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XIO2001IZGU

Texas Instruments

XIO2001IZGU by Texas Instruments

XIO2001IZGU by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at a max clock frequency of 125 MHz, supporting a data transfer rate of 250 MBps. Ideal for industrial applications requiring PCI peripheral ICs and VGA bus compatibility.

Median Price

$59.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Innovative Industries

USA . 49 parts In-Stock

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Digiode

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Vyrian

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Chip Stock

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Nova Conductors

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Distributors (Availability)

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AZTECH Wire

Italy . 217 parts In-Stock

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$10.462

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One Stop Electronics

USA . 1,565 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 430 parts In-Stock

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$31.000

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Semicontronic

India . 571 parts In-Stock

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$32.000

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$31.200

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$31.040

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Corohmni

South Africa . 881 parts In-Stock

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$53.244

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Parana Technologies

USA . 631 parts In-Stock

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$59.191

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DigiPath Technology Company

USA . 215 parts In-Stock

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$65.177

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ChromeModa Solutions

Germany . 81 parts In-Stock

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$66.507

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$54.536

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IDEA Electronic Components Group

UK . 41 parts In-Stock

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$66.507

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$63.182

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$59.856

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Perfect Parts

USA . 13,964 parts In-Stock

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Lixinc

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Corphita

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A-Z Elektronik GmbH

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Argo Parts USA

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Continental Prestige Electronics

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GreenTree Electronics

Israel . 600 parts In-Stock

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Bastille Electronics

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Microchip USA

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Authorized Procurement Solutions

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Overview

Discover the XIO2001IZGU by Texas Instruments, a top-notch bus controller designed to deliver high performance in various industrial applications. With a strong reputation for quality and reliability, Texas Instruments ensures that this product meets the highest standards in the industry. Offering fast data transfer rates and compatibility with VGA buses, this versatile device is a game-changer for your system integration needs. Experience seamless connectivity and enhanced efficiency with the XIO2001IZGU, providing unparalleled value and benefits to our customers. Elevate your projects with Texas Instruments' cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on a circuit board, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage ensures compatibility with a wide range of systems, including those with lower voltage requirements.

Address Bus Width: 32

A wider address bus width allows for higher data transfer rates, improving the overall performance of the bus controller.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of space on a circuit board, ideal for applications with limited room.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages gives flexibility in system design and compatibility with various power sources.

No. of Terminals: 169

Having a large number of terminals allows for connections to multiple components, expanding the versatility of the bus controller.

Minimum Supply Voltage: 1.35 V

The low minimum supply voltage ensures efficient power consumption and operation, suitable for energy-saving applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Maximum Data Transfer Rate: 250 MBps

A high maximum data transfer rate enables fast communication between devices, critical for real-time data processing applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, making the bus controller suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: BOTTOM

Having terminals positioned on the bottom facilitates easy and secure connections to the circuit board, enhancing overall stability.

Maximum Seated Height: 1.4 mm

The low maximum seated height minimizes the space required for installation, making the bus controller suitable for compact electronic devices.

Width: 12 mm

With a width of 12 mm, the bus controller is compact and suitable for applications where space is limited.

External Data Bus Width: 32

The external data bus width of 32 enables fast data transfer between the bus controller and connected devices, enhancing overall performance.

Maximum Clock Frequency: 125 MHz

The high maximum clock frequency allows for rapid data processing and communication, making the bus controller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the bus controller can be efficiently soldered onto a circuit board during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure soldering and reliability during manufacturing processes.

Length: 12 mm

Having a length of 12 mm ensures a compact and space-efficient design, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the bus controller a durable choice for industrial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a bus controller with PCI compatibility, the product can interface with a variety of devices and systems, making it versatile and suitable for various applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the bus controller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form provides reliable connectivity and durability, ensuring secure connections and long-term performance.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V is suitable for efficient power consumption and stable operation, making the bus controller a reliable choice for various applications.

Bus Compatibility: VGA

With VGA bus compatibility, the bus controller can communicate with VGA devices, expanding its compatibility and versatility in multimedia applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for compact and space-efficient design, ideal for applications with tight layout constraints.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the bus controller can withstand moderate exposure to moisture during handling and storage, ensuring product reliability.

Technical Specifications

Bus Controllers XIO2001IZGU attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

32

Bus Compatibility:

VGA

Maximum Clock Frequency:

125 MHz

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2001IZGU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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