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TUSB3410VF

Texas Instruments

TUSB3410VF by Texas Instruments

TUSB3410VF by Texas Instruments is a 32-terminal bus controller with 3.3V power supply, supporting I2C and UART buses. It operates at temperatures from 0 to 70°C, with a max data transfer rate of 12 MBps. Ideal for applications requiring USB connectivity in commercial-grade environments.

Median Price

$9.040

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 663 parts In-Stock

1+ parts

$9.040

100+ parts

$5.930

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663

$9.040

$5.930

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$4.890

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50

$4.890

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Digiode

USA . 1,003 parts In-Stock

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$7.258

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$7.258

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Forefront Electronics and Design

USA . 8 parts In-Stock

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$15.930

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Chip Stock

USA . 7,501 parts In-Stock

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Vyrian

USA . 2,485 parts In-Stock

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Inventory MP

USA . 462 parts In-Stock

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462

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Bristol Electronics

USA . 428 parts In-Stock

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428

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Greenchips

USA . 370 parts In-Stock

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ComSIT Distribution GmbH

Germany . 209 parts In-Stock

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Prism Electronics

USA . 64 parts In-Stock

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Huijzer Components

Netherlands . 50 parts In-Stock

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Flex Direct, LLC

USA . 16 parts In-Stock

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Sensible Micro Corp

USA . 15 parts In-Stock

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Sinequanon

UK . 3 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,432 parts In-Stock

1+ parts

$4.890

100+ parts

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$4.792

2,432

$4.890

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$4.792

Netroflash

USA . 50 parts In-Stock

1+ parts

$4.890

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50

$4.890

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Ampacity Inc.

Singapore . 2,287 parts In-Stock

1+ parts

$6.490

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2,287

$6.490

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Semicontronic

India . 2,283 parts In-Stock

1+ parts

$6.490

100+ parts

$6.328

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$6.295

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$6.490

$6.328

$6.295

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Corphita

USA . 2,259 parts In-Stock

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$6.876

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$6.876

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Microchip USA

USA . 408 parts In-Stock

1+ parts

$23.320

100+ parts

$22.990

1k+ parts

$22.820

10k+ parts

$22.660

408

$23.320

$22.990

$22.820

$22.660

Corohmni

South Africa . 1,202 parts In-Stock

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$37.020

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$37.020

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Parana Technologies

USA . 2,158 parts In-Stock

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$64.804

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$64.804

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DigiPath Technology Company

USA . 1,751 parts In-Stock

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$71.358

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$71.358

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ChromeModa Solutions

Germany . 2,854 parts In-Stock

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$72.814

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$59.707

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$72.814

$59.707

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IDEA Electronic Components Group

UK . 145 parts In-Stock

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$72.814

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$69.173

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$65.533

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$72.814

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$65.533

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Kepictronics

USA . 14,141 parts In-Stock

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Lixinc

USA . 11,808 parts In-Stock

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Perfect Parts

USA . 9,888 parts In-Stock

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Argo Parts USA

USA . 3,684 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,148 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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iodParts Technologies Inc.

India . 209 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 98 parts In-Stock

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Overview

Enhance your electronic designs with the TUSB3410VF by Texas Instruments, a top-tier manufacturer known for delivering reliable and high-quality products. This versatile bus controller offers seamless integration for various applications, providing customers with efficient data transfer rates of up to 12 MBps. With a compact design, low profile package body material, and compatibility with I2C and UART buses, this product delivers exceptional value, performance, and ease of use. Upgrade your projects today with the TUSB3410VF and experience unparalleled connectivity and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Makes installation on circuit boards easier and more efficient.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply compatibility.

Package Shape: SQUARE

Enables a compact design and space-saving installation.

Power Supplies (V): 3.3

Operates at a common and reliable voltage level.

No. of Terminals: 32

Offers sufficient connectivity options for various devices and peripherals.

Maximum Data Transfer Rate: 12 MBps

Ensures fast and efficient communication between connected devices.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures for versatile applications.

Minimum Operating Temperature: 0 °C

Capable of functioning in a wide range of temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Enhances conductivity and corrosion resistance for reliable connections.

Maximum Clock Frequency: 12 MHz

Supports high-speed data processing and communication.

Maximum Seated Height: 1.6 mm

Maintains a low profile design for space-constrained installations.

Technical Specifications

Bus Controllers TUSB3410VF attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C; UART

Maximum Clock Frequency:

12 MHz

Maximum Data Transfer Rate:

12 MBps

Drive Interface Standard:

RS232; RS485

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TUSB3410VF Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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