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PEX8112-AA66FBIF

Broadcom

PEX8112-AA66FBIF by Broadcom

Broadcom's PEX8112-AA66FBIF is a PCI bus controller with 161 terminals in a grid array package. It operates at -40 to 85°C, supporting data rates up to 250 MBps at a max clock frequency of 66 MHz. Ideal for industrial applications requiring high-speed data transfer and reliable performance.

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Digiode

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Nova Conductors

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AZTECH Wire

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Decca Corp

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Microchip USA

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Corohmni

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Aranea Global

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Overview

Experience unparalleled performance and reliability with the PEX8112-AA66FBIF by Broadcom, a leading manufacturer in bus controllers. This powerful PCI controller offers seamless data transfer rates of up to 250 MBps, making it perfect for industrial applications that demand high-speed connectivity. With its durable plastic/epoxy package body material and innovative GRID ARRAY design, this product ensures optimal performance even in extreme temperatures. Upgrade your system today and unlock the full potential of your network with the Broadcom PEX8112-AA66FBIF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this bus controller lightweight and durable, perfect for industrial applications.

Surface Mount: YES

Being surface mountable allows for easy and secure installation onto PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package provides a standardized form factor, making it compatible with a wide range of systems and designs.

Power Supplies (V): 1.5,3.3,3.3/5

With multiple power supply options, this bus controller can be used in various voltage environments, increasing flexibility and compatibility.

No. of Terminals: 161

The high number of terminals allows for efficient connectivity to other components, reducing the need for additional connectors and simplifying the overall design.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal conductivity and electrical performance, ensuring reliability and stability during operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this bus controller can withstand harsh environmental conditions, suitable for industrial and automotive applications.

Maximum Data Transfer Rate: 250 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making this bus controller versatile and resilient.

Terminal Position: BOTTOM

The bottom terminal position allows for easier PCB layout and routing, optimizing space and improving signal integrity.

Maximum Clock Frequency: 66 MHz

Operating at a high maximum clock frequency ensures timely and synchronized data transmission, crucial for real-time applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature simplifies the manufacturing process by enabling quick and reliable soldering, ensuring robust connections.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this bus controller meets stringent temperature requirements and reliability standards, ideal for demanding applications.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed as a bus controller for PCI interfaces, providing seamless integration and compatibility with PCI-based systems.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high reliability, making this bus controller energy-efficient and dependable.

Terminal Form: BALL

The use of ball terminals enhances solder joint reliability and mechanical strength, ensuring long-term performance and durability.

Maximum Supply Current: 207 mA

With a maximum supply current of 207 mA, this bus controller operates efficiently while minimizing power consumption, suitable for battery-powered devices.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V ensures compatibility with low-voltage systems, making this bus controller versatile and widely applicable.

Terminal Pitch: 0.635 mm

The tight terminal pitch allows for high-density board designs, enabling compact and space-saving integration in crowded PCB layouts.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this bus controller can withstand exposure to moderate levels of moisture during manufacturing and assembly, ensuring product quality and reliability.

Technical Specifications

Bus Controllers PEX8112-AA66FBIF attributes and parameters. Explore more Bus Controllers devices from Broadcom

Specs

Maximum Clock Frequency:

66 MHz

Maximum Data Transfer Rate:

250 MBps

JESD-30 Code:

S-PBGA-B161

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

161

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA161,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3,3.3/5

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Maximum Supply Current:

207 mA

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

PEX8112-AA66FBIF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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