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CYPD2104-20FNXIT

Infineon Technologies

CYPD2104-20FNXIT by Infineon Technologies

CYPD2104-20FNXIT by Infineon is a BUS CONTROLLER IC with 20 terminals, operating at 48 MHz clock frequency. It supports I2C, SPI, UART, and USB buses with data transfer rate of 0.125 MBps. This CMOS technology chip has a supply voltage range of 2.7V to 5.5V and is ideal for applications requiring high-speed communication in compact devices.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 135 parts In-Stock

1+ parts

$0.580

100+ parts

$0.321

1k+ parts

-

10k+ parts

-

135

$0.580

$0.321

-

-

Arrow

USA . 926 parts In-Stock

1+ parts

$0.728

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$0.728

-

-

-

Chip1Stop

Japan . 926 parts In-Stock

1+ parts

$1.111

100+ parts

$0.923

1k+ parts

$0.904

10k+ parts

-

926

$1.111

$0.923

$0.904

-

Rochester

USA . 3,170 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

$0.880

10k+ parts

$0.784

3,170

-

$1.060

$0.880

$0.784

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.100

10k+ parts

$0.981

2,000

-

-

$1.100

$0.981

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 811 parts In-Stock

1+ parts

$0.551

100+ parts

-

1k+ parts

-

10k+ parts

-

811

$0.551

-

-

-

Vyrian

USA . 640 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

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640

$0.580

-

-

-

Flip Electronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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24,000

-

-

-

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Sunrise Surplus Inc.

USA . 2,050 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,050

-

-

-

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SPM Sales

USA . 1,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,984

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,333 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,333

$0.493

-

-

-

Corphita

USA . 990 parts In-Stock

1+ parts

$0.522

100+ parts

-

1k+ parts

-

10k+ parts

-

990

$0.522

-

-

-

Modulus Dynamics

Lithuania . 2,038 parts In-Stock

1+ parts

$0.780

100+ parts

$0.749

1k+ parts

$0.718

10k+ parts

-

2,038

$0.780

$0.749

$0.718

-

Corohmni

South Africa . 604 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$0.780

-

-

-

RC Electronics

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$0.600

1k+ parts

$0.560

10k+ parts

$0.550

36,000

-

$0.600

$0.560

$0.550

A-Z Elektronik GmbH

Germany . 5,633 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,633

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-

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Alle Elektronik GmbH

Germany . 3,755 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,755

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

-

Overview

Unlock seamless connectivity with the CYPD2104-20FNXIT by Infineon Technologies. Crafted with precision and expertise, this bus controller offers unparalleled reliability and performance. Ideal for a wide range of applications, this versatile component ensures smooth data transfer and efficient operation. Elevate your projects with the quality and innovation Infineon is known for, and experience the value and benefits this product brings to your designs. Trust in Infineon to deliver cutting-edge solutions that meet your every need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus controller, ensuring a longer product lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it compatible with various systems and applications.

Package Shape: RECTANGULAR

Saves space on the PCB and allows for efficient placement of the bus controller in a compact design.

Maximum Data Transfer Rate: 0.125 MBps

Enables high-speed data transfer, improving the overall performance of the bus controller in data-heavy applications.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, making it an energy-efficient and reliable choice.

Bus Compatibility: I2C, SPI, UART, USB

Supports multiple bus protocols, allowing for versatile connectivity options in a variety of devices and systems.

Technical Specifications

Bus Controllers CYPD2104-20FNXIT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, SPI, UART, USB

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

2.03 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.63 mm

Trade Compliance

CYPD2104-20FNXIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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