Loading...

CYUSB2014-BZXI

Infineon Technologies

CYUSB2014-BZXI by Infineon Technologies

CYUSB2014-BZXI by Infineon is a bus controller with 32-bit external data bus width, 625 MBps data transfer rate, and 19.2 MHz clock frequency. It is ideal for industrial applications requiring USB, I2C, I2S, SPI, UART compatibility in a compact package with thin profile and fine pitch grid array design.

Median Price

$22.549

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 11 parts In-Stock

1+ parts

$20.680

100+ parts

$15.350

1k+ parts

-

10k+ parts

-

11

$20.680

$15.350

-

-

Verical

USA . 100 parts In-Stock

1+ parts

$22.549

100+ parts

$16.003

1k+ parts

$15.849

10k+ parts

-

100

$22.549

$16.003

$15.849

-

Chip1Stop

Japan . 100 parts In-Stock

1+ parts

$26.600

100+ parts

$17.400

1k+ parts

-

10k+ parts

-

100

$26.600

$17.400

-

-

Mouser Electronics

USA . 111 parts In-Stock

1+ parts

$30.950

100+ parts

$21.480

1k+ parts

$20.670

10k+ parts

-

111

$30.950

$21.480

$20.670

-

DigiKey

USA . 345 parts In-Stock

1+ parts

$35.310

100+ parts

$26.822

1k+ parts

$23.827

10k+ parts

-

345

$35.310

$26.822

$23.827

-

Flip Electronics (Authorized)

USA . 1,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

-

-

-

-

RS (Exports)

UK . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$20.884

10k+ parts

-

50

-

-

$20.884

-

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$16.200

1k+ parts

$14.490

10k+ parts

$13.640

10

-

$16.200

$14.490

$13.640

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 504 parts In-Stock

1+ parts

$11.875

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$11.875

-

-

-

Chip Stock

USA . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

628

-

-

-

-

Vyrian

USA . 197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

197

-

-

-

-

Nova Conductors

Japan . 73 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

73

-

-

-

-

Flip Electronics

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 758 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$11.250

-

-

-

Corohmni

South Africa . 4,906 parts In-Stock

1+ parts

$15.037

100+ parts

-

1k+ parts

-

10k+ parts

-

4,906

$15.037

-

-

-

Ampacity Inc.

Singapore . 649 parts In-Stock

1+ parts

$15.300

100+ parts

-

1k+ parts

-

10k+ parts

-

649

$15.300

-

-

-

Aztec Data Supply Inc.

USA . 1,228 parts In-Stock

1+ parts

$36.104

100+ parts

-

1k+ parts

-

10k+ parts

-

1,228

$36.104

-

-

-

Modulus Dynamics

Lithuania . 1,890 parts In-Stock

1+ parts

$65.845

100+ parts

$63.211

1k+ parts

$60.577

10k+ parts

-

1,890

$65.845

$63.211

$60.577

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Continental Prestige Electronics

USA . 5,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,961

-

-

-

-

Argo Parts USA

USA . 3,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,482

-

-

-

-

Futuretech Components

Singapore . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Formix International (Excess)

India . 1,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,053

-

-

-

-

RC Electronics

USA . 968 parts In-Stock

1+ parts

-

100+ parts

$21.810

1k+ parts

$19.900

10k+ parts

$19.310

968

-

$21.810

$19.900

$19.310

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Discover the power and efficiency of the CYUSB2014-BZXI by Infineon Technologies, a top-tier manufacturer known for producing high-quality bus controllers. Designed for a wide range of applications, this versatile product offers customers unmatched reliability and performance. With its cutting-edge technology and innovative features, the CYUSB2014-BZXI provides seamless data transfer at lightning-fast speeds, making it an indispensable tool for any project. Experience the difference that Infineon Technologies can make in your work with the CYUSB2014-BZXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on the circuit board.

Maximum Supply Voltage: 1.25 V

Operates efficiently within a safe voltage range, providing stability and reliability.

Address Bus Width: 2

Supports communication between multiple devices, enhancing connectivity and data transfer capabilities.

Package Shape: SQUARE

Square shape allows for efficient packing on the circuit board, maximizing space utilization.

No. of Terminals: 121

Sufficient number of terminals for connecting various components, ensuring compatibility and functionality.

Minimum Supply Voltage: 1.15 V

Provides flexibility in power supply options while maintaining operational efficiency.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, suitable for industrial environments.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate ensures fast and efficient communication between devices.

Technical Specifications

Bus Controllers CYUSB2014-BZXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

2

Bus Compatibility:

I2C, I2S, SMBUS, SPI, UART, USB

Maximum Clock Frequency:

19.2 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

CYUSB2014-BZXI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20