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VNC2-32L1C

FTDI

VNC2-32L1C by FTDI

VNC2-32L1C by FTDI is a bus controller with a max data transfer rate of 1.5 MBps. It is used in automotive applications and supports SPI, UART, and USB bus compatibility. With a compact size of 7mm x 7mm, it operates at temperatures ranging from -40°C to 125°C.

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AZTECH Wire

Italy . 732 parts In-Stock

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Argo Parts USA

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Overview

The VNC2-32L1C by FTDI is a high-quality bus controller that offers customers a wide range of benefits and advantages. Manufactured by FTDI, a renowned leader in the industry, this product ensures reliability and superior performance. With its versatile applications in SPI, UART, and USB bus compatibility, it provides users with seamless connectivity options. Its compact design, low profile package body, and gull-wing terminal form make it perfect for space-constrained projects. Whether you need to transfer data at high speeds or interface with different drive interfaces like RS232, RS422, or RS485, the VNC2-32L1C has got you covered. Discover the value and convenience this exceptional product brings to your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The plastic/epoxy body material provides durability and heat resistance, making this bus controller suitable for rugged environments and automotive applications.

Surface Mount

YES - The surface mount feature allows for easy installation and integration onto PCBs, making it convenient for assembly and reducing production costs.

Maximum Supply Voltage

1.98 V - With a maximum supply voltage of 1.98 V, this bus controller is compatible with low voltage systems, ensuring efficient power consumption and reducing the risk of overheating.

Package Shape

SQUARE - The square package shape optimizes space utilization, making it ideal for applications with limited board space availability.

No. of Terminals

32 - The 32 terminals provide ample connectivity options, allowing for versatile bus configurations and support for various peripheral devices.

Package Style (Meter)

FLATPACK, LOW PROFILE - The flatpack, low profile package style offers a compact design and a low assembly height, making it suitable for space-constrained applications and facilitating efficient PCB layout.

Minimum Supply Voltage

1.62 V - The minimum supply voltage of 1.62 V ensures reliable functionality even in low-power scenarios, providing flexibility in system design and energy efficiency.

Maximum Operating Temperature

125 °C - With a maximum operating temperature of 125°C, this bus controller can withstand high-temperature environments, ensuring reliable performance in demanding applications.

Maximum Data Transfer Rate

1.5 MBps - The high maximum data transfer rate of 1.5 MBps enables fast and efficient communication between the bus controller and connected peripherals, enhancing overall system responsiveness and data throughput.

Minimum Operating Temperature

40 °C - The minimum operating temperature of -40°C allows for reliable operation in extreme cold environments, making this bus controller suitable for a wide range of applications and climates.

Terminal Position

QUAD - The quad terminal position facilitates easy and convenient connection and installation, simplifying the integration of the bus controller into existing systems and improving overall ease of use.

Maximum Seated Height

1.6 mm - With a maximum seated height of 1.6 mm, this bus controller offers a low profile, allowing for compact and space-efficient designs, particularly in tight form factor requirements.

Width

7 mm - The 7 mm width provides a compact form factor, enabling easy integration into various devices and enhancing the flexibility of system design.

Maximum Time At Peak Reflow Temperature (s)

40 - The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reliable connection during the manufacturing process, contributing to the overall durability and quality of the product.

Peak Reflow Temperature °C

260 - With a peak reflow temperature of 260°C, this bus controller can withstand high-temperature soldering processes, ensuring robust solder joints and long-term reliability.

Length

7 mm - The 7 mm length offers a compact size, enabling easy integration and flexibility in space-constrained applications.

Temperature Grade

AUTOMOTIVE - Designed to meet automotive industry standards, this bus controller can withstand harsh automotive environments, making it an ideal choice for automotive applications.

Peripheral IC Type

BUS CONTROLLER, UNIVERSAL SERIAL BUS - This bus controller supports universal serial bus (USB) interfaces, providing compatibility with a wide range of devices and enabling seamless connectivity.

Technology

CMOS - Built using complementary metal-oxide-semiconductor (CMOS) technology, this bus controller offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance and efficiency.

Terminal Form

GULL WING - The gull wing terminal form ensures reliable electrical connections and ease of soldering during the manufacturing process, contributing to the overall quality and durability of the product.

Nominal Supply Voltage

1.8 V - With a nominal supply voltage of 1.8 V, this bus controller operates efficiently within low voltage systems, providing optimal power usage and reducing energy consumption.

Bus Compatibility

SPI; UART; USB - This bus controller supports multiple bus protocols, including Serial Peripheral Interface (SPI), Universal Asynchronous Receiver-Transmitter (UART), and Universal Serial Bus (USB), enabling seamless connectivity and compatibility with a wide range of peripheral devices.

Terminal Pitch

0.8 mm - The 0.8 mm terminal pitch provides sufficient spacing between terminals for reliable connections while contributing to a compact layout, optimizing board space usage.

Moisture Sensitivity Level (MSL)

3 - With a moisture sensitivity level of 3, this bus controller can withstand moderate exposure to moisture during handling and assembly, ensuring product integrity and reliability.

Drive Interface Standard

RS232; RS422; RS485 - Supporting multiple drive interface standards, including RS232, RS422, and RS485, this bus controller offers versatility and compatibility with various communication protocols, expanding its usability in different applications.

Technical Specifications

Bus Controllers VNC2-32L1C attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Address Bus Width:

0

Bus Compatibility:

SPI; UART; USB

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS422; RS485

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

VNC2-32L1C Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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