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ISP1181ABS

NXP Semiconductors

ISP1181ABS by NXP Semiconductors

NXP Semiconductors' ISP1181ABS is a BUS CONTROLLER with 48 terminals, operating at 3-3.6V, supporting USB technology with data rate up to 11.1 MBps. Ideal for H8S/2357 and 8051 buses, it has a compact square shape and operates in industrial temperatures from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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J2 Sourcing AB

Sweden . 8,000 parts In-Stock

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Digiode

USA . 3,143 parts In-Stock

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Vyrian

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Anansix

USA . 2,315 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Bristol Electronics

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Ampacity Inc.

Singapore . 592 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 3,236 parts In-Stock

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Modulus Dynamics

Lithuania . 2,256 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

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Perfect Parts

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Corphita

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Overview

Unlock seamless connectivity with the NXP Semiconductors ISP1181ABS Bus Controller. Manufactured with precision and expertise, this versatile chip offers a wide range of applications in various industries. From industrial automation to consumer electronics, this innovative product delivers superior performance and reliability. Experience blazing-fast data transfer rates and effortless integration with a compact design that maximizes efficiency. Elevate your projects with the ISP1181ABS and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and enabling high-density designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance ensures compatibility with various power sources and provides flexibility in different operating conditions.

Package Shape: SQUARE

The square package shape simplifies the design and layout of the circuit board, making it easier to integrate the bus controller into different systems.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) allows for compatibility with a wide range of systems and devices, enhancing versatility.

No. of Terminals: 48

Having a high number of terminals (48) offers extensive connectivity options for interfacing with other components and peripherals, making it suitable for complex applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation, space-saving design, and compatibility with different mounting options.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures that the bus controller can operate in energy-efficient devices and under low-power conditions, enhancing overall system efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the bus controller to withstand harsh environmental conditions and operate reliably in industrial settings.

Maximum Data Transfer Rate: 11.1 MBps

The high maximum data transfer rate of 11.1 MBps enables fast and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the bus controller to function reliably in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection and long-term performance.

Terminal Position: QUAD

The quad terminal position offers increased stability and mechanical strength, reducing the risk of connection failures and ensuring robust performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact and slim device designs, ideal for space-constrained applications.

Width: 7 mm

The compact width of 7mm makes the bus controller suitable for integration into small form factor devices and PCB layouts.

External Data Bus Width: 16

The wide external data bus width of 16 bits enables fast data processing and communication, enhancing system performance and throughput.

Maximum Clock Frequency: 6 MHz

The high maximum clock frequency of 6 MHz allows for rapid data processing and execution of instructions, improving overall system efficiency.

Length: 7 mm

The compact length of 7mm ensures the bus controller can fit into tight spaces and compact designs, making it versatile for various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the bus controller suitable for industrial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus controller, the peripheral IC type ensures compatibility with a wide range of devices and systems, making it a versatile choice for numerous applications.

Technology: CMOS

The use of CMOS technology provides low power consumption, high noise immunity, and fast operation, making the bus controller efficient and reliable in various applications.

Terminal Form: NO LEAD

The no-lead terminal form offers better mechanical strength and reliability compared to traditional leaded terminals, ensuring long-term performance and durability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable and reliable power to the bus controller, ensuring consistent performance and compatibility with standard voltage levels.

Bus Compatibility: H8S/2357; 8051

With compatibility for H8S/2357 and 8051 bus architectures, the bus controller can seamlessly integrate into existing systems and devices, providing flexibility and ease of implementation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact PCB layouts, making the bus controller suitable for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the bus controller can withstand moderate exposure to moisture during handling and assembly processes, ensuring reliability in various environmental conditions.

Technical Specifications

Bus Controllers ISP1181ABS attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Additional Features:

OPERATES AT 5V SUPPLY WITH REGULATOR

Address Bus Width:

1

Bus Compatibility:

H8S/2357; 8051

Maximum Clock Frequency:

6 MHz

Maximum Data Transfer Rate:

11.1 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ISP1181ABS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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