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CYUSB3014-BZXCT

Infineon Technologies

CYUSB3014-BZXCT by Infineon Technologies

CYUSB3014-BZXCT by Infineon: 375 MBps data rate, 52 MHz clock freq, 32-bit bus width. Ideal for USB bus control in commercial applications with I2C, I2S, SPI, UART compatibility.

Median Price

$30.860

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 50 parts In-Stock

1+ parts

$28.552

100+ parts

$22.495

1k+ parts

$21.239

10k+ parts

-

50

$28.552

$22.495

$21.239

-

Verical

USA . 459 parts In-Stock

1+ parts

$30.668

100+ parts

$21.671

1k+ parts

$20.962

10k+ parts

-

459

$30.668

$21.671

$20.962

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Chip1Stop

Japan . 459 parts In-Stock

1+ parts

$30.900

100+ parts

$23.600

1k+ parts

-

10k+ parts

-

459

$30.900

$23.600

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-

Newark

USA . 250 parts In-Stock

1+ parts

$32.730

100+ parts

$24.040

1k+ parts

$20.130

10k+ parts

-

250

$32.730

$24.040

$20.130

-

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$35.030

100+ parts

$25.590

1k+ parts

$23.990

10k+ parts

-

210

$35.030

$25.590

$23.990

-

DigiKey

USA . 2,671 parts In-Stock

1+ parts

$40.910

100+ parts

$29.144

1k+ parts

$28.135

10k+ parts

$26.774

2,671

$40.910

$29.144

$28.135

$26.774

Flip Electronics (Authorized)

USA . 14,797 parts In-Stock

1+ parts

-

100+ parts

-

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14,797

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-

-

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Element14

Singapore . 225 parts In-Stock

1+ parts

-

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-

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$30.820

225

-

-

-

$30.820

Farnell

UK . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$17.060

50

-

-

-

$17.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 44 parts In-Stock

1+ parts

$22.895

100+ parts

-

1k+ parts

-

10k+ parts

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44

$22.895

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$28.865

100+ parts

-

1k+ parts

-

10k+ parts

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100

$28.865

-

-

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Sensible Micro Corp

USA . 21,800 parts In-Stock

1+ parts

-

100+ parts

-

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-

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21,800

-

-

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Chip Stock

USA . 3,590 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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3,590

-

-

-

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Vyrian

USA . 3,096 parts In-Stock

1+ parts

-

100+ parts

-

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3,096

-

-

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Flip Electronics

USA . 1,170 parts In-Stock

1+ parts

-

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1,170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,881 parts In-Stock

1+ parts

$15.550

100+ parts

$15.161

1k+ parts

$15.084

10k+ parts

-

2,881

$15.550

$15.161

$15.084

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Ampacity Inc.

Singapore . 2,853 parts In-Stock

1+ parts

$15.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,853

$15.550

-

-

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Corphita

USA . 560 parts In-Stock

1+ parts

$21.690

100+ parts

-

1k+ parts

-

10k+ parts

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560

$21.690

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$28.288

100+ parts

-

1k+ parts

$27.156

10k+ parts

-

1,000

$28.288

-

$27.156

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Continental Prestige Electronics

USA . 4,034 parts In-Stock

1+ parts

$28.865

100+ parts

-

1k+ parts

-

10k+ parts

$28.288

4,034

$28.865

-

-

$28.288

Corohmni

South Africa . 5,237 parts In-Stock

1+ parts

$54.364

100+ parts

-

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-

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5,237

$54.364

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-

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Microchip USA

USA . 2,915 parts In-Stock

1+ parts

$58.545

100+ parts

-

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-

10k+ parts

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2,915

$58.545

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Aztec Data Supply Inc.

USA . 21,496 parts In-Stock

1+ parts

$58.928

100+ parts

-

1k+ parts

-

10k+ parts

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21,496

$58.928

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-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$59.884

100+ parts

$56.890

1k+ parts

$56.890

10k+ parts

-

2,000

$59.884

$56.890

$56.890

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Modulus Dynamics

Lithuania . 550 parts In-Stock

1+ parts

$70.874

100+ parts

$68.039

1k+ parts

$65.204

10k+ parts

-

550

$70.874

$68.039

$65.204

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,251 parts In-Stock

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2,251

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

$0.600

1k+ parts

$0.600

10k+ parts

$0.600

100

-

$0.600

$0.600

$0.600

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.600

1k+ parts

$0.600

10k+ parts

$0.600

100

-

$0.600

$0.600

$0.600

Overview

Unlock the seamless connectivity and unparalleled performance with the CYUSB3014-BZXCT by Infineon Technologies. Crafted with precision and reliability, this bus controller is designed to elevate your applications to new heights. Perfect for a wide range of bus-compatible devices, this product offers unmatched value and benefits. Experience lightning-fast data transfer rates and effortless integration, all while enjoying the quality and expertise of a trusted manufacturer. Elevate your projects with the CYUSB3014-BZXCT and take your connectivity to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable bus controller applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

Efficient power consumption with a maximum supply voltage of 1.25V, making it suitable for low-power bus controller designs.

Package Shape: SQUARE

Square package shape helps in efficient placement on the PCB and enhances the overall aesthetics of the product.

No. of Terminals: 121

A high number of terminals allow for versatile connectivity options, enabling the bus controller to interface with multiple devices.

Maximum Data Transfer Rate: 375 MBps

High data transfer rate of 375 MBps ensures fast and efficient communication between the bus controller and connected devices.

Maximum Clock Frequency: 52 MHz

High clock frequency of 52 MHz enables quick processing of data and smooth operation of the bus controller.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Universal Serial Bus compatibility ensures that the bus controller can easily connect to a wide range of devices, enhancing its versatility.

Technical Specifications

Bus Controllers CYUSB3014-BZXCT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Bus Compatibility:

I2C; I2S; SPI; UART

Maximum Clock Frequency:

52 MHz

Maximum Data Transfer Rate:

375 MBps

Drive Interface Standard:

GPIF

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

CYUSB3014-BZXCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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