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CYUSB3065-BZXI

Infineon Technologies

CYUSB3065-BZXI by Infineon Technologies

CYUSB3065-BZXI by Infineon Technologies is a bus controller with a max data transfer rate of 625 MBps and operates at a clock frequency of up to 40 MHz. It is ideal for industrial applications requiring USB, I2C, I2S, SPI, and UART compatibility in a compact square package with low profile design. With a wide temperature range from -40 to 85 °C, this CMOS technology device offers high performance in various environments.

Median Price

$26.120

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 1,060 parts In-Stock

1+ parts

$18.439

100+ parts

$17.501

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$18.439

$17.501

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Farnell

UK . 820 parts In-Stock

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$24.570

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$18.610

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820

$24.570

$18.610

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Chip1Stop

Japan . 640 parts In-Stock

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$26.000

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$20.800

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-

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$20.600

640

$26.000

$20.800

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$20.600

Arrow

USA . 9 parts In-Stock

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$26.120

100+ parts

$20.710

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$20.470

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9

$26.120

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Verical

USA . 9 parts In-Stock

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$26.120

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9

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DigiKey

USA . 2,381 parts In-Stock

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$32.000

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$24.400

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$21.966

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2,381

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$21.966

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Mouser Electronics

USA . 1,576 parts In-Stock

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$32.880

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$22.850

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Newark

USA . 85 parts In-Stock

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$32.960

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$23.450

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$23.040

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85

$32.960

$23.450

$23.040

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Element14

Singapore . 820 parts In-Stock

1+ parts

$43.930

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$33.020

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820

$43.930

$33.020

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RS (Exports)

UK . 50 parts In-Stock

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$24.570

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50

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$24.570

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Rochester

USA . 5 parts In-Stock

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-

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$19.700

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$17.630

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$16.590

5

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$19.700

$17.630

$16.590

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 937 parts In-Stock

1+ parts

$14.250

100+ parts

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937

$14.250

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$27.580

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200

$27.580

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North Shore Components

USA . 1,680 parts In-Stock

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1,680

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Flip Electronics

USA . 1,416 parts In-Stock

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1,416

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Cyclops Electronics Ltd

UK . 980 parts In-Stock

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Vyrian

USA . 477 parts In-Stock

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Sensible Micro Corp

USA . 59 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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Sunrise Surplus Inc.

USA . 5 parts In-Stock

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Semtec, LLC

USA . 3 parts In-Stock

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Inventory MP

USA . 2 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corphita

USA . 629 parts In-Stock

1+ parts

$13.500

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629

$13.500

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Ampacity Inc.

Singapore . 481 parts In-Stock

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$18.610

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481

$18.610

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Modulus Dynamics

Lithuania . 3,943 parts In-Stock

1+ parts

$23.030

100+ parts

$22.109

1k+ parts

$21.188

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3,943

$23.030

$22.109

$21.188

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Corohmni

South Africa . 722 parts In-Stock

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$23.030

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722

$23.030

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$23.721

100+ parts

$22.535

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$22.535

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550

$23.721

$22.535

$22.535

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$27.580

100+ parts

$26.201

1k+ parts

-

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$24.546

200

$27.580

$26.201

-

$24.546

Continental Prestige Electronics

USA . 1,015 parts In-Stock

1+ parts

$28.330

100+ parts

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$20.630

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1,015

$28.330

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$20.630

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Semicontronic

India . 476 parts In-Stock

1+ parts

$39.590

100+ parts

$38.600

1k+ parts

$38.402

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476

$39.590

$38.600

$38.402

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Aztec Data Supply Inc.

USA . 3,045 parts In-Stock

1+ parts

$40.739

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$40.739

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A-Z Elektronik GmbH

Germany . 8,250 parts In-Stock

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Argo Parts USA

USA . 3,654 parts In-Stock

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3,654

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Infinite Electronics LLP (Excess)

. 2,745 parts In-Stock

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2,745

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Authorized Procurement Solutions

USA . 2,400 parts In-Stock

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2,400

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Robosynatics

Brazil . 2,159 parts In-Stock

1+ parts

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100+ parts

$22.569

1k+ parts

$22.109

10k+ parts

$22.109

2,159

-

$22.569

$22.109

$22.109

Lucentia Tech

USA . 2,159 parts In-Stock

1+ parts

-

100+ parts

$22.569

1k+ parts

$22.109

10k+ parts

$22.109

2,159

-

$22.569

$22.109

$22.109

GreenTree Electronics

Israel . 1,176 parts In-Stock

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1,176

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Formix International (Excess)

India . 465 parts In-Stock

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465

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Perfect Parts

USA . 155 parts In-Stock

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155

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Overview

Discover the superior quality and reliability of the CYUSB3065-BZXI Bus Controller from industry leader Infineon Technologies. This versatile device offers seamless integration with I2C, I2S, SPI, and UART bus compatibility, providing high-speed data transfer rates of up to 625 MBps. With a wide operating temperature range and low profile package design, this innovative solution is ideal for a variety of industrial applications. Trust in the expertise of Infineon Technologies to deliver cutting-edge technology that enhances performance and efficiency for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient integration into electronic circuits, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25V ensures efficient and safe operation of the bus controller.

Package Shape: SQUARE

The square package shape allows for compact placement on PCBs, optimizing space utilization.

Power Supplies (V): 1.2

The 1.2V power supply ensures reliable and stable performance of the bus controller.

No. of Terminals: 121

The high number of terminals provides flexibility for connecting various components and peripherals to the bus controller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for a high density of connections in a compact form factor.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage requirement of 1.15V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate of 625 MBps allows for fast and efficient communication between devices connected to the bus controller.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality in cold temperatures or harsh environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure soldering to the PCB for stable connections.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7mm enables a slim and space-saving design for the overall PCB layout.

Width: 10 mm

The compact width of 10mm makes the bus controller suitable for use in tight spaces or applications with size constraints.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz ensures efficient data processing and communication speed between connected devices.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering during the assembly process.

Length: 10 mm

The short length of 10mm contributes to the overall compact and space-efficient design of the bus controller.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The bus controller with universal serial bus support allows for versatile connectivity options and communication protocols for connected devices.

Technology: CMOS

The CMOS technology used in the bus controller ensures low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections during PCB assembly and operation.

Maximum Supply Current: 192 mA

The maximum supply current of 192mA ensures stable power delivery for the bus controller and connected devices.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures compatibility with standard power sources for seamless integration.

Bus Compatibility: I2C, I2S, SPI, UART

The bus controller's compatibility with I2C, I2S, SPI, and UART communication protocols allows for versatile connectivity options with various devices.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm enables a high density of connections within a small area, ideal for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the bus controller can withstand moderate exposure to moisture during storage or operation.

Technical Specifications

Bus Controllers CYUSB3065-BZXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, I2S, SPI, UART

Maximum Clock Frequency:

40 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

192 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

CYUSB3065-BZXI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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