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USB5734/MR

Microchip Technology

USB5734/MR by Microchip Technology

Microchip USB5734/MR is a 64-terminal bus controller with max clock freq of 25 MHz. It supports I2C, SMBUS, SPI, UART & USB buses at 625 MBps data rate. Ideal for commercial applications requiring low power consumption and high-speed data transfer in compact designs.

Median Price

$5.810

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,119 parts In-Stock

1+ parts

$5.810

100+ parts

$4.675

1k+ parts

-

10k+ parts

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2,119

$5.810

$4.675

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Microchip Technology

USA . 386 parts In-Stock

1+ parts

$5.810

100+ parts

$4.400

1k+ parts

$4.070

10k+ parts

$3.860

386

$5.810

$4.400

$4.070

$3.860

Mouser Electronics

USA . 298 parts In-Stock

1+ parts

$5.810

100+ parts

-

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298

$5.810

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Master Electronics

USA . 1,370 parts In-Stock

1+ parts

-

100+ parts

$7.480

1k+ parts

$5.130

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1,370

-

$7.480

$5.130

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Verical

USA . 590 parts In-Stock

1+ parts

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590

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Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$6.735

100+ parts

-

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15

$6.735

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Chip Stock

USA . 15,500 parts In-Stock

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15,500

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Vyrian

USA . 7,749 parts In-Stock

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7,749

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IBS Electronics

USA . 595 parts In-Stock

1+ parts

-

100+ parts

$10.608

1k+ parts

$7.275

10k+ parts

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595

-

$10.608

$7.275

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 153 parts In-Stock

1+ parts

$4.290

100+ parts

$4.183

1k+ parts

$4.161

10k+ parts

-

153

$4.290

$4.183

$4.161

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Continental Prestige Electronics

USA . 3,147 parts In-Stock

1+ parts

$6.735

100+ parts

-

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$6.600

3,147

$6.735

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-

$6.600

Ampacity Inc.

Singapore . 396 parts In-Stock

1+ parts

$9.340

100+ parts

-

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396

$9.340

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Corohmni

South Africa . 272 parts In-Stock

1+ parts

$15.285

100+ parts

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272

$15.285

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Microchip USA

USA . 8,783 parts In-Stock

1+ parts

$19.516

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8,783

$19.516

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Aztec Data Supply Inc.

USA . 1,001 parts In-Stock

1+ parts

$38.430

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1,001

$38.430

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$49.141

100+ parts

$46.684

1k+ parts

$46.684

10k+ parts

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500

$49.141

$46.684

$46.684

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GreenTree Electronics

Israel . 42,640 parts In-Stock

1+ parts

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42,640

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Lixinc

USA . 15,263 parts In-Stock

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15,263

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XL Components Corporation

Australia . 8,028 parts In-Stock

1+ parts

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8,028

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Argo Parts USA

USA . 4,187 parts In-Stock

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4,187

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Marpe Global Electronics

Taiwan . 1,874 parts In-Stock

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1,874

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QualityLine Systems

Poland . 304 parts In-Stock

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304

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Overview

Discover the unmatched quality and reliability of the USB5734/MR by Microchip Technology, a leading manufacturer in the industry. As a versatile Bus Controller, this product opens up endless possibilities for your applications, from I2C to USB compatibility. With a maximum data transfer rate of 625 MBps and a wide temperature range, this chip delivers high performance in any environment. Trust in Microchip Technology to provide superior products that guarantee seamless connectivity and optimal efficiency for all your projects. Elevate your technology solutions with the USB5734/MR and experience unparalleled value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.32V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape saves space on the circuit board and ensures efficient use of available area.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options gives flexibility in designing and integrating the product into different systems.

No. of Terminals: 64

The large number of terminals allows for connectivity with various other components, enhancing the functionality of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer versatility in installation and thermal management, catering to different application requirements.

Minimum Supply Voltage: 1.08V

The low minimum supply voltage ensures efficient power consumption and operation even in low-power scenarios.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate allows for fast and efficient communication between the bus controller and connected devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in various temperature conditions without issues.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability, ensuring secure connections between the bus controller and the circuit board.

Terminal Position: QUAD

The quad terminal position allows for easy and secure installation of the product on the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact and space-saving design of the overall system.

Width: 9 mm

The compact width of the product enables easy integration into various devices and systems.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency ensures smooth and efficient data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 40

The short time required at the peak reflow temperature ensures quick and reliable assembly of the product onto the circuit board.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering and bonding of the product during assembly.

Length: 9 mm

The compact length of the product contributes to space-saving and efficient use of available area on the circuit board.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications with normal temperature ranges.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The inclusion of a universal serial bus peripheral IC type enhances the connectivity and compatibility of the bus controller with various devices and protocols.

Technology: CMOS

The CMOS technology used in the product ensures efficient power consumption and reliable performance in various operating conditions.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and improves thermal performance of the product.

Nominal Supply Voltage: 1.2V

The nominal supply voltage provides a stable power source for the bus controller, ensuring consistent and reliable operation.

Bus Compatibility: I2C; SMBUS; SPI; UART; USB

The compatibility with various bus protocols such as I2C, SMBUS, SPI, UART, and USB allows for versatile communication and connectivity options.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density integration of the bus controller onto the circuit board, saving space and enhancing functionality.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating ensures that the product is less sensitive to moisture, contributing to its reliability and longevity in various environments.

Technical Specifications

Bus Controllers USB5734/MR attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

USB5734/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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