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TUSB8044ARGCT

Texas Instruments

TUSB8044ARGCT by Texas Instruments

TUSB8044ARGCT by Texas Instruments is a Bus Controller IC with 64 terminals, operating at temperatures from 0 to 70°C. It supports data transfer rates up to 625 MBps and has a supply voltage range of 0.99V to 1.26V. Ideal for USB applications requiring high-speed communication in commercial-grade environments.

Median Price

$11.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,822 parts In-Stock

1+ parts

$8.160

100+ parts

$6.653

1k+ parts

$4.435

10k+ parts

-

3,822

$8.160

$6.653

$4.435

-

DigiKey

USA . 74 parts In-Stock

1+ parts

$11.750

100+ parts

$7.875

1k+ parts

$7.241

10k+ parts

$7.129

74

$11.750

$7.875

$7.241

$7.129

Mouser Electronics

USA . 214 parts In-Stock

1+ parts

$12.950

100+ parts

$8.670

1k+ parts

$7.890

10k+ parts

-

214

$12.950

$8.670

$7.890

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$6.820

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$6.820

-

-

-

Digiode

USA . 2,860 parts In-Stock

1+ parts

$7.752

100+ parts

-

1k+ parts

-

10k+ parts

-

2,860

$7.752

-

-

-

Vyrian

USA . 7,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,187

-

-

-

-

Sensible Micro Corp

USA . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,375 parts In-Stock

1+ parts

$6.820

100+ parts

-

1k+ parts

-

10k+ parts

$6.684

1,375

$6.820

-

-

$6.684

Ampacity Inc.

Singapore . 1,452 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

-

10k+ parts

-

1,452

$6.940

-

-

-

Corphita

USA . 1,528 parts In-Stock

1+ parts

$7.344

100+ parts

-

1k+ parts

-

10k+ parts

-

1,528

$7.344

-

-

-

Corohmni

South Africa . 5,040 parts In-Stock

1+ parts

$59.813

100+ parts

-

1k+ parts

-

10k+ parts

-

5,040

$59.813

-

-

-

Parana Technologies

USA . 644 parts In-Stock

1+ parts

$68.056

100+ parts

-

1k+ parts

-

10k+ parts

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644

$68.056

-

-

-

IDEA Electronic Components Group

UK . 825 parts In-Stock

1+ parts

$76.467

100+ parts

$72.644

1k+ parts

$68.820

10k+ parts

-

825

$76.467

$72.644

$68.820

-

ChromeModa Solutions

Germany . 739 parts In-Stock

1+ parts

$76.467

100+ parts

$62.703

1k+ parts

-

10k+ parts

-

739

$76.467

$62.703

-

-

DigiPath Technology Company

USA . 2,345 parts In-Stock

1+ parts

-

100+ parts

$68.943

1k+ parts

-

10k+ parts

-

2,345

-

$68.943

-

-

Argo Parts USA

USA . 1,882 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,882

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-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.684

1k+ parts

$6.479

10k+ parts

$6.343

500

-

$6.684

$6.479

$6.343

Overview

Unlock the power of seamless connectivity with the TUSB8044ARGCT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This innovative bus controller is designed for a wide range of applications, providing high-speed data transfer rates of up to 625 MBps. With a compact and efficient design, this product offers customers unmatched value and performance. Say goodbye to connectivity issues and experience the benefits of easy and reliable data transmission with the TUSB8044ARGCT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 1.26 V

With a high maximum supply voltage, this bus controller can handle a wide range of power inputs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board.

No. of Terminals: 64

The large number of terminals provides ample connectivity options for various devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This unique package style offers both efficient heat dissipation and a slim profile for space-saving designs.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage ensures efficient power usage and compatibility with a range of systems.

Maximum Operating Temperature: 70 °C

This high operating temperature range allows the bus controller to function reliably in various environments.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate ensures fast and efficient communication between devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position allows for easy connections and secure attachment to the circuit board.

Maximum Seated Height: 1 mm

The low seated height design enables compact and streamlined electronic designs.

Width: 9 mm

The 9mm width makes this bus controller suitable for applications with limited space constraints.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient installation during manufacturing processes.

Peak Reflow Temperature °C: 260

This high peak reflow temperature ensures secure solder joints and reliable connections.

Length: 9 mm

The 9mm length offers a compact form factor for space-efficient designs.

Temperature Grade: COMMERCIAL

The commercial-grade temperature tolerance ensures reliable performance in standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

This bus controller is compatible with a wide range of devices and communication protocols.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and reduces manufacturing complexity.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V ensures efficient power usage and compatibility with standard power sources.

Bus Compatibility: I2C

The I2C bus compatibility allows for seamless integration with a variety of devices and systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides precise connectivity and accommodates high-density circuit board layouts.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this product is suitable for standard moisture exposure levels in typical operating environments.

Technical Specifications

Bus Controllers TUSB8044ARGCT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

3.3V SUPPLY ALSO AVAILABLE, 34 MHZ NOMINAL CRYSTAL AVAILABLE

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8044ARGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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