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TAS1020BPFBR

Texas Instruments

TAS1020BPFBR by Texas Instruments

TAS1020BPFBR by Texas Instruments is an 8-bit bus controller with 48 terminals, operating at a max frequency of 6 MHz. It is used in USB peripheral ICs, featuring a supply voltage range of 3-3.6 V and temperature grade up to 70°C. The package style is flatpack with thin profile and fine pitch for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 9,802 parts In-Stock

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Vyrian

USA . 8,965 parts In-Stock

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8,965

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Digiode

USA . 4,193 parts In-Stock

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4,193

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Nova Conductors

Japan . 19 parts In-Stock

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Ampacity Inc.

Singapore . 672 parts In-Stock

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$3.000

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672

$3.000

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One Stop Electronics

USA . 555 parts In-Stock

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$4.000

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555

$4.000

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AZTECH Wire

Italy . 669 parts In-Stock

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$6.348

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669

$6.348

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Corohmni

South Africa . 2,034 parts In-Stock

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$39.931

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2,034

$39.931

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Parana Technologies

USA . 520 parts In-Stock

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$65.155

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520

$65.155

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DigiPath Technology Company

USA . 1,781 parts In-Stock

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$71.744

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$66.004

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$71.744

$66.004

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ChromeModa Solutions

Germany . 2,030 parts In-Stock

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$73.208

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$60.031

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$73.208

$60.031

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IDEA Electronic Components Group

UK . 1,518 parts In-Stock

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$73.208

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$69.548

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$65.887

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$73.208

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$65.887

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Continental Prestige Electronics

USA . 6,301 parts In-Stock

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Kepictronics

USA . 5,903 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Futuretech Components

Singapore . 2,951 parts In-Stock

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Perfect Parts

USA . 2,824 parts In-Stock

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Argo Parts USA

USA . 2,544 parts In-Stock

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Corphita

USA . 2,268 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Microchip USA

USA . 427 parts In-Stock

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Bastille Electronics

Australia . 49 parts In-Stock

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49

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Overview

Unlock the power of seamless connectivity with the TAS1020BPFBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that offer unmatched reliability and performance. This versatile component is ideal for a wide range of applications, providing customers with a valuable solution for their connectivity needs. Experience the benefits of efficient data transfer and simplified integration with the TAS1020BPFBR, setting new standards in innovation and convenience. Elevate your projects with Texas Instruments and take your connectivity to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the bus controller.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the bus controller onto a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this bus controller can handle a wide range of power inputs, making it versatile for different applications.

Bit Size: 8

The 8-bit size of this bus controller allows for efficient processing and management of data signals, ensuring smooth operation in diverse systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures that this bus controller can withstand heat and operate reliably in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the bus controller.

DMA Channels: YES

The DMA channels feature allows for direct memory access, enabling efficient data transfer between peripherals and memory without involving the CPU, improving system performance.

Width: 7 mm

The compact width of 7mm makes this bus controller suitable for space-constrained applications where size is a critical factor.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus controller, this product supports the popular USB interface, making it compatible with a wide range of devices and systems.

ROM Programmability: MROM

The MROM programmability feature allows for efficient programming of read-only memory, enabling customization and flexibility in the operation of the bus controller.

Technical Specifications

Bus Controllers TAS1020BPFBR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ADDRESS BUS WIDTH IS 11 AND DATA BUS WIDTH IS 8 IN EXTERNAL MCU MODE

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

6 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

14

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

6 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS1020BPFBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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