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FT231XS-T

FTDI

FT231XS-T by FTDI

FT231XS-T by FTDI is a small outline, shrink pitch bus controller with UART and USB compatibility. It operates at 2.97-5.5V, supports up to 12.02MHz clock frequency, and has a dual terminal position for various applications in electronics design.

Median Price

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1

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< 1k

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Nova Conductors

Japan . 900 parts In-Stock

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900

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AZTECH Wire

Italy . 889 parts In-Stock

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$8.357

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889

$8.357

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Aztec Data Supply Inc.

USA . 4,953 parts In-Stock

1+ parts

$43.920

100+ parts

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4,953

$43.920

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Continental Prestige Electronics

USA . 4,034 parts In-Stock

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4,034

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Argo Parts USA

USA . 3,550 parts In-Stock

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3,550

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

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100+ parts

$0.388

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$0.388

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$0.388

150

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$0.388

$0.388

$0.388

Bastille Electronics

Australia . 50 parts In-Stock

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100+ parts

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50

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Overview

Experience seamless connectivity and reliable performance with the FT231XS-T by FTDI. As a leader in bus controllers, FTDI ensures top-notch quality and innovation in every product. This versatile device is perfect for a wide range of applications, providing customers with unparalleled value and benefits. Say goodbye to connectivity issues and hello to smooth operations with the FT231XS-T – your ultimate solution for efficient data transfer and communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight design, making it a practical choice for various applications.

Surface Mount: YES

With surface mount capability, this bus controller can easily be integrated into compact electronic devices, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance of 5.5 V provides flexibility and reliability in powering the bus controller in different operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized form factor, allowing for easy integration and compatibility with existing designs.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components, enhancing the versatility of the bus controller.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers a compact footprint, ideal for space-constrained applications.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage requirement of 2.97 V ensures efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this bus controller can function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the bus controller to operate in cold environments without any issues.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved connectivity, ensuring stable and reliable communication within the system.

Maximum Seated Height: 1.7526 mm

The low maximum seated height makes this bus controller suitable for applications where space is limited, without compromising performance.

Width: 3.9116 mm

The narrow width of 3.9116 mm enables the bus controller to fit comfortably within compact electronic devices, optimizing space utilization.

Maximum Clock Frequency: 12.02 MHz

The high maximum clock frequency of 12.02 MHz allows for fast and efficient data processing, making the bus controller ideal for high-speed applications.

Length: 8.6614 mm

The moderate length of 8.6614 mm strikes a balance between compactness and functionality, making it a versatile choice for various designs.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

With peripheral IC type supporting bus controller and USB functionality, this product offers comprehensive and standardized communication capabilities.

Technology: CMOS

The CMOS technology used in this bus controller ensures low power consumption and high noise immunity, resulting in reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability during PCB assembly and operation, enhancing the longevity of the bus controller.

Maximum Supply Current: 8.4 mA

The low maximum supply current requirement of 8.4 mA minimizes power consumption, making this bus controller energy-efficient and cost-effective.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5 V ensures compatibility with a wide range of voltage sources, simplifying integration into various systems.

Bus Compatibility: UART; USB

With compatibility for UART and USB buses, this bus controller offers versatile connectivity options for seamless integration into different communication systems.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm allows for precise and secure connections, enhancing the reliability of the bus controller in demanding applications.

Technical Specifications

Bus Controllers FT231XS-T attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

UART; USB

Maximum Clock Frequency:

12.02 MHz

JESD-30 Code:

R-PDSO-G20

Length:

8.6614 mm

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

1.7526 mm

Maximum Supply Current:

8.4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9116 mm

Trade Compliance

FT231XS-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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