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PCA9540BDP-T

NXP Semiconductors

PCA9540BDP-T by NXP Semiconductors

NXP Semiconductors' PCA9540BDP-T is a bus controller with 8 terminals, operating at -40 to 85°C. It has dual terminal positions and supports power supplies of 2.5/5V. Ideal for industrial applications, this device comes in a small outline package for surface mounting.

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Digiode

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Lantek

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Vyrian

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Nova Conductors

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Prism Electronics

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AZTECH Wire

Italy . 509 parts In-Stock

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Ampacity Inc.

Singapore . 832 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

USA . 4,598 parts In-Stock

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Corohmni

South Africa . 2,545 parts In-Stock

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Continental Prestige Electronics

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GreenTree Electronics

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Argo Parts USA

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Overview

Unlock the power of efficient bus control with the NXP Semiconductors PCA9540BDP-T. Known for its high-quality manufacturing, NXP Semiconductors delivers a reliable solution for your connectivity needs. This Bus Controller offers seamless integration, providing customers with enhanced flexibility and scalability in various applications. Experience the value and benefits of this product as it simplifies complex systems and optimizes performance, making it a must-have for any project requiring precise control and management of multiple buses.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and resistance, making it a suitable choice for various environments.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, ideal for space-constrained applications.

Power Supplies (V): 2.5/5

Compatible with a range of power sources, offering flexibility in system integration.

No. of Terminals: 8

Sufficient terminals for connecting multiple components, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design saves space, while the shrink pitch enhances performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments with demanding conditions.

Minimum Operating Temperature: -40 °C

Ensures operation even in extremely low temperatures, providing reliability in varied climates.

Terminal Position: DUAL

Dual terminal position allows for versatile installation options, accommodating different design layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh conditions.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Maximum Supply Current: 0.1 mA

Low maximum supply current consumption, aiding in energy efficiency and reducing power costs.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting on PCBs, enabling compact system designs.

Technical Specifications

Bus Controllers PCA9540BDP-T attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Maximum Supply Current:

.1 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

PCA9540BDP-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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