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CY7C65630-56LTXI

Infineon Technologies

CY7C65630-56LTXI by Infineon Technologies

CY7C65630-56LTXI by Infineon is a 3.3V bus controller with 56 terminals, operating at -40 to 85°C. It supports USB interface, clock frequency up to 24 MHz, and has a compact square package for industrial applications.

Median Price

$28.962

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 100 parts In-Stock

1+ parts

$24.236

100+ parts

$18.098

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-

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100

$24.236

$18.098

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Element14

Singapore . 641 parts In-Stock

1+ parts

$28.360

100+ parts

$21.140

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-

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641

$28.360

$21.140

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Farnell

UK . 641 parts In-Stock

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$29.150

100+ parts

$22.950

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641

$29.150

$22.950

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Chip1Stop

Japan . 784 parts In-Stock

1+ parts

$34.200

100+ parts

$18.500

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784

$34.200

$18.500

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Mouser Electronics

USA . 377 parts In-Stock

1+ parts

$35.160

100+ parts

$25.020

1k+ parts

$22.150

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-

377

$35.160

$25.020

$22.150

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Newark

USA . 18 parts In-Stock

1+ parts

$44.180

100+ parts

$34.370

1k+ parts

$29.030

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-

18

$44.180

$34.370

$29.030

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Flip Electronics (Authorized)

USA . 458 parts In-Stock

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458

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Rochester

USA . 389 parts In-Stock

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-

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$23.020

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$20.600

10k+ parts

$19.380

389

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$23.020

$20.600

$19.380

Avnet

USA . 339 parts In-Stock

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339

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Verical

USA . 249 parts In-Stock

1+ parts

-

100+ parts

$28.775

1k+ parts

$25.750

10k+ parts

$24.225

249

-

$28.775

$25.750

$24.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$17.151

100+ parts

-

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68

$17.151

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Digiode

USA . 87 parts In-Stock

1+ parts

$22.866

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87

$22.866

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IBS Electronics

USA . 125 parts In-Stock

1+ parts

$27.362

100+ parts

$7.145

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125

$27.362

$7.145

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Chip Stock

USA . 724 parts In-Stock

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724

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DigiKey Marketplace

USA . 722 parts In-Stock

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Vyrian

USA . 155 parts In-Stock

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Flip Electronics

USA . 13 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,541 parts In-Stock

1+ parts

$11.550

100+ parts

$11.088

1k+ parts

$10.626

10k+ parts

-

3,541

$11.550

$11.088

$10.626

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Corohmni

South Africa . 2,563 parts In-Stock

1+ parts

$11.550

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-

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2,563

$11.550

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Ampacity Inc.

Singapore . 639 parts In-Stock

1+ parts

$11.580

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-

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639

$11.580

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Semicontronic

India . 369 parts In-Stock

1+ parts

$11.580

100+ parts

$11.290

1k+ parts

$11.233

10k+ parts

-

369

$11.580

$11.290

$11.233

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$11.896

100+ parts

$11.302

1k+ parts

$11.302

10k+ parts

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100

$11.896

$11.302

$11.302

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Continental Prestige Electronics

USA . 784 parts In-Stock

1+ parts

$16.700

100+ parts

$12.960

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784

$16.700

$12.960

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Netroflash

USA . 100 parts In-Stock

1+ parts

$17.151

100+ parts

-

1k+ parts

$16.293

10k+ parts

$15.950

100

$17.151

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$16.293

$15.950

Corphita

USA . 387 parts In-Stock

1+ parts

$21.662

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387

$21.662

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Microchip USA

USA . 5,056 parts In-Stock

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$46.506

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5,056

$46.506

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Aztec Data Supply Inc.

USA . 282 parts In-Stock

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$71.712

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282

$71.712

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Argo Parts USA

USA . 4,975 parts In-Stock

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4,975

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1,273 parts In-Stock

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1,273

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Futuretech Components

Singapore . 780 parts In-Stock

1+ parts

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780

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Overview

Experience seamless connectivity and superior performance with the CY7C65630-56LTXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bus controllers that offer unmatched reliability and efficiency. Ideal for a wide range of applications, this chip carrier with a very thin profile boasts a maximum clock frequency of 24 MHz and a wide operating temperature range. Trust Infineon to provide you with innovative solutions that bring value and convenience to your projects. Elevate your designs with the CY7C65630-56LTXI and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.45 V

Compatible with a wide range of power supplies, providing flexibility in design.

Package Shape: SQUARE

Squares are commonly used in electronic packaging, offering good space efficiency.

Power Supplies (V): 3.3

Standard power supply voltage for many electronic devices.

No. of Terminals: 56

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple packaging options for different space and cooling requirements.

Minimum Supply Voltage: 3.15 V

Ensures proper functioning at lower voltages, enhancing reliability.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Designed to work in extreme cold conditions, suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term performance.

Terminal Position: QUAD

Quad terminals offer stable connections and reduce the risk of signal interference.

Maximum Seated Height: 1 mm

Low profile design is space-saving and can fit into compact devices.

Width: 8 mm

Compact width for easier integration into electronic systems.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for faster data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process for efficient PCB manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, ensuring secure solder joints.

Length: 8 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature ranges.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Universal Serial Bus controller for efficient data transfer in a wide range of devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminals for environmental friendliness and compliance with regulations.

Maximum Supply Current: 260 mA

Able to handle moderate current levels for reliable operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for proper handling during assembly and storage.

Technical Specifications

Bus Controllers CY7C65630-56LTXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

CY7C65630-56LTXI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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