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TUSB2077APTRG4

Texas Instruments

TUSB2077APTRG4 by Texas Instruments

TUSB2077APTRG4 by Texas Instruments is a 48-terminal bus controller with 3.3V power supply, supporting USB data transfer rates up to 12 MBps. Ideal for commercial applications, it operates b/w 0-70°C and has a max clock frequency of 48 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,298 parts In-Stock

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Digiode

USA . 4,442 parts In-Stock

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Nova Conductors

Japan . 49 parts In-Stock

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One Stop Electronics

USA . 474 parts In-Stock

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$13.000

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474

$13.000

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AZTECH Wire

Italy . 889 parts In-Stock

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$14.776

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889

$14.776

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Ampacity Inc.

Singapore . 788 parts In-Stock

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$33.000

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$33.000

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Semicontronic

India . 275 parts In-Stock

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$35.000

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$34.125

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$33.950

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275

$35.000

$34.125

$33.950

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Corohmni

South Africa . 2,452 parts In-Stock

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$54.998

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Parana Technologies

USA . 1,950 parts In-Stock

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$55.637

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DigiPath Technology Company

USA . 552 parts In-Stock

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$61.264

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$56.363

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$61.264

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IDEA Electronic Components Group

UK . 809 parts In-Stock

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$62.514

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$59.388

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$56.263

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809

$62.514

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$56.263

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ChromeModa Solutions

Germany . 767 parts In-Stock

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$62.514

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$51.261

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$62.514

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$81.461

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$77.388

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$77.388

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QUARKTWIN TECHNOLOGY LTD

USA . 26,430 parts In-Stock

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Continental Prestige Electronics

USA . 5,450 parts In-Stock

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Argo Parts USA

USA . 4,236 parts In-Stock

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Perfect Parts

USA . 3,149 parts In-Stock

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Corphita

USA . 2,476 parts In-Stock

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Microchip USA

USA . 1,259 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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$30.243

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Bastille Electronics

Australia . 88 parts In-Stock

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Overview

Enhance your electronic designs with the TUSB2077APTRG4 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology and reliable products. This bus controller offers seamless connectivity and high-speed data transfer rates of up to 12 MBps, making it ideal for a wide range of applications. With a compact square package style and low profile design, this versatile component is perfect for space-constrained projects. Trust in Texas Instruments to deliver quality and performance with the TUSB2077APTRG4, providing you with exceptional value and unmatched reliability for all your USB interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for portable devices.

Surface Mount: YES

This feature allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle power surges without risk of damage.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board.

Power Supplies (V): 3.3

This specific power supply voltage ensures compatibility with a wide range of devices.

No. of Terminals: 48

The large number of terminals allows for connectivity to multiple components, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a sleek design and precise alignment on the circuit board.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures optimal performance even in low power situations.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand heat without issues.

Maximum Data Transfer Rate: 12 MBps

The high data transfer rate allows for fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections to other components.

Maximum Seated Height: 1.6 mm

The low seated height makes this product suitable for slim and compact devices.

Width: 7 mm

The narrow width saves space on the circuit board, making it suitable for small devices.

Maximum Clock Frequency: 48 MHz

The high clock frequency enables fast data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

This allows for quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure and durable solder joints.

Length: 7 mm

The short length makes this product suitable for compact designs and saving space on the circuit board.

Temperature Grade: COMMERCIAL

This temperature grade indicates that the product is suitable for standard commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

This peripheral IC type enables the product to work with a wide range of devices and systems.

Technology: CMOS

CMOS technology offers low power consumption and high reliability for continuous operation.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and stable connection during use.

Maximum Supply Current: 40 mA

With a high maximum supply current, this product can meet the power demands of various components.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures consistent and stable power delivery for optimal performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for precise and compact connections on the circuit board.

Moisture Sensitivity Level (MSL): 3

This MSL level indicates that the product is resistant to moisture, preventing damage in humid environments.

Technical Specifications

Bus Controllers TUSB2077APTRG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

12 MBps

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TUSB2077APTRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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