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FT231XQ-T

FTDI

FT231XQ-T by FTDI

FT231XQ-T by FTDI is a bus controller with 3.3/5V supplies, 12.02 MHz clock frequency, and UART/USB compatibility. Ideal for applications requiring a compact chip carrier package with quad terminals and CMOS technology, operating b/w -40 to 85°C temperature range.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

9

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RS Americas

USA . 90 parts In-Stock

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$2.320

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$1.970

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Verical

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Nova Conductors

Japan . 79 parts In-Stock

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$1.880

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Chip Stock

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ACDS - Activité Composants Distribution Service

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LIBRA Elektronik GmbH

Germany . 490 parts In-Stock

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ComSIT Distribution GmbH

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Ashlea Components Ltd

UK . 20 parts In-Stock

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Bristol Electronics

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Continental Prestige Electronics

USA . 5,236 parts In-Stock

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$1.880

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$1.842

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Argo Parts USA

USA . 2,656 parts In-Stock

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$1.880

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Allen Electronics Distributors

USA . 90 parts In-Stock

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$2.610

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Neutron USA

USA . 50 parts In-Stock

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$27.160

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Aztec Data Supply Inc.

USA . 123 parts In-Stock

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$27.540

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$31.483

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$29.909

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QUARKTWIN TECHNOLOGY LTD

USA . 24,642 parts In-Stock

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GreenTree Electronics

Israel . 4,047 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 450 parts In-Stock

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Futuretech Components

Singapore . 220 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 50 parts In-Stock

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Overview

FTDI's FT231XQ-T offers unrivaled quality and reliability in the bus controllers category. With features like surface mount capability, a wide supply voltage range, and compatibility with UART and USB buses, this product is a versatile solution for various applications. FTDI's reputation for excellence shines through in the FT231XQ-T, providing customers with a valuable and efficient component that meets their needs. Experience the benefits and advantages of FTDI's FT231XQ-T today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure installation, making this product suitable for applications where space is limited.

Maximum Supply Voltage: 5.5 V

Can handle a relatively high supply voltage, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape enhances stability and ease of mounting, ensuring reliable performance.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, making it versatile for different system configurations.

No. of Terminals: 20

An ample number of terminals provide connectivity options for various peripherals and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Multiple package styles offer flexibility in design and heat dissipation, catering to different application requirements.

Maximum Operating Temperature: 85 °C

Can operate efficiently in relatively high-temperature environments, increasing the product's reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, expanding the range of suitable operating environments.

Terminal Position: QUAD

Quad terminal position enhances connectivity options and ease of integration into the system.

Maximum Seated Height: 0.8 mm

Low seated height allows for compact design and efficient use of space in the application.

Width: 4 mm

Compact width dimension facilitates space-saving installation in tight layouts.

Maximum Clock Frequency: 12.02 MHz

High clock frequency capability supports fast data processing and communication speeds.

Length: 4 mm

Short length dimension contributes to a space-efficient design and ease of installation.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Designed for controlling bus operations and supporting universal serial bus communication, adding versatility to the product's functionality.

Technology: CMOS

Utilization of CMOS technology ensures low power consumption and high operating efficiency.

Terminal Form: NO LEAD

No lead terminal form simplifies installation and enhances connection reliability in the system.

Maximum Supply Current: 8.4 mA

Low maximum supply current requirement helps in reducing power consumption and operating costs.

Nominal Supply Voltage: 5 V

Supports a standard nominal supply voltage of 5V, ensuring compatibility with common power sources.

Bus Compatibility: UART; USB

Compatibility with UART and USB buses enables seamless integration into different communication protocols and systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration and contributes to a compact product design.

Technical Specifications

Bus Controllers FT231XQ-T attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

UART; USB

Maximum Clock Frequency:

12.02 MHz

JESD-30 Code:

S-XQCC-N20

Length:

4 mm

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Current:

8.4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

FT231XQ-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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