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PI7C9X3G816GPBHFCE

Diodes Incorporated

PI7C9X3G816GPBHFCE by Diodes Incorporated

Diodes Inc. PI7C9X3G816GPBHFCE is a PCI bus controller IC with 324 terminals in a grid array package. It operates at 100MHz clock frequency, supports I2C and SPI buses, and has a max data transfer rate of 0.0125MBps. Ideal for applications requiring high-speed data processing on compact PCBs.

Median Price

$62.770

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

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$62.770

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$62.770

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Nova Conductors

Japan . 150 parts In-Stock

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$45.342

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$45.342

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Vyrian

USA . 3,830 parts In-Stock

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3,830

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Chip Stock

USA . 225 parts In-Stock

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NAC Semi

USA . 84 parts In-Stock

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$66.340

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84

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Distributors (Availability)

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AZTECH Wire

Italy . 302 parts In-Stock

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$15.216

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Corohmni

South Africa . 153 parts In-Stock

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$19.265

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Ampacity Inc.

Singapore . 48 parts In-Stock

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$45.080

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$45.080

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Continental Prestige Electronics

USA . 6,272 parts In-Stock

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$45.342

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$44.435

6,272

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Netroflash

USA . 2,000 parts In-Stock

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$45.342

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Microchip USA

USA . 1,893 parts In-Stock

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$120.198

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QUARKTWIN TECHNOLOGY LTD

USA . 24,123 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Argo Parts USA

USA . 1,973 parts In-Stock

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GreenTree Electronics

Israel . 84 parts In-Stock

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Overview

Discover the cutting-edge PI7C9X3G816GPBHFCE by Diodes Incorporated, a top-tier manufacturer renowned for its high-quality bus controllers. This innovative product is designed to revolutionize connectivity solutions, offering seamless integration and unmatched performance. Ideal for a wide range of applications, this PCI bus controller boasts a maximum data transfer rate of 0.0125 MBps and a maximum clock frequency of 100 MHz. Experience the value and benefits of this advanced technology, providing customers with reliability and efficiency like never before. Elevate your projects with the PI7C9X3G816GPBHFCE and stay ahead of the curve in today's fast-paced digital landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it ideal for use in various environments.

Surface Mount: YES

Being surface mountable makes it easier to integrate this bus controller into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.99 V

Having a high maximum supply voltage allows for flexibility in power input, ensuring compatibility with different systems.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, making it space-efficient for installation.

No. of Terminals: 324

Having a high number of terminals allows for connectivity with multiple components, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with heat sink/slug design helps in efficient heat dissipation, ensuring optimal performance under heavy loads.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage ensures energy efficiency and reliable operation even at lower power levels.

Maximum Data Transfer Rate: 0.0125 MBps

The high maximum data transfer rate enables fast communication between devices, improving overall system efficiency.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the PCB layout and allows for easy connectivity during integration.

Maximum Seated Height: 2.89 mm

The low maximum seated height saves space within the system, enabling a more compact design overall.

Width: 19 mm

The 19mm width provides a balance between compactness and ease of installation, making it suitable for various applications.

Maximum Clock Frequency: 100 MHz

With a high maximum clock frequency, this bus controller can manage high-speed data processing tasks efficiently.

Length: 19 mm

The 19mm length complements the width, offering a square form factor that is convenient for deployment in tight spaces.

Peripheral IC Type: BUS CONTROLLER, PCI

Designed as a bus controller for PCI, this product is compatible with a wide range of devices and systems, enhancing its versatility.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, contributing to the overall efficiency of the bus controller.

Terminal Form: BALL

The ball terminal form simplifies the soldering process, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95V offers a stable power input for consistent operation, enhancing the reliability of the bus controller.

Bus Compatibility: I2C, SPI

Support for I2C and SPI bus compatibility allows for seamless integration with a variety of devices, expanding the connectivity options.

Terminal Pitch: 1 mm

The 1mm terminal pitch facilitates easy connection to other components on the circuit board, enabling quick and secure installations.

Technical Specifications

Bus Controllers PI7C9X3G816GPBHFCE attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Address Bus Width:

0

Bus Compatibility:

I2C, SPI

Maximum Clock Frequency:

100 MHz

Maximum Data Transfer Rate:

.0125 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B324

Length:

19 mm

No. of Terminals:

324

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

2.89 mm

Maximum Supply Voltage:

.99 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

PI7C9X3G816GPBHFCE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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