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TUSB9261PVP

Texas Instruments

TUSB9261PVP by Texas Instruments

TUSB9261PVP by Texas Instruments is a bus controller with a max data transfer rate of 384 MBps. It has a package style of flatpack, heat sink/slug, thin profile, and fine pitch. This peripheral IC type is commonly used for ATA and ATAPI drive interfaces.

Median Price

$4.455

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 10 parts In-Stock

1+ parts

$1.210

100+ parts

$1.210

1k+ parts

-

10k+ parts

-

10

$1.210

$1.210

-

-

Texas Instruments

USA . 68,623 parts In-Stock

1+ parts

$4.675

100+ parts

$3.812

1k+ parts

$2.541

10k+ parts

-

68,623

$4.675

$3.812

$2.541

-

DigiKey

USA . 816 parts In-Stock

1+ parts

$6.890

100+ parts

$4.478

1k+ parts

$4.043

10k+ parts

$3.934

816

$6.890

$4.478

$4.043

$3.934

Mouser Electronics

USA . 705 parts In-Stock

1+ parts

$6.890

100+ parts

$4.480

1k+ parts

$4.040

10k+ parts

-

705

$6.890

$4.480

$4.040

-

Avnet

USA . 64 parts In-Stock

1+ parts

-

100+ parts

$4.235

1k+ parts

$3.970

10k+ parts

-

64

-

$4.235

$3.970

-

Rochester

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$3.650

1k+ parts

$3.260

10k+ parts

$3.070

12

-

$3.650

$3.260

$3.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,388 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

4,388

$1.150

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$3.812

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$3.812

-

-

-

Vyrian

USA . 11,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,224

-

-

-

-

Cyclops Electronics Ltd

UK . 6,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,347

-

-

-

-

Sensible Micro Corp

USA . 250 parts In-Stock

1+ parts

-

100+ parts

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250

-

-

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Rebound Electronics

UK . 58 parts In-Stock

1+ parts

-

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-

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58

-

-

-

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Micros

Poland . 20 parts In-Stock

1+ parts

-

100+ parts

$4.518

1k+ parts

-

10k+ parts

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20

-

$4.518

-

-

Partservice

France . 20 parts In-Stock

1+ parts

-

100+ parts

$4.358

1k+ parts

$4.358

10k+ parts

$4.358

20

-

$4.358

$4.358

$4.358

Micros sp.j. W. Kędra i J. Lic

Poland . 20 parts In-Stock

1+ parts

-

100+ parts

$4.668

1k+ parts

$4.668

10k+ parts

$4.668

20

-

$4.668

$4.668

$4.668

EMSNET

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,450 parts In-Stock

1+ parts

$1.030

100+ parts

-

1k+ parts

-

10k+ parts

-

11,450

$1.030

-

-

-

Semicontronic

India . 11,304 parts In-Stock

1+ parts

$1.030

100+ parts

$1.004

1k+ parts

$0.999

10k+ parts

-

11,304

$1.030

$1.004

$0.999

-

Corphita

USA . 1,545 parts In-Stock

1+ parts

$1.089

100+ parts

-

1k+ parts

-

10k+ parts

-

1,545

$1.089

-

-

-

Argo Parts USA

USA . 4,266 parts In-Stock

1+ parts

$3.812

100+ parts

-

1k+ parts

-

10k+ parts

-

4,266

$3.812

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.812

100+ parts

-

1k+ parts

$3.621

10k+ parts

$3.545

2,000

$3.812

-

$3.621

$3.545

Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$33.533

100+ parts

-

1k+ parts

$128.073

10k+ parts

-

1,800

$33.533

-

$128.073

-

DigiPath Technology Company

USA . 1,584 parts In-Stock

1+ parts

$36.924

100+ parts

$33.970

1k+ parts

-

10k+ parts

-

1,584

$36.924

$33.970

-

-

Corohmni

South Africa . 3,070 parts In-Stock

1+ parts

$37.197

100+ parts

-

1k+ parts

-

10k+ parts

-

3,070

$37.197

-

-

-

ChromeModa Solutions

Germany . 1,323 parts In-Stock

1+ parts

$37.678

100+ parts

$30.896

1k+ parts

-

10k+ parts

-

1,323

$37.678

$30.896

-

-

IDEA Electronic Components Group

UK . 1,166 parts In-Stock

1+ parts

$37.678

100+ parts

$35.794

1k+ parts

$33.910

10k+ parts

-

1,166

$37.678

$35.794

$33.910

-

Perfect Parts

USA . 30,132 parts In-Stock

1+ parts

-

100+ parts

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30,132

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-

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Lixinc

USA . 2,714 parts In-Stock

1+ parts

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2,714

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-

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Kepictronics

USA . 350 parts In-Stock

1+ parts

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350

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-

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Assy Fe

Spain . 160 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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160

-

-

-

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Computer Components Inc. - USA

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2

-

-

-

-

Overview

Experience seamless data transfer and enhanced connectivity with the TUSB9261PVP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus controller is perfect for various applications, offering multiple advantages to customers. With its maximum data transfer rate of 384 MBps, it ensures lightning-fast performance. Its compact design, surface mount capability, and low power consumption make it an ideal choice for space-constrained environments. Whether you're working on ATA or ATAPI projects, this versatile device has got you covered. Invest in the TUSB9261PVP and revolutionize your connectivity experience today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy as the package body material provides durability and protection to the bus controller, making it suitable for various applications.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation of the bus controller onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

1.155 V - With a high maximum supply voltage, this bus controller can handle a wide range of power input, enhancing its compatibility and versatility.

Package Shape:

SQUARE - The square package shape offers a compact design, optimizing space utilization and making it ideal for devices with limited board real estate.

Power Supplies (V):

1.1,3.3 - The availability of multiple power supply options allows for flexibility in system design, accommodating different voltage requirements and configurations.

No. of Terminals:

64 - With a generous number of terminals, this bus controller can efficiently handle a wide range of connections and interfaces, ensuring smooth data transfer.

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - The varied package styles offer different advantages such as low profile, heat dissipation, and fine pitch, allowing for customization based on specific application needs.

Minimum Supply Voltage:

1.045 V - The low minimum supply voltage ensures energy efficiency and compatibility with devices requiring lower power consumption, making it suitable for portable or battery-operated systems.

Maximum Operating Temperature:

70 °C - The high maximum operating temperature allows the bus controller to withstand demanding environments, ensuring reliable performance even in extreme conditions.

Maximum Data Transfer Rate:

384 MBps - The fast data transfer rate enables efficient and quick communication between devices, enhancing overall system performance and reducing data processing time.

Minimum Operating Temperature:

0 °C - The low minimum operating temperature guarantees reliable operation in colder environments, making the bus controller suitable for various climatic conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and longevity, ensuring reliable and long-lasting connections.

Terminal Position:

QUAD - The quad terminal position simplifies the integration of the bus controller into circuit designs, ensuring easy alignment and connection with other components.

Maximum Seated Height:

1.2 mm - The low maximum seated height allows for a shallower profile, enabling the bus controller to be used in compact devices or systems with height limitations.

Width:

7 mm - The compact width of the bus controller enables efficient use of space on circuit boards, accommodating a higher density of components and enhancing overall design flexibility.

Maximum Clock Frequency:

40 MHz - With a high maximum clock frequency, this bus controller can effectively handle fast data transmissions and ensure synchronized system operations.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature specifies the duration the bus controller can withstand during the soldering process, simplifying assembly and protecting the component from potential damage.

Peak Reflow Temperature °C:

260 - The peak reflow temperature indicates the maximum temperature the bus controller can handle during soldering, ensuring compatibility with standard soldering practices and equipment.

Length:

7 mm - The compact length allows for efficient use of space on circuit boards, facilitating the integration of the bus controller into smaller form factor devices.

Temperature Grade:

COMMERCIAL - The commercial temperature grade indicates that the bus controller is designed for standard temperature conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type:

BUS CONTROLLER, UNIVERSAL SERIAL BUS - The bus controller's peripheral IC type enables it to effectively manage and control USB interfaces, providing seamless connectivity and compatibility for various USB devices.

Technology:

CMOS - The CMOS technology ensures low power consumption, efficient operation, and compatibility with a wide range of systems, making this bus controller an energy-efficient and versatile choice.

Terminal Form:

GULL WING - The gull-wing terminal form simplifies the soldering process, ensuring secure connections and facilitating automated assembly, which enhances production efficiency.

Maximum Supply Current:

0.005 mA - With an extremely low maximum supply current, this bus controller minimizes power consumption, making it an energy-efficient choice for battery-powered devices.

Nominal Supply Voltage:

1.1 V - The nominal supply voltage provides a standard operating voltage for the bus controller, ensuring compatibility with various power sources and simplifying system integration.

Bus Compatibility:

ATA; ATAPI - The bus controller's compatibility with ATA and ATAPI interfaces allows it to seamlessly communicate and integrate with a wide range of storage devices, ensuring versatility and compatibility.

Terminal Pitch:

0.4 mm - The small terminal pitch enables high-density circuit designs, accommodating more connections and components within a limited space, improving overall system functionality.

Moisture Sensitivity Level (MSL):

3 - The moisture sensitivity level indicates the degree of moisture resistance of the bus controller, ensuring reliable operation and protection against moisture-related damage.

Drive Interface Standard:

IEEE 1149.6; IEEE 1149.1 - The bus controller supports the IEEE 1149.6 and IEEE 1149.1 drive interface standards, providing standardized connectivity and compatibility with various test and measurement systems.

Technical Specifications

Bus Controllers TUSB9261PVP attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

ATA; ATAPI

Maximum Clock Frequency:

40 MHz

Maximum Data Transfer Rate:

384 MBps

Drive Interface Standard:

IEEE 1149.6; IEEE 1149.1

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.35SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

.005 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TUSB9261PVP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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