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TAS1020BPFB

Texas Instruments

TAS1020BPFB by Texas Instruments

TAS1020BPFB by Texas Instruments is a BUS CONTROLLER IC with 8-bit size, 48 terminals, and 3.6V max supply voltage. It is used in USB peripherals for data transfer at up to 6MHz clock frequency. The IC operates b/w 0-70°C temperature range and has a thin profile flatpack package style.

Median Price

$4.846

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip Stock

USA . 9,850 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,253 parts In-Stock

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Digiode

USA . 2,894 parts In-Stock

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Vyrian

USA . 2,789 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Netsource Technology, Inc.

USA . 390 parts In-Stock

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Sunrise Surplus Inc.

USA . 290 parts In-Stock

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Sensible Micro Corp

USA . 277 parts In-Stock

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$4.846

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$4.473

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Elcom Components

USA . 17 parts In-Stock

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Prism Electronics

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LittleDiode

UK . 3 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 314 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 707 parts In-Stock

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$12.917

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One Stop Electronics

USA . 908 parts In-Stock

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$27.000

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Corohmni

South Africa . 2,742 parts In-Stock

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$35.468

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Parana Technologies

USA . 2,372 parts In-Stock

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$49.486

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DigiPath Technology Company

USA . 2,224 parts In-Stock

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$54.490

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ChromeModa Solutions

Germany . 6,444 parts In-Stock

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$55.602

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$45.594

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IDEA Electronic Components Group

UK . 991 parts In-Stock

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$55.602

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$52.822

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$50.042

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Lixinc

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

USA . 3,804 parts In-Stock

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Continental Prestige Electronics

USA . 2,813 parts In-Stock

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Perfect Parts

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Microchip USA

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Kepictronics

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Bastille Electronics

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unlock seamless connectivity and efficiency with the TAS1020BPFB by Texas Instruments. As a leader in the industry, Texas Instruments delivers superior quality and reliability in their products. The TAS1020BPFB, a bus controller, offers unparalleled performance for various applications. With its advanced technology and innovative design, this product ensures optimal functionality and ease of use. Experience the value and benefits that Texas Instruments brings to customers with the TAS1020BPFB - your ultimate solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for use in various environments.

Surface Mount: YES

Being surface mountable allows for easy installation and takes up less space on the PCB, making the product efficient in terms of board space.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage tolerance allows for a wider range of power sources to be used with the product, increasing flexibility.

Bit Size: 8

8-bit size allows for processing of data in chunks of 8 bits at a time, providing a good balance between performance and complexity.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the product can operate reliably even in extreme temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

No. of I/O Lines: 14

Having 14 I/O lines provides sufficient input and output capabilities for connecting to external devices or peripherals.

Technical Specifications

Bus Controllers TAS1020BPFB attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ADDRESS BUS WIDTH IS 11 AND DATA BUS WIDTH IS 8 IN EXTERNAL MCU MODE

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

6 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

14

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

6 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS1020BPFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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