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USB2513-AEZG

Microchip Technology

USB2513-AEZG by Microchip Technology

Microchip Technology's USB2513-AEZG is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of 24 MHz, suitable for various applications requiring high-speed data transfer in commercial-grade environments. The chip carrier package style with a very thin profile makes it ideal for space-constrained designs.

Median Price

$1.657

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Rebound Electronics

UK . 562 parts In-Stock

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Prism Electronics

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Vyrian

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Nova Conductors

Japan . 100 parts In-Stock

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Sensible Micro Corp

USA . 55 parts In-Stock

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$1.657

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$1.530

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Semi Source

USA . 15 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 463 parts In-Stock

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$19.469

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Semicontronic

India . 1,133 parts In-Stock

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$24.000

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$23.400

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$23.280

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Corohmni

South Africa . 69 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,633 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,119 parts In-Stock

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West Coast Incorporated

USA . 7,814 parts In-Stock

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Microchip USA

USA . 5,665 parts In-Stock

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GreenTree Electronics

Israel . 5,250 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 245 parts In-Stock

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Kepictronics

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Computer Components Inc. - USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Unlock seamless connectivity with the USB2513-AEZG by Microchip Technology, a leading manufacturer renowned for innovative solutions. This bus controller is a game-changer in the industry, offering high-quality performance and reliability. From I2C to USB compatibility, this versatile device caters to a wide range of applications. With its compact design and advanced technology, the USB2513-AEZG ensures optimal functionality while maximizing efficiency. Elevate your projects with this cutting-edge solution that guarantees superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, providing compatibility with a wide range of power sources and applications.

Package Shape: SQUARE

The square package shape enables easy placement on circuit boards and efficient use of space.

No. of Terminals: 36

The high number of terminals allows for versatile connectivity options and integration with various components.

Minimum Supply Voltage: 3 V

Supports a minimum supply voltage of 3V, ensuring reliable operation even with lower power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Capable of operating at temperatures as low as 0°C, making it suitable for a wide range of environmental conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Designed as a bus controller for Universal Serial Bus (USB) interfaces, providing efficient communication between devices.

Maximum Clock Frequency: 24 MHz

Supports a high maximum clock frequency of 24 MHz, enabling fast data transfer and processing speeds.

Technical Specifications

Bus Controllers USB2513-AEZG attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C; SMBUS; USB

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-PQCC-N36

Length:

6 mm

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

USB2513-AEZG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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