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CYPD6125-40LQXIT

Infineon Technologies

CYPD6125-40LQXIT by Infineon Technologies

CYPD6125-40LQXIT by Infineon Technologies is a 40-terminal bus controller with a max clock frequency of 48 MHz. It operates in industrial temperature range and supports I2C, SPI, and UART buses. This chip carrier package with a very thin profile is suitable for various USB peripheral applications.

Median Price

$4.995

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,492 parts In-Stock

1+ parts

$6.110

100+ parts

$4.150

1k+ parts

-

10k+ parts

-

2,492

$6.110

$4.150

-

-

Mouser Electronics

USA . 1,385 parts In-Stock

1+ parts

$6.130

100+ parts

$3.960

1k+ parts

$3.570

10k+ parts

$3.460

1,385

$6.130

$3.960

$3.570

$3.460

DigiKey

USA . 737 parts In-Stock

1+ parts

$7.480

100+ parts

$4.824

1k+ parts

$4.345

10k+ parts

-

737

$7.480

$4.824

$4.345

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

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3,000

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-

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Arrow

USA . 2,500 parts In-Stock

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$3.074

2,500

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-

$3.074

Verical

USA . 2,492 parts In-Stock

1+ parts

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2,492

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Farnell

UK . 50 parts In-Stock

1+ parts

-

100+ parts

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$2.880

50

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-

$2.880

Newark

USA . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$3.880

50

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-

$3.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 681 parts In-Stock

1+ parts

$3.848

100+ parts

-

1k+ parts

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681

$3.848

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-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$5.055

100+ parts

-

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150

$5.055

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IBS Electronics

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$4.979

45,000

-

-

-

$4.979

Cyclops Electronics Ltd

UK . 17,348 parts In-Stock

1+ parts

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17,348

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 1,950 parts In-Stock

1+ parts

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1,950

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Conversion2

USA . 1,349 parts In-Stock

1+ parts

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1,349

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Avant Electronics Limited

UK . 239 parts In-Stock

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239

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 508 parts In-Stock

1+ parts

$3.645

100+ parts

-

1k+ parts

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10k+ parts

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508

$3.645

-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$4.954

100+ parts

-

1k+ parts

$4.756

10k+ parts

-

100

$4.954

-

$4.756

-

Continental Prestige Electronics

USA . 1,995 parts In-Stock

1+ parts

$5.055

100+ parts

-

1k+ parts

-

10k+ parts

$4.954

1,995

$5.055

-

-

$4.954

Ampacity Inc.

Singapore . 1,808 parts In-Stock

1+ parts

$5.690

100+ parts

-

1k+ parts

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10k+ parts

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1,808

$5.690

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Modulus Dynamics

Lithuania . 974 parts In-Stock

1+ parts

$19.575

100+ parts

$18.792

1k+ parts

$18.009

10k+ parts

-

974

$19.575

$18.792

$18.009

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Microchip USA

USA . 4,093 parts In-Stock

1+ parts

$31.668

100+ parts

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4,093

$31.668

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Corohmni

South Africa . 2,397 parts In-Stock

1+ parts

$63.539

100+ parts

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2,397

$63.539

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QUARKTWIN TECHNOLOGY LTD

USA . 25,365 parts In-Stock

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RC Electronics

USA . 15,000 parts In-Stock

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Argo Parts USA

USA . 2,920 parts In-Stock

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2,920

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Infinite Electronics LLP (Excess)

. 420 parts In-Stock

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420

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Overview

Unlock endless possibilities with the CYPD6125-40LQXIT by Infineon Technologies. As a leading manufacturer in the industry, this bus controller offers unparalleled quality and reliability. Ideal for applications requiring I2C, SPI, and UART bus compatibility, this versatile chip carrier provides seamless data transfer at a maximum rate of 0.125 MBps. With a wide operating temperature range and low supply voltage requirements, customers can trust in the durability and efficiency of this product. Discover the value and benefits that the CYPD6125-40LQXIT brings to your projects today.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on PCBs, saving space and reducing overall product size.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this bus controller can handle a wide range of power inputs, increasing its versatility.

Package Shape: SQUARE

The square package shape enables efficient placement on the PCB, optimizing board space and layout design.

No. of Terminals: 40

With a high number of terminals, this bus controller can support complex networking tasks and connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and a low profile, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this bus controller can withstand extreme heat conditions, ensuring reliability in various environments.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate enables fast and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the bus controller to function reliably in cold environments.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, minimizing the risk of disconnection or signal loss.

Maximum Seated Height: 0.6 mm

The low maximum seated height allows for a slim and compact design, ideal for space-constrained applications.

Width: 6 mm

The narrow width of the bus controller enables easy integration into tight spaces on the PCB.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency enables fast signal processing, improving overall system performance.

Length: 6 mm

The short length of the bus controller contributes to a compact design, suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

This versatile bus controller supports multiple bus interfaces, providing compatibility with a wide range of devices.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the bus controller energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and enhances the overall reliability of the connection.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and consistent power delivery, enhancing the bus controller's performance.

Bus Compatibility: I2C; SPI; UART

The bus controller is compatible with multiple bus protocols, expanding its versatility and applicability.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density PCB layouts, maximizing connectivity options in a compact space.

Technical Specifications

Bus Controllers CYPD6125-40LQXIT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

.125 MBps

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.75 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

CYPD6125-40LQXIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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