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CY7C65634-28LTXC

Infineon Technologies

CY7C65634-28LTXC by Infineon Technologies

CY7C65634-28LTXC by Infineon is a 28-terminal bus controller with a max clock frequency of 12 MHz. It operates at supply voltages ranging from 1.8V to 5.5V and is compatible with I2C buses. This CMOS technology chip carrier is ideal for applications requiring universal serial bus peripheral ICs in commercial temperature grades.

Median Price

$1.915

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1 parts In-Stock

1+ parts

$1.320

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1

$1.320

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Arrow

USA . 3,240 parts In-Stock

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$1.410

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3,240

$1.410

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Mouser Electronics

USA . 4,969 parts In-Stock

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$2.060

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$1.460

1k+ parts

$1.340

10k+ parts

$1.280

4,969

$2.060

$1.460

$1.340

$1.280

Newark

USA . 31 parts In-Stock

1+ parts

$2.860

100+ parts

$2.090

1k+ parts

$1.700

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31

$2.860

$2.090

$1.700

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Chip1Stop

Japan . 400 parts In-Stock

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$2.970

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$2.970

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DigiKey

USA . 8,393 parts In-Stock

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$3.100

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$1.891

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$1.674

10k+ parts

$1.582

8,393

$3.100

$1.891

$1.674

$1.582

Element14

Singapore . 31 parts In-Stock

1+ parts

$4.160

100+ parts

$2.920

1k+ parts

$2.090

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$2.020

31

$4.160

$2.920

$2.090

$2.020

Rochester

USA . 14,284 parts In-Stock

1+ parts

-

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$1.570

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$1.300

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$1.160

14,284

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$1.570

$1.300

$1.160

Verical

USA . 14,284 parts In-Stock

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$1.625

10k+ parts

$1.450

14,284

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$1.625

$1.450

RS (Exports)

UK . 750 parts In-Stock

1+ parts

-

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$1.770

1k+ parts

$1.410

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750

-

$1.770

$1.410

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 991 parts In-Stock

1+ parts

$0.586

100+ parts

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991

$0.586

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Chip Stock

USA . 72,800 parts In-Stock

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72,800

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Vyrian

USA . 4,772 parts In-Stock

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4,772

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Sensible Micro Corp

USA . 1,230 parts In-Stock

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Bristol Electronics

USA . 419 parts In-Stock

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419

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Cyclops Electronics Ltd

UK . 246 parts In-Stock

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246

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ComSIT Distribution GmbH

Germany . 185 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 412 parts In-Stock

1+ parts

$0.555

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412

$0.555

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Ampacity Inc.

Singapore . 4,397 parts In-Stock

1+ parts

$1.140

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4,397

$1.140

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Corohmni

South Africa . 305 parts In-Stock

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$23.961

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305

$23.961

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Aztec Data Supply Inc.

USA . 1,843 parts In-Stock

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$26.281

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1,843

$26.281

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Microchip USA

USA . 1,659 parts In-Stock

1+ parts

$32.180

100+ parts

$31.980

1k+ parts

$31.880

10k+ parts

$31.780

1,659

$32.180

$31.980

$31.880

$31.780

Modulus Dynamics

Lithuania . 1,974 parts In-Stock

1+ parts

$82.513

100+ parts

$79.212

1k+ parts

$75.912

10k+ parts

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1,974

$82.513

$79.212

$75.912

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RC Electronics

USA . 39,671 parts In-Stock

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$2.330

1k+ parts

$2.130

10k+ parts

$2.060

39,671

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$2.330

$2.130

$2.060

Lixinc

USA . 8,109 parts In-Stock

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Continental Prestige Electronics

USA . 6,180 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,883 parts In-Stock

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GreenTree Electronics

Israel . 4,900 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,854 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,922 parts In-Stock

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3,922

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Futuretech Components

Singapore . 3,410 parts In-Stock

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3,410

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Metaverse IC Inc.

Canada . 2,838 parts In-Stock

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Argo Parts USA

USA . 2,740 parts In-Stock

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Perfect Parts

USA . 2,231 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Kepictronics

USA . 89 parts In-Stock

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ChipstoGo Electronic ltd

UK . 84 parts In-Stock

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Overview

Discover the ultimate solution for seamless data transfer with the CY7C65634-28LTXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bus controllers designed for a wide range of applications. From its surface-mount capabilities to its high clock frequency, this product provides unmatched reliability and performance. Say goodbye to connectivity issues and hello to efficient operations with this advanced technology. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easier and more efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile and compatible with various power sources.

Package Shape: SQUARE

Square package shape offers better space utilization and easier placement on the PCB, optimizing the design layout.

Power Supplies (V): 3.3/5

Supports multiple power supply options, making it adaptable to different system requirements and configurations.

No. of Terminals: 28

Ample number of terminals provide ample connectivity options and interfaces for connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and thin profile packaging enhances thermal management and space-saving in the design.

Minimum Supply Voltage: 1.8 V

Supports low supply voltage operation, enabling energy-efficient performance and compatibility with different power sources.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable operation under varying temperature conditions, making it suitable for different environments.

Minimum Operating Temperature: 0 °C

Able to operate at low temperatures, ensuring functionality in cold environments or during startup conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish enhances corrosion resistance and ensures long-term reliability and performance.

Terminal Position: QUAD

Quad terminal position simplifies the connection process and allows for easier soldering and assembly onto the PCB.

Maximum Seated Height: 0.8 mm

Low seated height profile enables a compact and slim form factor, ideal for applications with limited space constraints.

Width: 5 mm

Narrow width design allows for efficient placement on the PCB, optimizing space utilization and design layout.

Maximum Clock Frequency: 12 MHz

Supports high clock frequency operation, enabling fast data processing and communication speeds in bus control applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified time, ensuring reliability during the assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering and assembly processes without compromising performance.

Length: 5 mm

Compact length profile allows for space-efficient placement on the PCB, optimizing design layout and minimizing footprint.

Temperature Grade: COMMERCIAL

Commercial temperature grade designation indicates suitability for standard operating temperature environments, making it ideal for commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Peripheral IC type involving a bus controller for Universal Serial Bus (USB) enhances compatibility and communication capabilities in USB-based systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation in various applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and improves thermal performance, enhancing reliability and manufacturability.

Maximum Supply Current: 99.78 mA

Supports a maximum supply current of 99.78 mA, ensuring stable power delivery and operation within specified current limits.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides a standard voltage option for stable and reliable operation in various applications.

Bus Compatibility: I2C

Supports I2C bus compatibility, allowing for easy integration and communication with other I2C devices in the system.

Terminal Pitch: 0.5 mm

Compact terminal pitch of 0.5mm enables high-density mounting and space-efficient PCB design, optimizing layout and connectivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions for moisture protection.

Technical Specifications

Bus Controllers CY7C65634-28LTXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 27 MHZ OR 48 MHZ CLOCK FREQUENCY

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

99.78 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CY7C65634-28LTXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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