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ISP1581BD-S

NXP Semiconductors

ISP1581BD-S by NXP Semiconductors

ISP1581BD-S by NXP Semiconductors is a Bus Controller with 8-bit Address Bus Width, 12.5 MBps Data Transfer Rate, and 12 MHz Clock Frequency. Ideal for industrial applications requiring USB connectivity, it operates b/w -40 to 85 °C with a supply voltage range of 3-3.6 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,818 parts In-Stock

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Anansix

USA . 1,868 parts In-Stock

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Vyrian

USA . 852 parts In-Stock

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852

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Ampacity Inc.

Singapore . 665 parts In-Stock

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$1.000

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665

$1.000

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One Stop Electronics

USA . 208 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 852 parts In-Stock

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$5.220

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Corohmni

South Africa . 1,971 parts In-Stock

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$29.558

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$44.436

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$43.992

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$42.214

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100

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Aztec Data Supply Inc.

USA . 1,163 parts In-Stock

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$60.770

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UNI Independent Distributors

Spain . 7,646 parts In-Stock

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Argo Parts USA

USA . 3,814 parts In-Stock

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Continental Prestige Electronics

USA . 3,787 parts In-Stock

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Corphita

USA . 897 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

The ISP1581BD-S by NXP Semiconductors is a top-of-the-line Bus Controller that offers unparalleled quality and reliability. With a maximum data transfer rate of 12.5 MBps and a maximum clock frequency of 12 MHz, this versatile component is perfect for a wide range of applications, including ATA and ATAPI compatibility. NXP Semiconductors is known for its cutting-edge technology and innovation, ensuring that customers get the best value for their investment. Experience seamless connectivity and efficient data transfer with the ISP1581BD-S, the ultimate solution for your bus control needs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and cost-effective.

Surface Mount

YES - Allows for easy installation and efficient use of PCB space.

Maximum Supply Voltage

3.6 V - Provides a wide range of power options for compatibility.

Address Bus Width

8 - Allows for efficient data transfer and processing capabilities.

Package Shape

SQUARE - Ensures a compact design for space-saving integration.

No. of Terminals

64 - Offers multiple connection points for various components.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Allows for a streamlined and efficient design layout.

Minimum Supply Voltage

3 V - Ensures low power consumption and efficiency.

Maximum Operating Temperature

85 °C - Ensures reliable performance even in high-temperature conditions.

Maximum Data Transfer Rate

12.5 MBps - Provides fast and efficient data transfer capabilities.

Minimum Operating Temperature

40 °C - Ensures reliable performance even in low-temperature conditions.

Terminal Position

QUAD - Offers convenient terminal placement for easy connections.

Maximum Seated Height

1.6 mm - Ensures a compact and low-profile design.

Width

10 mm - Compact size for space-saving integration.

External Data Bus Width

8 - Ensures efficient data transfer between devices.

Maximum Clock Frequency

12 MHz - Provides fast and accurate processing capabilities.

Maximum Time At Peak Reflow Temperature (s)

40 - Ensures proper soldering and durability during manufacturing.

Peak Reflow Temperature °C

260 - Allows for reliable soldering and durability.

Length

10 mm - Compact size for efficient use of space.

Temperature Grade

INDUSTRIAL - Suitable for use in a wide range of temperature conditions.

Peripheral IC Type

BUS CONTROLLER, UNIVERSAL SERIAL BUS - Versatile compatibility for various devices.

Technology

CMOS - Offers efficient power usage and performance capabilities.

Terminal Form

GULL WING - Provides secure and stable terminal connections.

Nominal Supply Voltage

3.3 V - Ensures stable and efficient power supply for the device.

Bus Compatibility

ATA; ATAPI - Compatible with various bus systems for versatile use.

Terminal Pitch

0.5 mm - Offers precise and efficient terminal connections.

Technical Specifications

Bus Controllers ISP1581BD-S attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY; IN BUILT 3.3V REGULATOR

Address Bus Width:

8

Bus Compatibility:

ATA; ATAPI

Maximum Clock Frequency:

12 MHz

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

ISP1581BD-S Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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