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CYUSB3314-88LTXCT

Infineon Technologies

CYUSB3314-88LTXCT by Infineon Technologies

CYUSB3314-88LTXCT by Infineon Technologies is a bus controller with 88 terminals, operating at 1.14-1.26V, supporting USB and I2C buses. It offers a data transfer rate of 625MBps, clock frequency up to 26MHz, and operates in temperatures ranging from 0 to 70°C. This chip carrier with a very thin profile is suitable for applications requiring high-speed bus control in compact electronic devices.

Median Price

$2.874

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$2.838

2,000

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$2.838

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

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$2.868

2,000

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$2.868

Verical

USA . 1,252 parts In-Stock

1+ parts

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100+ parts

$3.775

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1,252

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$3.775

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Rochester

USA . 1,252 parts In-Stock

1+ parts

-

100+ parts

$2.880

1k+ parts

$2.580

10k+ parts

$2.420

1,252

-

$2.880

$2.580

$2.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 765 parts In-Stock

1+ parts

$3.030

100+ parts

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765

$3.030

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Bristol Electronics

USA . 10,370 parts In-Stock

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10,370

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Chip Stock

USA . 4,650 parts In-Stock

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4,650

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Sensible Micro Corp

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Flip Electronics

USA . 2,399 parts In-Stock

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2,399

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Vyrian

USA . 1,038 parts In-Stock

1+ parts

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1,038

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Nova Conductors

Japan . 93 parts In-Stock

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93

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,398 parts In-Stock

1+ parts

$2.410

100+ parts

$2.350

1k+ parts

$2.338

10k+ parts

-

1,398

$2.410

$2.350

$2.338

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Ampacity Inc.

Singapore . 842 parts In-Stock

1+ parts

$2.410

100+ parts

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842

$2.410

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Corphita

USA . 850 parts In-Stock

1+ parts

$2.871

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850

$2.871

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Microchip USA

USA . 683 parts In-Stock

1+ parts

$20.480

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683

$20.480

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Corohmni

South Africa . 421 parts In-Stock

1+ parts

$71.755

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421

$71.755

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Aztec Data Supply Inc.

USA . 4,298 parts In-Stock

1+ parts

$76.670

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4,298

$76.670

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Modulus Dynamics

Lithuania . 4,542 parts In-Stock

1+ parts

$84.249

100+ parts

$80.879

1k+ parts

$77.509

10k+ parts

-

4,542

$84.249

$80.879

$77.509

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 5,013 parts In-Stock

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5,013

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,517 parts In-Stock

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4,517

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Futuretech Components

Singapore . 4,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,806 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,342 parts In-Stock

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3,342

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Argo Parts USA

USA . 2,294 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unlock the potential of your devices with the CYUSB3314-88LTXCT from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bus controllers that guarantee seamless connectivity and high-speed data transfer rates of up to 625 MBps. Whether you're looking to enhance your I2C or USB bus compatibility, this product offers unmatched reliability and performance. With a compact square package shape and easy surface mount installation, the CYUSB3314-88LTXCT is the ultimate solution for maximizing efficiency and productivity in your applications. Elevate your technology experience with this exceptional product today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and reducing production costs.

Maximum Supply Voltage: 1.26 V

A higher maximum supply voltage provides flexibility and compatibility with various power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and a compact design.

No. of Terminals: 88

Having a high number of terminals allows for multiple connections and functionality in a single package.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile provides optimal thermal management and space-saving design.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures compatibility with a wide range of power sources while maintaining efficient operation.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this bus controller can withstand harsh environments and extended use without overheating.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate allows for fast and efficient communication within the system, enhancing overall performance.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this bus controller can operate reliably even in cold environments.

Terminal Position: QUAD

The quad terminal position enables easy and reliable connections, enhancing the usability of the product.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim and compact design, ideal for space-constrained applications.

Width: 10 mm

The compact width makes this bus controller suitable for applications where board space is limited.

Length: 10 mm

The small length of the bus controller contributes to a space-saving design, especially in compact electronic devices.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus controller allows for versatile connectivity and communication with various devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and enhances the durability of the connections.

Maximum Supply Current: 526 mA

The high maximum supply current capability ensures stable power delivery to the bus controller, supporting its reliable operation.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a standard voltage level for consistent performance and compatibility.

Bus Compatibility: I2C, USB

Support for I2C and USB bus compatibility allows for seamless integration with a wide range of systems and devices.

Terminal Pitch: 0.4 mm

The small terminal pitch facilitates high-density mounting, enabling efficient use of board space and compact designs.

Technical Specifications

Bus Controllers CYUSB3314-88LTXCT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, USB

Maximum Clock Frequency:

26 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N88

Length:

10 mm

No. of Terminals:

88

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC88,.4SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Current:

526 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

CYUSB3314-88LTXCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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