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USB5744T-I/2GTA

Microchip Technology

USB5744T-I/2GTA by Microchip Technology

USB5744T-I/2GTA by Microchip is a BUS CONTROLLER with 56 terminals, operating at -40 to 85 °C. It supports I2C, SMBUS, SPI, USB buses with a data rate of 625 MBps. Ideal for industrial applications requiring low voltage (1.08-1.32 V) and compact size (7x7 mm).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,522 parts In-Stock

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7,522

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Semicontronic

India . 843 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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843

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 757 parts In-Stock

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$8.465

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757

$8.465

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Ampacity Inc.

Singapore . 1,021 parts In-Stock

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$22.000

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1,021

$22.000

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Advanced Electronics

New Zealand . 75 parts In-Stock

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$59.361

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$56.393

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$56.393

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75

$59.361

$56.393

$56.393

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Corohmni

South Africa . 905 parts In-Stock

1+ parts

$60.299

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905

$60.299

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Aztec Data Supply Inc.

USA . 856 parts In-Stock

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$66.870

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856

$66.870

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Microchip USA

USA . 6,904 parts In-Stock

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Continental Prestige Electronics

USA . 3,249 parts In-Stock

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Argo Parts USA

USA . 1,377 parts In-Stock

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1,377

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Fulton Briggs Corp.

USA . 685 parts In-Stock

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685

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Experience seamless and reliable data transfer with the USB5744T-I/2GTA from Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and performance in their bus controllers. Perfect for various applications, this product offers unmatched value and benefits to customers looking for a fast and efficient solution. Say goodbye to slow data transfer speeds and hello to a new level of productivity with the USB5744T-I/2GTA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making the product suitable for various environments and conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power input requirements, accommodating a wider range of power sources.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, meeting industry standards for performance and durability.

No. of Terminals: 56

Having 56 terminals provides ample connection options for interfacing with other components, allowing for versatile integration capabilities.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate enables fast and efficient communication, making the product suitable for high-speed applications that require quick data exchange.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the product can function in harsh environments with extreme temperatures, increasing its suitability for a variety of applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates that the product is designed to withstand rugged industrial environments, ensuring reliability and longevity in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the product.

Bus Compatibility: I2C; SMBUS; SPI; USB

Support for multiple bus protocols enables versatile connectivity options, allowing the product to be used in various systems that utilize different communication interfaces.

Technical Specifications

Bus Controllers USB5744T-I/2GTA attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V; IT HAS CRYSTAL FREQ OF 25MHZ NOM

Address Bus Width:

0

Bus Compatibility:

I2C; SMBUS; SPI; USB

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N56

Length:

7 mm

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

USB5744T-I/2GTA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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