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TUSB7340RKMT

Texas Instruments

TUSB7340RKMT by Texas Instruments

TUSB7340RKMT by Texas Instruments is a BUS CONTROLLER IC with 100 terminals, operating at 1.045-1.155 V, supporting PCI and I2C buses. It has a data transfer rate of 625 MBps, clock frequency up to 50 MHz, and operates b/w 0-70°C. Ideal for applications requiring high-speed USB connectivity in compact designs.

Median Price

$6.790

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,008 parts In-Stock

1+ parts

$6.790

100+ parts

$6.650

1k+ parts

$6.520

10k+ parts

-

3,008

$6.790

$6.650

$6.520

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$8.955

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$8.955

-

-

-

Vyrian

USA . 8,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,839

-

-

-

-

Digiode

USA . 3,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,307

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,518 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,518

$7.000

-

-

-

Continental Prestige Electronics

USA . 5,577 parts In-Stock

1+ parts

$8.955

100+ parts

-

1k+ parts

-

10k+ parts

$8.776

5,577

$8.955

-

-

$8.776

AZTECH Wire

Italy . 277 parts In-Stock

1+ parts

$13.262

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$13.262

-

-

-

One Stop Electronics

USA . 1,146 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$25.000

-

-

-

Corohmni

South Africa . 968 parts In-Stock

1+ parts

$36.233

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$36.233

-

-

-

Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$61.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$61.312

-

-

-

ChromeModa Solutions

Germany . 1,984 parts In-Stock

1+ parts

$68.890

100+ parts

$56.490

1k+ parts

-

10k+ parts

-

1,984

$68.890

$56.490

-

-

IDEA Electronic Components Group

UK . 866 parts In-Stock

1+ parts

$68.890

100+ parts

$65.446

1k+ parts

$62.001

10k+ parts

-

866

$68.890

$65.446

$62.001

-

A-Z Elektronik GmbH

Germany . 7,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,082

-

-

-

-

Perfect Parts

USA . 3,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,039

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$8.776

1k+ parts

$8.508

10k+ parts

$8.329

2,000

-

$8.776

$8.508

$8.329

Argo Parts USA

USA . 1,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,968

-

-

-

-

Corphita

USA . 703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

703

-

-

-

-

DigiPath Technology Company

USA . 647 parts In-Stock

1+ parts

-

100+ parts

$62.111

1k+ parts

-

10k+ parts

-

647

-

$62.111

-

-

Overview

Elevate your connectivity experience with the TUSB7340RKMT from Texas Instruments, a leading manufacturer known for delivering top-quality products. As a versatile bus controller, this device offers seamless integration and high-speed data transfer rates of up to 625 MBps, making it ideal for a wide range of applications. With its advanced technology and reliable performance, this chip carrier with a very thin profile brings value and efficiency to your projects. Upgrade to the TUSB7340RKMT and unlock a world of possibilities in communication and data management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps in reducing the overall weight of the product, making it a good choice for portable or compact devices.

Surface Mount: YES

This feature allows for easy and efficient installation on PCBs, saving time and effort during assembly processes.

Maximum Supply Voltage: 1.155 V

The low supply voltage helps in saving power and reducing heat dissipation, making it suitable for energy-efficient applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, making it a good choice for densely packed electronic designs.

Power Supplies (V): 1.1,3.3

The multiple power supply options provide flexibility in design and compatibility with different systems, making it versatile for various applications.

No. of Terminals: 100

The high number of terminals allows for connecting multiple components, enhancing connectivity and functionality in complex systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer different heat dissipation and size options, making it suitable for a wide range of design requirements.

Minimum Supply Voltage: 1.045 V

The low minimum supply voltage ensures stable operation even under low power conditions, enhancing reliability in power-sensitive applications.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures the product can withstand harsh environmental conditions, making it suitable for industrial or automotive applications.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate allows for fast and efficient communication between devices, making it ideal for high-speed data processing applications.

Technical Specifications

Bus Controllers TUSB7340RKMT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

PCI; I2C

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N100

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC100(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB7340RKMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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