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SL811HST-AXC

Infineon Technologies

SL811HST-AXC by Infineon Technologies

SL811HST-AXC by Infineon: 3.3V power supply, 48MHz clock frequency, 1.5MBps data rate. Ideal for USB bus controllers in commercial applications like ISA and PCMCIA due to its compact size and high-speed performance.

Median Price

$15.700

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Chip1Stop

Japan . 7 parts In-Stock

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$15.700

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Digiode

USA . 706 parts In-Stock

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$14.915

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$14.915

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Nova Conductors

Japan . 500 parts In-Stock

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$15.650

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Component Electronics Inc.

Canada . 144 parts In-Stock

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$24.620

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$18.460

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$16.000

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Maritex

Poland . 285 parts In-Stock

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$34.629

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Chip Stock

USA . 2,800 parts In-Stock

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Martec Srl

Italy . 1,041 parts In-Stock

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Avant Electronics Limited

UK . 911 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Bristol Electronics

USA . 50 parts In-Stock

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Standard Data Resources

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SPM Sales

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ACDS - Activité Composants Distribution Service

France . 13 parts In-Stock

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J2 Sourcing AB

Sweden . 12 parts In-Stock

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Vyrian

USA . 7 parts In-Stock

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Rebound Electronics

UK . 6 parts In-Stock

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Carlin Systems, Inc.

USA . 5 parts In-Stock

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PC Components Company LLC

USA . 3 parts In-Stock

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AZTECH Wire

Italy . 647 parts In-Stock

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$13.267

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647

$13.267

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$13.340

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7

$13.340

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Semicontronic

India . 7 parts In-Stock

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$13.340

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$13.006

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$12.940

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7

$13.340

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Corphita

USA . 215 parts In-Stock

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$14.130

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Continental Prestige Electronics

USA . 473 parts In-Stock

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$15.650

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$15.337

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$15.337

Aztec Data Supply Inc.

USA . 623 parts In-Stock

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$18.097

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Corohmni

South Africa . 2,447 parts In-Stock

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$29.385

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Modulus Dynamics

Lithuania . 3,780 parts In-Stock

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$34.969

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$33.570

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$32.171

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Assy Fe

Spain . 55,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,281 parts In-Stock

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Perfect Parts

USA . 7,840 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,418 parts In-Stock

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RC Electronics

USA . 1,389 parts In-Stock

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$15.960

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$14.570

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$14.130

1,389

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$14.570

$14.130

Authorized Procurement Solutions

USA . 749 parts In-Stock

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GreenTree Electronics

Israel . 749 parts In-Stock

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Kepictronics

USA . 462 parts In-Stock

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Microchip USA

USA . 382 parts In-Stock

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iodParts Technologies Inc.

India . 157 parts In-Stock

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Advanced Electronics

New Zealand . 90 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the SL811HST-AXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bus controllers like no other. This versatile product opens up a world of possibilities for applications in various fields. From enhanced data transfer rates to reliable performance, the SL811HST-AXC offers unmatched value and benefits. Experience the convenience and efficiency it brings to your projects today. Elevate your technology game with this exceptional solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and quick assembly on circuit boards.

Maximum Supply Voltage: 3.45 V

The high maximum supply voltage provides flexibility in a variety of applications.

Address Bus Width: 8

With an 8-bit address bus width, this product can handle a large amount of addressable memory space.

Maximum Data Transfer Rate: 1.5 MBps

The high data transfer rate allows for efficient and quick communication between devices.

Maximum Clock Frequency: 48 MHz

The high clock frequency enables fast data processing and communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Bus Compatibility: ISA; PCMCIA

Support for multiple bus types ensures the product can be used in various systems and devices.

Technical Specifications

Bus Controllers SL811HST-AXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

8

Bus Compatibility:

ISA; PCMCIA

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

1.5 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

SL811HST-AXC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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