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CY7C65630-56LTXC

Infineon Technologies

CY7C65630-56LTXC by Infineon Technologies

CY7C65630-56LTXC by Infineon is a 3.3V bus controller with 56 terminals in a square package, operating at up to 24MHz. It is ideal for USB peripheral ICs, featuring a max supply voltage of 3.45V and suitable for commercial temperature grades. The chip carrier has a very thin profile and matte tin finish, making it suitable for various applications requiring high-speed data transfer over USB interfaces.

Median Price

$21.340

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 45 parts In-Stock

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$11.190

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$11.190

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Avnet

USA . 1,300 parts In-Stock

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$14.828

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Farnell

UK . 1,579 parts In-Stock

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$21.340

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$15.790

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RS (Exports)

UK . 98 parts In-Stock

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$24.058

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$18.670

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Chip1Stop

Japan . 870 parts In-Stock

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$24.100

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$15.700

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Arrow

USA . 520 parts In-Stock

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$19.110

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Mouser Electronics

USA . 72 parts In-Stock

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$27.990

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$19.370

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$18.620

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$27.990

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Element14

Singapore . 1,443 parts In-Stock

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$39.770

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$28.020

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Rochester

USA . 2,927 parts In-Stock

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$16.630

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$14.880

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$14.000

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Verical

USA . 1,734 parts In-Stock

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$20.788

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$18.600

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Flip Electronics (Authorized)

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DigiKey

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Digiode

USA . 829 parts In-Stock

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$15.835

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Nova Conductors

Japan . 50 parts In-Stock

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Infinite Electronics LLP

India . 2,600 parts In-Stock

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Vyrian

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PC Components Company LLC

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Bristol Electronics

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Prism Electronics

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Sensible Micro Corp

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Flip Electronics

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ACDS - Activité Composants Distribution Service

France . 27 parts In-Stock

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ComSIT USA

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LWI Electronics Inc

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Micros

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Partservice

France . 8 parts In-Stock

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8

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$217.273

$217.273

Micros sp.j. W. Kędra i J. Lic

Poland . 8 parts In-Stock

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$232.734

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$232.734

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Atlantic Semiconductor

USA . 4 parts In-Stock

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Inventory MP

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Semicontronic

India . 1,160 parts In-Stock

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$7.350

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$7.166

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$7.130

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$7.350

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$7.130

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Ampacity Inc.

Singapore . 1,258 parts In-Stock

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$9.510

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$9.510

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Component Stockers USA

USA . 8,547 parts In-Stock

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$13.360

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$13.850

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$13.420

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$13.360

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$13.420

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Corphita

USA . 586 parts In-Stock

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$15.001

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Continental Prestige Electronics

USA . 1,965 parts In-Stock

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$18.140

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$14.080

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$18.140

$14.080

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Modulus Dynamics

Lithuania . 4,507 parts In-Stock

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$24.081

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$23.118

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$22.155

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$24.081

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Microchip USA

USA . 7,207 parts In-Stock

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$51.543

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$51.543

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Advanced Electronics

New Zealand . 72 parts In-Stock

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$52.198

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$47.500

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$42.802

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72

$52.198

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$42.802

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Aztec Data Supply Inc.

USA . 3,889 parts In-Stock

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$72.526

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$72.526

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Corohmni

South Africa . 714 parts In-Stock

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$84.684

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$84.684

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Perfect Parts

USA . 8,988 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,704 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,136 parts In-Stock

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Argo Parts USA

USA . 2,929 parts In-Stock

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RC Electronics

USA . 1,488 parts In-Stock

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$16.870

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$15.400

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$14.940

1,488

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$16.870

$15.400

$14.940

Infinite Electronics LLP (Excess)

. 1,302 parts In-Stock

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Robosynatics

Brazil . 606 parts In-Stock

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$65.513

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$64.176

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$64.176

606

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$65.513

$64.176

$64.176

Lucentia Tech

USA . 606 parts In-Stock

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$65.513

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$64.176

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$64.176

606

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$64.176

$64.176

Kepictronics

USA . 488 parts In-Stock

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488

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S.R.D Solutions

India . 455 parts In-Stock

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Futuretech Components

Singapore . 120 parts In-Stock

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Lixinc

USA . 84 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$16.209

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$15.713

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$15.382

50

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$15.713

$15.382

GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 11 parts In-Stock

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Overview

Elevate your device's performance with the CY7C65630-56LTXC from Infineon Technologies, a leading manufacturer in the industry. As a versatile Bus Controller, this product offers seamless integration and superior functionality for a wide range of applications. With a maximum clock frequency of 24 MHz and a compact square package shape, it delivers optimal performance while maintaining a low profile. Trust in the quality and reliability of Infineon Technologies to enhance your system's efficiency and productivity. Experience the value and benefits of the CY7C65630-56LTXC today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and labor costs.

Maximum Supply Voltage: 3.45 V

Operates efficiently within a safe voltage range, ensuring stable performance and longevity of the product.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB and allowing for easier integration into tight layouts.

Power Supplies (V): 3.3

Standard power supply of 3.3 V makes it compatible with a wide range of systems and devices.

No. of Terminals: 56

High number of terminals allows for versatile connectivity options, accommodating various configurations and interfaces.

Minimum Supply Voltage: 3.15 V

Having a low minimum supply voltage ensures reliable performance even in situations where the voltage supply might fluctuate slightly.

Maximum Operating Temperature: 70 °C

Withstands high operating temperatures, making it suitable for use in environments with elevated heat levels.

Minimum Operating Temperature: 0 °C

Capable of operating in cold temperatures as well, ensuring functionality across a wide range of environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and enhances solderability, ensuring reliable connections and long-term durability.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals and helps in reducing signal interference and crosstalk.

Maximum Seated Height: 1 mm

Low seated height saves space and enables a more streamlined and compact PCB design.

Width: 8 mm

Compact width dimension facilitates efficient placement on the PCB and allows for greater flexibility in layout design.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast data processing and transfer speeds, ideal for applications requiring quick response times.

Maximum Time At Peak Reflow Temperature (s): 20

Can withstand peak reflow temperatures for up to 20 seconds, ensuring proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and ensures component integrity during assembly.

Length: 8 mm

Compact length dimension contributes to a smaller footprint on the PCB, optimizing board space and allowing for more efficient layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments, making it suitable for a wide range of commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Bus controller for Universal Serial Bus (USB) peripherals allows for seamless integration and efficient communication with USB devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall performance.

Terminal Form: NO LEAD

No-lead terminal form improves thermal performance, reduces solder joint stress, and complies with environmental regulations.

Maximum Supply Current: 260 mA

Capable of handling a high supply current, ensuring stable operation and sufficient power delivery to connected devices.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage of 3.3 V ensures compatibility with common power sources and systems, simplifying integration.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for dense packing of terminals, enabling more connections in a limited space and improving overall functionality.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices to prevent damage.

Technical Specifications

Bus Controllers CY7C65630-56LTXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY7C65630-56LTXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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