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CYUSB3014-BZXI

Infineon Technologies

CYUSB3014-BZXI by Infineon Technologies

CYUSB3014-BZXI by Infineon: 32-bit external data bus, 625 MBps data transfer rate, 19.2 MHz clock frequency. Ideal for industrial applications requiring USB, I2C, SPI compatibility in a compact square package with 121 terminals and thin profile.

Median Price

$41.531

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 191 parts In-Stock

1+ parts

$38.557

100+ parts

$37.121

1k+ parts

-

10k+ parts

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191

$38.557

$37.121

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Chip1Stop

Japan . 914 parts In-Stock

1+ parts

$39.300

100+ parts

$28.800

1k+ parts

$27.500

10k+ parts

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914

$39.300

$28.800

$27.500

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Element14

Singapore . 270 parts In-Stock

1+ parts

$41.531

100+ parts

$37.434

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-

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270

$41.531

$37.434

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Newark

USA . 521 parts In-Stock

1+ parts

$42.190

100+ parts

$29.730

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$29.040

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521

$42.190

$29.730

$29.040

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Mouser Electronics

USA . 445 parts In-Stock

1+ parts

$44.350

100+ parts

$33.270

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$30.930

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445

$44.350

$33.270

$30.930

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Verical

USA . 2,132 parts In-Stock

1+ parts

$50.375

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$36.500

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2,132

$50.375

$36.500

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DigiKey

USA . 1,759 parts In-Stock

1+ parts

$52.520

100+ parts

$40.528

1k+ parts

$37.144

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$52.520

$40.528

$37.144

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Flip Electronics (Authorized)

USA . 9,939 parts In-Stock

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RS (Exports)

UK . 40 parts In-Stock

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$30.283

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40

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$30.283

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Rochester

USA . 2 parts In-Stock

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$24.710

1k+ parts

$22.110

10k+ parts

$20.810

2

-

$24.710

$22.110

$20.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 989 parts In-Stock

1+ parts

$23.246

100+ parts

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989

$23.246

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NAC Semi

USA . 8 parts In-Stock

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$35.000

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8

$35.000

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Maritex

Poland . 8,550 parts In-Stock

1+ parts

$35.102

100+ parts

$24.706

1k+ parts

$24.127

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8,550

$35.102

$24.706

$24.127

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Voyager Components

USA . 45 parts In-Stock

1+ parts

$36.000

100+ parts

$36.000

1k+ parts

$36.000

10k+ parts

$36.000

45

$36.000

$36.000

$36.000

$36.000

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$44.345

100+ parts

-

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29

$44.345

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Flip Electronics

USA . 9,939 parts In-Stock

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9,939

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Vyrian

USA . 2,781 parts In-Stock

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2,781

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Chip Stock

USA . 2,000 parts In-Stock

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2,000

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Cyclops Electronics Ltd

UK . 1,744 parts In-Stock

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1,744

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Rutronik

Germany . 548 parts In-Stock

1+ parts

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$46.990

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548

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$46.990

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Semi Source

USA . 10 parts In-Stock

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10

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SPM Sales

USA . 7 parts In-Stock

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7

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Halfin

Belgium . 6 parts In-Stock

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6

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Elcom Components

USA . 6 parts In-Stock

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6

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 6 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,041 parts In-Stock

1+ parts

$15.670

100+ parts

$15.278

1k+ parts

$15.200

10k+ parts

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3,041

$15.670

$15.278

$15.200

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Corphita

USA . 837 parts In-Stock

1+ parts

$22.023

100+ parts

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837

$22.023

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Aztec Data Supply Inc.

USA . 3,866 parts In-Stock

1+ parts

$26.764

100+ parts

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3,866

$26.764

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Component Stockers USA

USA . 4,909 parts In-Stock

1+ parts

$28.000

100+ parts

$28.360

1k+ parts

$28.120

10k+ parts

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4,909

$28.000

$28.360

$28.120

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Ampacity Inc.

Singapore . 2,589 parts In-Stock

1+ parts

$34.110

100+ parts

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2,589

$34.110

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$34.921

100+ parts

$33.175

1k+ parts

$33.175

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5,000

$34.921

$33.175

$33.175

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Continental Prestige Electronics

USA . 734 parts In-Stock

1+ parts

$36.250

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734

$36.250

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Netroflash

USA . 50 parts In-Stock

1+ parts

$44.345

100+ parts

-

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$42.128

10k+ parts

$41.241

50

$44.345

-

$42.128

$41.241

Corohmni

South Africa . 252 parts In-Stock

1+ parts

$62.929

100+ parts

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252

$62.929

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Modulus Dynamics

Lithuania . 2,174 parts In-Stock

1+ parts

$74.640

100+ parts

$71.654

1k+ parts

$68.669

10k+ parts

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2,174

$74.640

$71.654

$68.669

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Microchip USA

USA . 6,359 parts In-Stock

1+ parts

$106.810

100+ parts

$104.950

1k+ parts

$104.030

10k+ parts

$103.100

6,359

$106.810

$104.950

$104.030

$103.100

A-Z Elektronik GmbH

Germany . 15,348 parts In-Stock

1+ parts

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15,348

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Infinite Electronics LLP (Excess)

. 11,559 parts In-Stock

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11,559

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Perfect Parts

USA . 10,214 parts In-Stock

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GreenTree Electronics

Israel . 5,530 parts In-Stock

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5,530

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Alle Elektronik GmbH

Germany . 4,232 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Kepictronics

USA . 3,634 parts In-Stock

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3,634

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Robosynatics

Brazil . 2,871 parts In-Stock

1+ parts

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100+ parts

$26.733

1k+ parts

$26.188

10k+ parts

$26.188

2,871

-

$26.733

$26.188

$26.188

Lucentia Tech

USA . 2,871 parts In-Stock

1+ parts

-

100+ parts

$26.733

1k+ parts

$26.188

10k+ parts

$26.188

2,871

-

$26.733

$26.188

$26.188

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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S.R.D Solutions

India . 2,071 parts In-Stock

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2,071

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Benley Electronics

USA . 1,019 parts In-Stock

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1,019

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Argo Parts USA

USA . 696 parts In-Stock

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696

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iodParts Technologies Inc.

India . 591 parts In-Stock

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591

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RC Electronics

USA . 500 parts In-Stock

1+ parts

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100+ parts

$44.100

1k+ parts

$40.260

10k+ parts

$39.050

500

-

$44.100

$40.260

$39.050

Allen Electronics Distributors

USA . 8 parts In-Stock

1+ parts

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100+ parts

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8

-

-

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Overview

Discover the power of seamless connectivity with the CYUSB3014-BZXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bus controllers that provide reliable performance and unmatched versatility. Ideal for a wide range of applications, this product offers lightning-fast data transfer rates and outstanding compatibility with various bus types, making it a must-have for any tech enthusiast. Experience the value and benefits of Infineon's cutting-edge technology with the CYUSB3014-BZXI and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus controller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, making the integration process more efficient.

Maximum Supply Voltage: 1.25 V

Operates efficiently within a safe voltage range, reducing the risk of damage from power surges.

Address Bus Width: 2

Allows for efficient communication with peripheral devices, enhancing the overall performance of the bus controller.

Package Shape: SQUARE

Compact and space-saving design, ideal for applications where board space is limited.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Enables high-density mounting and efficient heat dissipation, making it suitable for compact electronic devices.

Minimum Supply Voltage: 1.15 V

Low power consumption at minimum voltage, ensuring energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying heat levels.

Maximum Data Transfer Rate: 625 MBps

High-speed data transfer capabilities for quick and efficient communication between devices.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperatures, suitable for applications in cold environments.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and ensures a reliable connection between the bus controller and other components.

Terminal Position: BOTTOM

Facilitates easy mounting on circuit boards and improves accessibility for connections.

Maximum Seated Height: 1.2 mm

Low-profile design for space-efficient installations in compact electronic devices.

Width: 10 mm

Compact form factor suitable for small electronic devices with limited space.

External Data Bus Width: 32

Wide data bus width for enhanced data processing and communication speed.

Maximum Clock Frequency: 19.2 MHz

High clock frequency for fast data processing and improved system performance.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper reflow soldering process with the specified time limit for optimal performance.

Peak Reflow Temperature °C: 260

High reflow temperature capability for reliable soldering and durability during manufacturing processes.

Length: 10 mm

Compact and space-saving design suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with varying temperature conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports a wide range of bus types for versatile connectivity and compatibility with various devices.

Technology: CMOS

Uses CMOS technology for low power consumption and efficient operation in electronic devices.

Terminal Form: BALL

Ball terminal form for reliable connections and easy installation on circuit boards.

Maximum Supply Current: 200 mA

Efficient power usage with a maximum current requirement of 200 mA.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent performance and reliable operation.

Bus Compatibility: I2C, I2S, SMBUS, SPI, UART, USB

Supports a wide range of bus protocols for seamless integration with various devices and systems.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and efficient PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures proper handling and storage to prevent moisture-related damage during manufacturing and assembly processes.

Technical Specifications

Bus Controllers CYUSB3014-BZXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

2

Bus Compatibility:

I2C, I2S, SMBUS, SPI, UART, USB

Maximum Clock Frequency:

19.2 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

CYUSB3014-BZXI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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