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FT232HPQ-REEL

FTDI

FT232HPQ-REEL by FTDI

FTDI's FT232HPQ-REEL is a bus controller with 40 MBps data transfer rate, compatible with I2C, SPI, UART, and USB. Operating temperature ranges from -40 to 85 °C, with a supply voltage of 1.08-1.32 V. Ideal for applications requiring high-speed communication in compact spaces.

Median Price

$15,720.000

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$15,720.000

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37

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Vyrian

USA . 5,574 parts In-Stock

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5,574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,482 parts In-Stock

1+ parts

$4.280

100+ parts

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10k+ parts

$4.194

3,482

$4.280

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$4.194

Argo Parts USA

USA . 531 parts In-Stock

1+ parts

$4.280

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531

$4.280

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AZTECH Wire

Italy . 598 parts In-Stock

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$6.104

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598

$6.104

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Corohmni

South Africa . 19 parts In-Stock

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$26.272

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19

$26.272

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$29.059

100+ parts

$27.606

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$27.606

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900

$29.059

$27.606

$27.606

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Aztec Data Supply Inc.

USA . 2,343 parts In-Stock

1+ parts

$84.290

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2,343

$84.290

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Netroflash

USA . 500 parts In-Stock

1+ parts

$15,720.000

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1k+ parts

$14,934.000

10k+ parts

$14,619.600

500

$15,720.000

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$14,934.000

$14,619.600

Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your electronic designs with the FT232HPQ-REEL by FTDI, a top-tier manufacturer known for providing high-quality bus controllers. This versatile chip carrier offers seamless integration into various applications such as I2C, SPI, UART, and USB compatibility, enabling fast and reliable data transfer rates of up to 40 MBps. With its compact square shape and slim profile, this innovative product is the perfect solution for all your connectivity needs. Experience unparalleled performance and exceptional value with the FT232HPQ-REEL - the ultimate choice for cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving time and space in the design.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage provides flexibility in power supply options and ensures compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting on the circuit board, simplifying the assembly process.

No. of Terminals: 56

Having 56 terminals allows for versatile connectivity options and compatibility with various input and output devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The combination of chip carrier, heat sink/slug, thin profile, and shrink pitch design enhances thermal management, reduces overall size, and improves signal integrity.

Minimum Supply Voltage: 1.08 V

A low minimum supply voltage ensures efficient power consumption and compatibility with low-power devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the bus controller can function reliably in challenging environments without overheating.

Maximum Data Transfer Rate: 40 MBps

A fast data transfer rate of 40 MBps enables quick and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures the bus controller can function in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position enables easy connection to other components, simplifying the installation and maintenance process.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm contributes to a compact design and efficient use of space within the system.

Width: 8 mm

The slim width of 8 mm allows for easy integration into tight spaces and compact electronic devices.

Length: 8 mm

The short length of 8 mm further enhances the overall compactness and versatility of the bus controller.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a bus controller for universal serial bus (USB), this product offers compatibility with a widely used standard for data transfer and device connectivity.

Technology: CMOS

Complementary metal–oxide–semiconductor (CMOS) technology provides energy efficiency and reliable performance for the bus controller.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and improves the durability of the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V offers a stable and efficient power supply for the bus controller, ensuring consistent performance.

Bus Compatibility: I2C; SPI; UART; USB

Support for various bus protocols such as I2C, SPI, UART, and USB enables versatile connectivity and communication with a wide range of devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for precise and secure connections, enhancing the reliability and performance of the bus controller.

Technical Specifications

Bus Controllers FT232HPQ-REEL attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Data Transfer Rate:

40 MBps

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

FT232HPQ-REEL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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