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TUSB8043ARGCT

Texas Instruments

TUSB8043ARGCT by Texas Instruments

TUSB8043ARGCT by Texas Instruments is a surface mount bus controller with 64 terminals. It operates at a supply voltage range of 0.99V to 1.26V and has a max data transfer rate of 625MBps. This IC is commonly used in applications requiring universal serial bus (USB) compatibility, such as computer peripherals and consumer electronics.

Median Price

$10.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,220 parts In-Stock

1+ parts

$7.958

100+ parts

$6.488

1k+ parts

$4.325

10k+ parts

-

6,220

$7.958

$6.488

$4.325

-

DigiKey

USA . 1,080 parts In-Stock

1+ parts

$10.650

100+ parts

$7.744

1k+ parts

$6.526

10k+ parts

$6.424

1,080

$10.650

$7.744

$6.526

$6.424

Mouser Electronics

USA . 8,978 parts In-Stock

1+ parts

$12.000

100+ parts

$8.040

1k+ parts

$7.310

10k+ parts

-

8,978

$12.000

$8.040

$7.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,603 parts In-Stock

1+ parts

$7.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

$7.560

-

-

-

Vyrian

USA . 5,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,234

-

-

-

-

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,405 parts In-Stock

1+ parts

$6.760

100+ parts

-

1k+ parts

-

10k+ parts

-

5,405

$6.760

-

-

-

Corphita

USA . 1,578 parts In-Stock

1+ parts

$7.162

100+ parts

-

1k+ parts

-

10k+ parts

-

1,578

$7.162

-

-

-

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$29.518

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$29.518

-

-

-

Parana Technologies

USA . 533 parts In-Stock

1+ parts

$41.683

100+ parts

-

1k+ parts

-

10k+ parts

-

533

$41.683

-

-

-

DigiPath Technology Company

USA . 1,050 parts In-Stock

1+ parts

$45.898

100+ parts

$42.226

1k+ parts

-

10k+ parts

-

1,050

$45.898

$42.226

-

-

IDEA Electronic Components Group

UK . 2,086 parts In-Stock

1+ parts

$46.835

100+ parts

$44.493

1k+ parts

$42.152

10k+ parts

-

2,086

$46.835

$44.493

$42.152

-

ChromeModa Solutions

Germany . 547 parts In-Stock

1+ parts

$46.835

100+ parts

$38.405

1k+ parts

-

10k+ parts

-

547

$46.835

$38.405

-

-

Argo Parts USA

USA . 4,583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,583

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-

-

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Continental Prestige Electronics

USA . 134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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134

-

-

-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

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-

-

Overview

Discover the TUSB8043ARGCT, an exceptional bus controller created by Texas Instruments. Renowned for their high-quality products, Texas Instruments has once again delivered a game-changing solution that caters to a wide range of applications. With its surface mount design and impressive data transfer rate of 625 MBps, this device revolutionizes connectivity. Offering reliability and seamless integration, the TUSB8043ARGCT ensures smooth communication and efficient performance. Trust in Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Experience the value and advantages of this remarkable product today!

Feature Benefit Bullets

Surface Mount: YES

This product is surface mountable, allowing for easy integration into a variety of applications.

Maximum Supply Voltage: 1.26 V

With a high maximum supply voltage, this bus controller can handle demanding power requirements.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design for efficient circuit board layout.

No. of Terminals: 64

With 64 terminals, this bus controller offers ample connectivity options for various devices and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier package style, combined with an integrated heat sink/slug, ensures excellent heat dissipation for reliable performance under high stress conditions.

Minimum Supply Voltage: 0.99 V

With a low minimum supply voltage, this bus controller offers good power efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable operation even in harsh environmental conditions.

Maximum Data Transfer Rate: 625 MBps

With an impressive data transfer rate of 625 MBps, this bus controller can handle high-speed data transmission efficiently.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and ensures secure connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this bus controller offers convenient and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering during assembly for robust and durable connections.

Temperature Grade: COMMERCIAL

This bus controller is designed and rated for commercial temperature ranges, ensuring reliable operation in typical working conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

This product functions as a bus controller, specifically designed for Universal Serial Bus (USB) applications, making it suitable for a wide range of USB-enabled devices.

Technology: CMOS

The use of CMOS technology in this bus controller ensures low power consumption, efficient performance, and compatibility with digital systems.

Terminal Form: NO LEAD

The terminal form of this bus controller is lead-free, conforming to environmental regulations and offering a safer and more environmentally friendly solution.

Nominal Supply Voltage: 1.1 V

With a nominal supply voltage of 1.1V, this bus controller is compatible with a range of power supply configurations.

Bus Compatibility: I2C; SMBUS

This bus controller is compatible with both I2C and SMBus protocols, providing versatility and flexibility in various bus communication systems.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has a moderate level of sensitivity to moisture, requiring proper handling and storage.

Technical Specifications

Bus Controllers TUSB8043ARGCT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL SUPPLY;24 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

Address Bus Width:

0

Bus Compatibility:

I2C; SMBUS

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TUSB8043ARGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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