA . 285 parts In-Stock

1+ parts

$17.130

100+ parts

-

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285

$17.130

-

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TME

Poland . 794 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$24.670

10k+ parts

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794

-

-

$24.670

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Flip Electronics

USA . 739 parts In-Stock

1+ parts

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739

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Nova Conductors

Japan . 100 parts In-Stock

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100

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,081 parts In-Stock

1+ parts

$14.560

100+ parts

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1,081

$14.560

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Corphita

USA . 589 parts In-Stock

1+ parts

$15.417

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589

$15.417

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Modulus Dynamics

Lithuania . 4,524 parts In-Stock

1+ parts

$48.055

100+ parts

$46.133

1k+ parts

$44.211

10k+ parts

-

4,524

$48.055

$46.133

$44.211

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Corohmni

South Africa . 491 parts In-Stock

1+ parts

$65.366

100+ parts

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491

$65.366

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QUARKTWIN TECHNOLOGY LTD

USA . 8,864 parts In-Stock

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8,864

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Argo Parts USA

USA . 5,165 parts In-Stock

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5,165

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Continental Prestige Electronics

USA . 4,335 parts In-Stock

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4,335

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of seamless connectivity with the CYUSB4347-BZXC by Infineon Technologies. As a leading manufacturer in bus controllers, Infineon delivers unparalleled quality and reliability. This versatile product is perfect for a wide range of applications, offering high-speed data transfer rates of up to 1250 MBps. With its low profile design and universal serial bus compatibility, the CYUSB4347-BZXC ensures optimal performance while maximizing efficiency. Experience the value and benefits of this cutting-edge technology, providing customers with a solution that exceeds expectations. Elevate your connectivity experience with the CYUSB4347-BZXC from Infineon Technologies.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Durable and lightweight material, suitable for electronic components.

Surface Mount YES

Allows for easy and secure attachment to circuit boards.

Maximum Supply Voltage 1.05 V

Ideal voltage range for efficient operation and power consumption.

Package Shape SQUARE

Compact shape for space-saving and organized circuit layout.

No. of Terminals 192

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter) GRID ARRAY, LOW PROFILE, FINE PITCH

Optimal design for high-density and high-performance applications.

Minimum Supply Voltage 0.95 V

Allows for flexibility in power supply without compromising performance.

Maximum Operating Temperature 70 °C

Suitable for a wide range of environmental conditions.

Maximum Data Transfer Rate 1250 MBps

High data transfer rate for fast and efficient communication.

Minimum Operating Temperature 0 °C

Can operate in low-temperature environments without issues.

Terminal Finish TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position BOTTOM

Easier access and connection to other components on the circuit board.

Maximum Seated Height 1.45 mm

Low profile design for compact and streamlined product appearance.

Width 12 mm

Optimal width for fitting into standard circuit board configurations.

Maximum Clock Frequency 25 MHz

Supports high-speed data processing and communication.

Length 12 mm

Balanced length for space efficiency and component layout.

Temperature Grade COMMERCIAL

Suitable for commercial-grade applications with standard temperature requirements.

Peripheral IC Type BUS CONTROLLER, UNIVERSAL SERIAL BUS

Versatile IC type for handling various bus protocols, including USB.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form BALL

Ball terminal form for secure connections and reliability.

Maximum Supply Current 750 mA

Adequate supply current for stable and efficient operation.

Nominal Supply Voltage 1 V

Stable supply voltage for consistent performance.

Bus Compatibility I2C; SPI

Compatible with popular bus protocols for easy integration and connectivity.

Terminal Pitch 0.8 mm

Optimal terminal pitch for compact and efficient circuit designs.

Technical Specifications

Bus Controllers CYUSB4347-BZXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Bus Compatibility:

I2C; SPI

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

1250 MBps

JESD-30 Code:

S-PBGA-B192

JESD-609 Code:

e1

Length:

12 mm

No. of Terminals:

192

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA192,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.45 mm

Maximum Supply Current:

750 mA

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

CYUSB4347-BZXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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