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TAS1020BPFBG4

Texas Instruments

TAS1020BPFBG4 by Texas Instruments

TAS1020BPFBG4 by Texas Instruments is a BUS CONTROLLER IC with 8-bit size, 48 terminals, and 6 MHz clock frequency. It operates at 3-3.6V, suitable for USB peripherals due to its thin profile and CMOS technology. With DMA channels and nickel palladium gold finish, it ensures high-speed data transfer in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 9,801 parts In-Stock

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Vyrian

USA . 4,793 parts In-Stock

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Digiode

USA . 976 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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One Stop Electronics

USA . 558 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 530 parts In-Stock

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$9.389

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Ampacity Inc.

Singapore . 801 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,350 parts In-Stock

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$48.072

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DigiPath Technology Company

USA . 212 parts In-Stock

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$52.933

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$48.698

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ChromeModa Solutions

Germany . 1,951 parts In-Stock

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$54.013

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$44.291

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IDEA Electronic Components Group

UK . 336 parts In-Stock

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$54.013

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$51.312

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$48.612

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Corohmni

South Africa . 2,602 parts In-Stock

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Lixinc

USA . 6,076 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Kepictronics

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Microchip USA

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Bastille Electronics

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Overview

Unlock the potential of your electronic devices with the TAS1020BPFBG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality bus controllers that are essential for seamless data transfer and communication within electronic systems. The TAS1020BPFBG4 offers customers unparalleled value and benefits, making it ideal for a wide range of applications. Whether you're designing consumer electronics, industrial equipment, or automotive systems, this product provides reliable performance and efficiency. Trust Texas Instruments to elevate your designs with cutting-edge technology and innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability makes it easy to integrate this bus controller into various electronic systems, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this bus controller can handle a wide range of power inputs, making it versatile for different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy alignment during assembly, contributing to a compact design.

Bit Size: 8

An 8-bit size allows for efficient data processing and communication, enabling the bus controller to handle complex tasks effectively.

No. of Terminals: 48

With 48 terminals, this bus controller offers ample connectivity options for interfacing with other components and peripherals in a system.

Minimum Supply Voltage: 3 V

The minimum supply voltage requirement of 3 V ensures compatibility with a wide range of power sources, enhancing the product's flexibility.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the bus controller to function reliably in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the bus controller can operate efficiently even in colder environments, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

DMA Channels: YES

Having DMA channels enables direct memory access for efficient data transfer, reducing the workload on the CPU and enhancing the bus controller's data processing capabilities.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for a slim profile and easy integration into compact electronic devices, optimizing space efficiency.

Maximum Clock Frequency: 6 MHz

A high maximum clock frequency of 6 MHz ensures fast and efficient data processing, making this bus controller suitable for high-speed applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus controller allows for compatibility with a wide range of devices, making it a versatile choice for various systems and applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various systems, contributing to the efficiency of the bus controller.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable power input for the bus controller, ensuring consistent performance and reliable operation.

ROM Programmability: MROM

MROM programmability allows for easy and secure programming of the read-only memory, facilitating customization and flexibility in operation.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that this bus controller is less susceptible to moisture damage, ensuring reliability in various environmental conditions.

Speed: 6 rpm

The speed capability of 6 rpm enables fast and efficient data processing, making this bus controller suitable for applications requiring quick response times.

No. of I/O Lines: 14

With 14 I/O lines, this bus controller offers versatile input and output options for connecting to external devices and peripherals, enhancing its connectivity capabilities.

Technical Specifications

Bus Controllers TAS1020BPFBG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ADDRESS BUS WIDTH IS 11 AND DATA BUS WIDTH IS 8 IN EXTERNAL MCU MODE

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

6 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

14

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

6 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS1020BPFBG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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